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公开(公告)号:US20110132885A1
公开(公告)日:2011-06-09
申请号:US12962050
申请日:2010-12-07
申请人: Jeffrey P. Sercel , Marco Mendes , Randal R. Hill , Norm Bergeron , Jeremy Hsu , Lawrence Liu
发明人: Jeffrey P. Sercel , Marco Mendes , Randal R. Hill , Norm Bergeron , Jeremy Hsu , Lawrence Liu
IPC分类号: B23K26/00
CPC分类号: B23K26/042 , B23K26/0608 , B23K26/0676 , B23K26/0738 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L33/0095
摘要: A laser machining system may include an opposite side camera to provide workpiece alignment from an opposite side of the system (i.e., the side opposite the laser machining process). The opposite side camera may be used with an air bearing positioning stage, and a portion of the stage and/or the opposite side camera may be moved to allow the opposite side camera to image a feature on the workpiece to be aligned. The opposite side alignment may be used with back side scribing and/or dual side scribing of a workpiece with alignment from one or both sides of the workpiece. Laser machining systems and methods may also be used to provide quasi-stealth scribing and multi-beam scribing.
摘要翻译: 激光加工系统可以包括相对侧相机,以从系统的相对侧(即与激光加工过程相反的一侧)提供工件对准。 相对侧相机可以与空气轴承定位台一起使用,并且台架和/或相对侧相机的一部分可以被移动以允许相对侧相机对待对准的工件上的特征进行成像。 相对侧对准可以与来自工件的一侧或两侧对准的工件的背面划线和/或双面划线一起使用。 激光加工系统和方法也可用于提供准隐形划线和多光束划线。
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公开(公告)号:US08633420B2
公开(公告)日:2014-01-21
申请号:US12576963
申请日:2009-10-09
申请人: Jeffrey P. Sercel , Joshua H. Freed , Terrence A. Murphy, Jr. , Randal R. Hill , Michael Von Dadelszen
发明人: Jeffrey P. Sercel , Joshua H. Freed , Terrence A. Murphy, Jr. , Randal R. Hill , Michael Von Dadelszen
IPC分类号: B23K26/14
CPC分类号: B23K26/359 , B23K9/1006 , B23K9/1087 , B23K26/032 , B23K26/066 , B23K26/067 , B23K26/083 , B23K26/0869 , B23K26/0892 , B23K26/16 , B23K26/364 , B23K37/0461 , B23K2101/36
摘要: Laser machining systems and methods may include debris removal systems to remove debris generated by the machining process and/or outgassing or filtration systems to remove harmful gases and filter and recycle air within the system. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.
摘要翻译: 激光加工系统和方法可以包括用于去除由加工过程产生的碎屑和/或除气或过滤系统的碎屑去除系统,以去除有害气体并过滤和再循环系统内的空气。 激光加工系统和方法可用于在诸如太阳能电池板的大型平坦工件中划线一条或多条线。 特别地,激光加工系统和方法可以用于在精确,高速和低成本的薄膜光伏(PV)太阳能电池板中划线。
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公开(公告)号:US20100089880A1
公开(公告)日:2010-04-15
申请号:US12576963
申请日:2009-10-09
申请人: Jeffrey P. Sercel , Joshua H. Freed , Terrence A. Murphy, JR. , Randal R. Hill , Michael Von Dadelszen
发明人: Jeffrey P. Sercel , Joshua H. Freed , Terrence A. Murphy, JR. , Randal R. Hill , Michael Von Dadelszen
IPC分类号: B23K26/00
CPC分类号: B23K26/359 , B23K9/1006 , B23K9/1087 , B23K26/032 , B23K26/066 , B23K26/067 , B23K26/083 , B23K26/0869 , B23K26/0892 , B23K26/16 , B23K26/364 , B23K37/0461 , B23K2101/36
摘要: Laser machining systems and methods may include debris removal systems to remove debris generated by the machining process and/or outgassing or filtration systems to remove harmful gases and filter and recycle air within the system. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.
摘要翻译: 激光加工系统和方法可以包括用于去除由加工过程产生的碎屑和/或除气或过滤系统的碎屑去除系统,以去除有害气体并过滤和再循环系统内的空气。 激光加工系统和方法可用于在诸如太阳能电池板的大型平坦工件中划线一条或多条线。 特别地,激光加工系统和方法可以用于在精确,高速和低成本的薄膜光伏(PV)太阳能电池板中划线。
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