PERINDOPRIL FORMULATIONS
    2.
    发明申请
    PERINDOPRIL FORMULATIONS 审中-公开
    佩林多制剂

    公开(公告)号:US20100076052A1

    公开(公告)日:2010-03-25

    申请号:US12565424

    申请日:2009-09-23

    IPC分类号: A61K31/40

    摘要: Pharmaceutical formulations comprising perindopril or its salts, isomers, enantiomers, polymorphs, metabolites, solvates, hydrates, and mixtures thereof, and at least one surface stabilizer. Also disclosed are methods of stabilizing perindopril in the formulations, and polyoxyethylene-polyoxypropylene block copolymers as surface stabilizers.

    摘要翻译: 包含培哚普利或其盐,异构体,对映异构体,多晶型物,代谢物,溶剂合物,水合物及其混合物以及至少一种表面稳定剂的药物制剂。 还公开了在制剂中稳定培哚普托的方法,以及聚氧乙烯 - 聚氧丙烯嵌段共聚物作为表面稳定剂。

    Electrotransport Of Lisuride
    4.
    发明申请
    Electrotransport Of Lisuride 审中-公开
    Lisuride电传

    公开(公告)号:US20090105632A1

    公开(公告)日:2009-04-23

    申请号:US12246856

    申请日:2008-10-07

    摘要: An electrotransport system for delivery of lisuride or a pharmaceutically acceptable salt thereof. The system has a donor electrode assembly, a counter electrode assembly, and a controller electrically connected to the donor electrode assembly and the counter electrode assembly. The donor electrode assembly has a donor reservoir that contains a lisuride salt. The controller is electrically connected to the donor and counter electrode assemblies and is operatable for controlling current for the electrotransport.

    摘要翻译: 一种用于递送黎西汀或其药学上可接受的盐的电转运系统。 该系统具有供体电极组件,对电极组件和电连接到施主电极组件和对电极组件的控制器。 供体电极组件具有含有碘化物盐的供体储存器。 控制器电连接到供体和对电极组件,并且可操作用于控制电输送的电流。

    Methods for silicon oxide and oxynitride deposition using single wafer low pressure CVD
    5.
    发明授权
    Methods for silicon oxide and oxynitride deposition using single wafer low pressure CVD 有权
    使用单晶片低压CVD的氧化硅和氮氧化物沉积方法

    公开(公告)号:US06713127B2

    公开(公告)日:2004-03-30

    申请号:US10041026

    申请日:2001-12-28

    IPC分类号: C23C1640

    摘要: An oxide and an oxynitride films and their methods of fabrication are described. The oxide or the oxynitride film is grown on a substrate that is placed in a deposition chamber. A silicon source gas (or a silicon source gas with a nitridation source gas) and an oxidation source gas are decomposed in the deposition chamber using a thermal energy source. A silicon oxide (or an oxynitride) film is formed above the substrate wherein total pressure for the deposition chamber is maintained in the range of 50 Torr to 350 Torr and wherein a flow ratio for the silicon source gas (or the silicon source gas with the nitridiation source gas) and the oxidation source gas is in the range of 1:50 to 1:10000 during a deposition process.

    摘要翻译: 描述了氧化物和氧氮化物膜及其制造方法。 氧化物或氧氮化物膜在放置在沉积室中的衬底上生长。 使用热能源在沉积室中分解硅源气体(或具有氮化源气体的硅源气体)和氧化源气体。 在基板上方形成氧化硅(或氮氧化物)膜,其中沉积室的总压力保持在50Torr至350Torr的范围内,并且其中硅源气体(或硅源气体 氮化源气体),氧化源气体在沉积过程中为1:50至1:10000。