Methods for silicon oxide and oxynitride deposition using single wafer low pressure CVD
    1.
    发明授权
    Methods for silicon oxide and oxynitride deposition using single wafer low pressure CVD 有权
    使用单晶片低压CVD的氧化硅和氮氧化物沉积方法

    公开(公告)号:US06713127B2

    公开(公告)日:2004-03-30

    申请号:US10041026

    申请日:2001-12-28

    IPC分类号: C23C1640

    摘要: An oxide and an oxynitride films and their methods of fabrication are described. The oxide or the oxynitride film is grown on a substrate that is placed in a deposition chamber. A silicon source gas (or a silicon source gas with a nitridation source gas) and an oxidation source gas are decomposed in the deposition chamber using a thermal energy source. A silicon oxide (or an oxynitride) film is formed above the substrate wherein total pressure for the deposition chamber is maintained in the range of 50 Torr to 350 Torr and wherein a flow ratio for the silicon source gas (or the silicon source gas with the nitridiation source gas) and the oxidation source gas is in the range of 1:50 to 1:10000 during a deposition process.

    摘要翻译: 描述了氧化物和氧氮化物膜及其制造方法。 氧化物或氧氮化物膜在放置在沉积室中的衬底上生长。 使用热能源在沉积室中分解硅源气体(或具有氮化源气体的硅源气体)和氧化源气体。 在基板上方形成氧化硅(或氮氧化物)膜,其中沉积室的总压力保持在50Torr至350Torr的范围内,并且其中硅源气体(或硅源气体 氮化源气体),氧化源气体在沉积过程中为1:50至1:10000。