Lapping method and system for compensating for substrate bow
    1.
    发明授权
    Lapping method and system for compensating for substrate bow 失效
    用于补偿基材弓的研磨方法和系统

    公开(公告)号:US5967878A

    公开(公告)日:1999-10-19

    申请号:US842940

    申请日:1997-04-25

    摘要: A method and system is disclosed for lapping row edges of a substrate work piece with a flat lapping element. The substrate work piece comprises a section of wafer having parallel aligned multiple row edges to be individually lapped. The wafer has different bow characteristics imparted to different substrate work piece. The bow characteristic of the substrate work piece to be lapped is determined, load points are selected on the work piece which will counteract the bow characteristic, and a pusher with push pads located at the selected load points pushes the work piece at those load points so that the pushing flexes the substrate work piece to counteract the bow characteristic to lap the row edge. Upon completion of the lapping step, the row having the lapped row edge is sliced from the work piece to form a new row edge parallel to the lapped row edge, and, repeating the lapping process, the work piece is pushed by the push pads at the same selected load points, whereby, as the substrate is shortened, making said bow characteristic more pronounced, the pushing at the selected load points provides greater flex of the work piece to counteract the more pronounced bow.

    摘要翻译: 公开了一种用于研磨具有平坦研磨元件的基底工件的行边缘的方法和系统。 衬底工件包括具有平行排列的多个行边缘以进行单独研磨的晶片部分。 晶片具有赋予不同衬底工件的不同的弓形特性。 确定要研磨的基板工件的弓形特征,在工件上选择负载点,该负载点将抵消弓形特性,并且具有位于所选加载点处的推动垫的推动器将工件在这些负载点处推动 推动弯曲基板工件以抵消弓形特征以搭接行边缘。 在研磨步骤完成后,具有重叠行边的行从工件切片以形成平行于搭接的行边缘的新的行边,并且重复研磨过程,工件被推垫推动 相同的选择的负载点,由此,当基板被缩短时,使所述弓形特征更加显着,在所选择的载荷点处的推动提供了工件的更大弯曲以抵抗更明显的弓。

    Lapping process using micro-advancement for optimizing flatness of a
magnetic head air bearing surface
    2.
    发明授权
    Lapping process using micro-advancement for optimizing flatness of a magnetic head air bearing surface 失效
    研磨工艺采用微型前进,优化磁头空气轴承表面的平整度

    公开(公告)号:US5749769A

    公开(公告)日:1998-05-12

    申请号:US674054

    申请日:1996-07-01

    摘要: A lapping method and device for lapping magnetic heads to provide an air bearing surface with improved surface quality including increased smoothness, reduced rolloff, and reduced recession. The lapping machine includes a lapping plate having a grinding surface, a linear motion mechanism for moving the ABS over the grinding surface in a first, linear direction, and a micro-advance mechanism for controllably advancing the workpiece over the grinding surface in a second direction that is preferably perpendicular. The lapping method comprises affixing the unfinished magnetic head proximate to the lapping plate and depositing an abrasive slurry on the grinding surface. An initial rough lapping stage is performed, including moving the grinding surface so that the workpiece is lapped to a first predetermined target specification. After washing, a conductive lubricant material is applied to the grinding surface, other lapping steps may be performed, and then a micro-advanced lapping stage is performed, including micro-advancing the magnetic head in the second direction while simultaneously linear lapping it in the first direction to provide a highly polished ABS.

    摘要翻译: 一种研磨方法和装置,用于研磨磁头以提供具有改进的表面质量的空气轴承表面,包括增加的平滑度,降低的滚降和减小的衰退。 研磨机包括具有磨削表面的研磨板,用于沿着第一直线方向将ABS移动到磨削表面上的直线运动机构,以及用于在第二方向上将工件可控地推进到研磨表面上的微前进机构 优选是垂直的。 研磨方法包括将未完成的磁头固定在研磨板附近并将磨料浆料沉积在研磨表面上。 执行初始粗糙研磨阶段,包括移动研磨表面,使得工件被研磨到第一预定目标规格。 洗涤后,将导电润滑剂材料施加到研磨表面,可以进行其它研磨步骤,然后进行微型高级研磨阶段,包括在第二方向上微动进给磁头,同时在 第一个方向提供高度抛光的ABS。