公开(公告)号：US5761790A

公开(公告)日：1998-06-09

申请号：US747551

申请日：1996-11-12

申请人： Jeffrey William Carr ,  Jeffrey Paul Gunder

发明人： Jeffrey William Carr ,  Jeffrey Paul Gunder

IPC分类号： G11B5/10 ,  G11B5/255 ,  G11B5/31 ,  G11B5/39 ,  G11B5/60 ,  G11B21/21 ,  G11B5/127

CPC分类号： G11B5/6005 ,  G11B5/102 ,  G11B5/255 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/3903 ,  G11B5/3163 ,  Y10T29/49041 ,  Y10T29/49046 ,  Y10T29/49048

摘要： A composite thin film slider with a protruding R/W device formed by chemical-mechanical polishing to protrude above its substrate and thereby reduce the distance between the R/W device and the recording media. The slider includes a ceramic or non-ceramic substrate with a substantially planar bearing surface, and a R/W device. The R/W device includes an insulator and certain conductive R/W components, deposited onto the substrate's deposit end. The R/W components may include, for example, a magnetic shield layer, a MR stripe layer, and a magnetic pole tip layer, all layered over the deposit end of the substrate. The R/W components protrude from the insulator sufficiently to extend past the substrate's bearing surface. To manufacture this slider, a substrate with the R/W device deposited thereon is polished with a lapping slurry to disproportionately erode the substrate and insulator with respect to the R/W components. The R/W components therefore protrude from the insulator and the ceramic substrate's bearing surface.

摘要翻译： 一种复合薄膜滑块，其具有通过化学机械抛光形成的突出的R / W装置，以在其基板上突出，从而减小R / W装置与记录介质之间的距离。 滑块包括具有基本上平面的支承表面的陶瓷或非陶瓷基板以及R / W装置。 R / W器件包括沉积在衬底沉积端上的绝缘体和某些导电R / W元件。 R / W组件可以包括例如磁性屏蔽层，MR条纹层和磁极尖端层，全部层叠在衬底的沉积端上。 R / W组件从绝缘体充分突出以延伸穿过基板的支承表面。 为了制造该滑块，用研磨浆料抛光其上沉积有R / W器件的衬底，以相对于R / W部件不正常地侵蚀衬底和绝缘体。 因此，R / W部件从绝缘体和陶瓷基板的支承表面突出。

公开(公告)号：US5967878A

公开(公告)日：1999-10-19

申请号：US842940

申请日：1997-04-25

申请人： Christopher Arcona ,  Robert Owen Barr ,  Alain Michel Desouches ,  Jeffrey Paul Gunder ,  Douglas Jeffery Lucken ,  Michael Zung

发明人： Christopher Arcona ,  Robert Owen Barr ,  Alain Michel Desouches ,  Jeffrey Paul Gunder ,  Douglas Jeffery Lucken ,  Michael Zung

IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B49/02 ,  B24B49/10 ,  G11B5/187 ,  G11B5/31 ,  G11B5/39

CPC分类号： B24B37/102 ,  B24B37/048 ,  B24B49/02 ,  B24B49/10 ,  G11B5/3103 ,  G11B5/3163 ,  G11B5/1871 ,  G11B5/3116 ,  G11B5/3967 ,  G11B5/398

摘要： A method and system is disclosed for lapping row edges of a substrate work piece with a flat lapping element. The substrate work piece comprises a section of wafer having parallel aligned multiple row edges to be individually lapped. The wafer has different bow characteristics imparted to different substrate work piece. The bow characteristic of the substrate work piece to be lapped is determined, load points are selected on the work piece which will counteract the bow characteristic, and a pusher with push pads located at the selected load points pushes the work piece at those load points so that the pushing flexes the substrate work piece to counteract the bow characteristic to lap the row edge. Upon completion of the lapping step, the row having the lapped row edge is sliced from the work piece to form a new row edge parallel to the lapped row edge, and, repeating the lapping process, the work piece is pushed by the push pads at the same selected load points, whereby, as the substrate is shortened, making said bow characteristic more pronounced, the pushing at the selected load points provides greater flex of the work piece to counteract the more pronounced bow.

摘要翻译： 公开了一种用于研磨具有平坦研磨元件的基底工件的行边缘的方法和系统。 衬底工件包括具有平行排列的多个行边缘以进行单独研磨的晶片部分。 晶片具有赋予不同衬底工件的不同的弓形特性。 确定要研磨的基板工件的弓形特征，在工件上选择负载点，该负载点将抵消弓形特性，并且具有位于所选加载点处的推动垫的推动器将工件在这些负载点处推动 推动弯曲基板工件以抵消弓形特征以搭接行边缘。 在研磨步骤完成后，具有重叠行边的行从工件切片以形成平行于搭接的行边缘的新的行边，并且重复研磨过程，工件被推垫推动 相同的选择的负载点，由此，当基板被缩短时，使所述弓形特征更加显着，在所选择的载荷点处的推动提供了工件的更大弯曲以抵抗更明显的弓。