摘要:
An integrated circuit includes a first I/O cell disposed at a substrate, the first I/O cell including a first electrostatic discharge (ESD) clamp transistor device. The first ESD clamp transistor device includes a control electrode, a first current electrode coupled to a first voltage reference bus, and second current electrode coupled to a second voltage reference bus. The first ESD clamp transistor device has a first channel width. The integrated circuit further includes a second I/O cell including a second ESD clamp transistor device. The second ESD clamp transistor device includes a control electrode, a first current electrode coupled to the first voltage reference bus, and second current electrode coupled to the second voltage reference bus. The second ESD clamp transistor device has a second channel width different than the first channel width.
摘要:
An integrated circuit includes a first I/O cell disposed at a substrate, the first I/O cell including a first electrostatic discharge (ESD) clamp transistor device. The first ESD clamp transistor device includes a control electrode, a first current electrode coupled to a first voltage reference bus, and second current electrode coupled to a second voltage reference bus. The first ESD clamp transistor device has a first channel width. The integrated circuit further includes a second I/O cell including a second ESD clamp transistor device. The second ESD clamp transistor device includes a control electrode, a first current electrode coupled to the first voltage reference bus, and second current electrode coupled to the second voltage reference bus. The second ESD clamp transistor device has a second channel width different than the first channel width.
摘要:
An ESD protection system for I/O cells of an integrated circuit. The I/O cells of a bank of cells include a first type of I/O cells having ESD trigger circuits and a second type of I/O cells having ESD clamp devices. In one embodiment, the ESD trigger circuits of the first type are located at the same area of an active circuitry floor plan as the area in the floor plan for the ESD clamp devices of the I/O cells of the second type.
摘要:
An ESD protection circuit (81) and a method for providing ESD protection is provided. In some embodiments, an N-channel transistor (24), which can be ESD damaged, is selectively turned on and made conducting. The purpose of turning on the N-channel transistor (24) is to maximize the Vt1 of the N-channel transistor (24). Vt1 is the drain-to-source voltage point at which the parasitic bipolar action of the N-channel transistor (24) first occurs. In some embodiments, the ESD protection circuit (81) includes a diode (64) which provides an additional current path from the I/O pad 31 to a first power supply node (76).
摘要:
An ESD protection circuit (81) and a method for providing ESD protection is provided. In some embodiments, an N-channel transistor (24), which can be ESD damaged, is selectively turned on and made conducting. The purpose of turning on the N-channel transistor (24) is to maximize the Vt1 of the N-channel transistor (24). Vt1 is the drain-to-source voltage point at which the parasitic bipolar action of the N-channel transistor (24) first occurs. In some embodiments, the ESD protection circuit (81) includes a diode (64) which provides an additional current path from the I/O pad 31 to a first power supply node (76).
摘要:
An ESD protection circuit (81) and a method for providing ESD protection is provided. In some embodiments, an N-channel transistor (24), which can be ESD damaged, is selectively turned on and made conducting. The purpose of turning on the N-channel transistor (24) is to maximize the Vt1 of the N-channel transistor (24). Vt1 is the drain-to-source voltage point at which the parasitic bipolar action of the N-channel transistor (24) first occurs. In some embodiments, the ESD protection circuit (81) includes a diode (64) which provides an additional current path from the I/O pad 31 to a first power supply node (76).
摘要:
An eFuse (electronic fuse) circuit has a first detector for determining whether an ESD (electrostatic discharge) event occurs at a circuit pad of an integrated circuit and provides an ESD trigger signal in response thereto. A second detector detects a presence of a first power supply voltage and provides a power on signal indicating the presence of the first power supply voltage. A fuse is permitted to be programmable when no detection of the ESD event occurs and at the same time a presence of the power on signal is detected. The fuse is not permitted to be programmed when an ESD event is detected or when there is an absence of the power on signal. An array of fuses is thereby protected from inadvertent programming from an ESD event or powering up an integrated circuit.
摘要:
An eFuse (electronic fuse) circuit has a first detector for determining whether an ESD (electrostatic discharge) event occurs at a circuit pad of an integrated circuit and provides an ESD trigger signal in response thereto. A second detector detects a presence of a first power supply voltage and provides a power on signal indicating the presence of the first power supply voltage. A fuse is permitted to be programmable when no detection of the ESD event occurs and at the same time a presence of the power on signal is detected. The fuse is not permitted to be programmed when an ESD event is detected or when there is an absence of the power on signal. An array of fuses is thereby protected from inadvertent programming from an ESD event or powering up an integrated circuit.
摘要:
A number of small wells under the isolation layer are formed using the same mask made of photoresist and implant step that is used for the regular wells. The small wells are formed close enough together so that they merge during normal subsequent semiconductor processing to form a merged well. The normal wells and the small wells have a concentration that is greater than that of the merged well. The desired merging of the small wells is ensured by making sure that the small wells are sufficiently close together that the normal diffusion of well implants, which occurs from the particular semiconductor process that is being used, results in the merging. One desirable use of the merged well, with its lower doping concentration, is as a resistor that has more resistance than that of the regular well without requiring an additional implant.
摘要:
A circuit (600) provides Electrostatic Discharge (ESD) protection for internal elements in an integrated circuit during an ESD event. The circuit (600) includes cascoded NMOSFETs (614, 616), with the upper NMOSFET (614) connected to voltage divider circuitry (628). The voltage divider circuitry (628) provides a first bias voltage to the gate of the upper NMOSFET (614) during an ESD event and a second bias voltage during normal operation. Preferably, the first bias voltage is approximately ½ of the drain voltage of the upper NMOSFET (614). Under these bias conditions the cascoded NMOSFETs exhibit a maximum voltage threshold for initiation of parasitic lateral bipolar conduction.