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公开(公告)号：USD442258S1
公开(公告)日：2001-05-15
申请号：US29120961
申请日：2000-03-30
Applicant: James Wu , Linq-Jyi Yang
Designer： James Wu , Linq-Jyi Yang
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公开(公告)号：US20110077202A1
公开(公告)日：2011-03-31
申请号：US12992879
申请日：2009-05-15
Applicant: Richard Feldman , Ji-Yun Kim , Haiyan Jiang , Kirk Mclean , Junliang Pan , Glenn Pierce , James Wu , Xiao-Yan Zhao
Inventor： Richard Feldman , Ji-Yun Kim , Haiyan Jiang , Kirk Mclean , Junliang Pan , Glenn Pierce , James Wu , Xiao-Yan Zhao
IPC: A61K38/36 , C07K14/745 , C07K14/755 , A61P7/00
CPC classification number: C07K14/755 , A61K38/00 , A61K38/37 , A61K38/4846 , A61K47/64 , A61K47/6811 , A61K47/6849 , C07K16/2839 , C07K16/2848 , C07K2317/622 , C07K2319/30 , C07K2319/33
Abstract: Targeted coagulation factors comprising a coagulation factor linked with at least one domain that specifically binds to a membrane protein on a blood cell is provided. The disclosed targeted coagulation factors increase the efficiency of coagulation factors and prolong their duration of action and thus, are an improvement for the treatment of hematological diseases such as hemophilia A.
Abstract translation: 提供了包含与至少一个与血细胞上的膜蛋白特异性结合的结构域连接的凝血因子的靶向凝血因子。 所公开的靶向凝血因子增加凝血因子的效率并延长其作用时间，因此是治疗血液病如血友病A的改善。
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Patent Agency Ranking
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公开(公告)号：US20060210826A1
公开(公告)日：2006-09-21
申请号：US11085308
申请日：2005-03-21
Applicant: James Wu , Heidi de Villiers-Lovelock
Inventor： James Wu , Heidi de Villiers-Lovelock
IPC: B32B19/00
CPC classification number: C22C19/07 , Y10T428/30
Abstract: A Co-based alloy, a tubular wire with a Co-based sheath, and a method for forming a saw tip involving an alloy comprising, by approximate weight %, C (0.3-2.4), B (0.1-1.0), Cr (25-35), Mo (4-20), Si (0.1-1.57), Co (Balance), wherein the total concentration of boron and carbon is between about 1.2 wt % and about 2.5 wt % and the Si has a concentration no greater than about (1.8−(0.12[Mo])+(0.1*([B]+[C]))).
Abstract translation: Co基合金，具有Co基鞘的管状线以及用于形成涉及合金的锯尖的方法，包括以重量％计，C（0.3-2.4），B（0.1-1.0），Cr（ 25-35），Mo（4-20），Si（0.1-1.57），Co（余量），其中硼和碳的总浓度为约1.2重量％至约2.5重量％，Si的浓度为 大于约（1.8-（0.12 [Mo]）+（0.1 *（[B] + [C]）））。
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10.发明申请公开(公告)号：US20050032253A1
公开(公告)日：2005-02-10
申请号：US10634005
申请日：2003-08-04
Applicant: Yung-Lung Hsu , James Wu
Inventor： Yung-Lung Hsu , James Wu
IPC: H01L21/66 , H01L23/544 , H01L21/4763 , H01L23/58
CPC classification number: H01L22/20 , H01L22/34 , H01L2924/3011 , Y10S438/926
Abstract: An electrical monitor comprising a via array and method for determining and reducing an electrically charged state of a semiconductor process wafer the method including providing a metal filled via array including a plurality of interspersed electrically isolated dummy metal portions to form a via array monitor; exposing the semiconductor process wafer including the via array monitor to an electrical charge altering process including to produce an electrically charged state over at least a portion of the semiconductor wafer; carrying out electrical measurements of the via array monitor to determine a level of the electrically charged state; and, carrying out an electrically charge neutralizing process to reduce a level of the electrically charged state to a predetermined acceptable level prior to carrying out a subsequent process.
Abstract translation: 一种电监测器，包括用于确定和减少半导体工艺晶片的带电状态的通孔阵列和方法，所述方法包括提供包括多个散置的电隔离的虚设金属部分的金属填充通孔阵列以形成通孔阵列监视器; 将包括通孔阵列监视器的半导体工艺晶片暴露于电荷改变过程，其包括在半导体晶片的至少一部分上产生带电状态; 执行通孔阵列监视器的电气测量以确定带电状态的水平; 并且进行电荷中和处理，以在执行后续处理之前将带电状态的水平降低到预定的可接受水平。
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