利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

109 条记录 (耗时 0.014 秒)

    Rock polishing systems and methods
    1.
    发明授权
    Rock polishing systems and methods 有权
    岩石抛光系统和方法

    公开(公告)号：US08702473B1

    公开(公告)日：2014-04-22

    申请号：US13784679

    申请日：2013-03-04

    申请人： Gordon Lyons

    发明人： Gordon Lyons

    IPC分类号： B24B1/00

    CPC分类号： B24B37/102

    摘要： A polishing system for polishing a flat face of a rock comprises a polishing surface, a fence system, and a drive system. The polishing surface is supported for rotation about a primary rotation axis. The fence system is supported above the polishing surface. The drive system causes the polishing surface to rotate about the primary rotation axis and displace a driven portion of the fence system along a path relative to the primary rotation axis. The fence system engages the rock to prevent the polishing surface from causing the rock to move about the primary rotation axis and to cause the rock to move towards and away from the primary rotation axis.

    摘要翻译： 用于抛光岩石的平坦表面的抛光系统包括抛光表面，挡板系统和驱动系统。 抛光表面被支撑以围绕主旋转轴线旋转。 护栏系统支撑在抛光表面上方。 驱动系统使得抛光表面围绕主旋转轴线旋转并且沿着相对于主旋转轴线的路径移动挡板系统的被驱动部分。 围栏系统接合岩石以防止抛光表面使岩石围绕初级旋转轴线移动并且使岩石朝向和远离主旋转轴线移动。

    Pulsed-force chemical mechanical polishing
    2.
    发明授权
    Pulsed-force chemical mechanical polishing 失效
    脉冲化学机械抛光

    公开(公告)号：US5562530A

    公开(公告)日：1996-10-08

    申请号：US284315

    申请日：1994-08-02

    申请人： Scott Runnels ,  L. Michael Eyman

    发明人： Scott Runnels ,  L. Michael Eyman

    IPC分类号： B24B1/04 ,  B24B37/10 ,  B24B1/00

    CPC分类号： B24B37/102 ,  B24B1/04

    摘要： A pulsed-force CMP scheme allows for the down force holding a wafer onto a pad to cycle periodically between minimum and maximum values. When the force is near its minimum value, slurry flows into the space between the wafer and the pad. When the force is near its maximum value, slurry is squeezed out allowing for the abrasive action of the pad surface to erode wafer surface features.

    摘要翻译： 脉冲力CMP方案允许将晶片保持在焊盘上的向下力在最小值和最大值之间周期性地循环。 当力接近其最小值时，浆料流入晶片和衬垫之间的空间。 当力接近其最大值时，浆料被挤出，允许焊盘表面的磨蚀作用侵蚀晶片表面特征。

    Temperature control for wafer polishing
    3.
    发明授权
    Temperature control for wafer polishing 失效
    晶圆抛光温度控制

    公开(公告)号：US4450652A

    公开(公告)日：1984-05-29

    申请号：US299378

    申请日：1981-09-04

    申请人： Robert J. Walsh

    发明人： Robert J. Walsh

    IPC分类号： H01L21/304 ,  B24B37/10 ,  B24B49/14 ,  H01L21/302 ,  B24B7/04

    CPC分类号： B24B37/102 ,  B24B49/14

    摘要： A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.

    摘要翻译： 提供了一种晶片工件抛光温度控制方法和装置，其中晶片安装在可转动的压板组件上，该可转动的压板组件定位成与转台组件支撑的抛光垫可转动地接触，转盘组件具有内部流体冷却装置，晶片抛光温度控制通过 通过在晶片和抛光垫上的抛光压力的变化而激活的响应闭环机电装置。

    Bearing mount for lapping machine pressure plate
    4.
    发明授权
    Bearing mount for lapping machine pressure plate 失效
    用于研磨机压板的轴承座

    公开(公告)号：US4270314A

    公开(公告)日：1981-06-02

    申请号：US76306

    申请日：1979-09-17

    申请人： Joseph V. Cesna

    发明人： Joseph V. Cesna

    IPC分类号： F16C23/08 ,  B24B37/10 ,  F16C35/04 ,  F16C35/06 ,  B24B7/04

    CPC分类号： B24B37/102 ,  F16C35/06 ,  F16C19/542

    摘要： This disclosure teaches structure for mounting a pressure plate relative to its supporting shaft in such a manner that axial forces are transmitted between the shaft and pressure plate while yet providing that the plate can freely rotate and swivel relative to the shaft even at varying angles of tilt. The mounting structure includes a pair of angular contact bearings arranged in back to back relationship, the inner races thereof being confined on the shaft and the outer races thereof being confined within a housing block. The housing block is nonrotatably keyed to the pressure plate and a single ball bearing is mounted between the pressure plate and bearing block in axial alignment with the shaft and with the pressure plate. In effect then, one of the angular contact bearings is working to allow free pressure plate rotation and swivel when axial compression forces are applied between the shaft and pressure plate, and the single ball bearing self aligns the axial force coaxially of the shaft and bearing plate; while the other angular contact bearing is working to allow free pressure plate rotation and swivel when the shaft is elevated and the plate is not supported on its underside.

    摘要翻译： 本公开教导了用于相对于其支撑轴安装压力板的结构，使得轴向力在轴和压力板之间传递，同时还提供了即使在倾斜角度不同的情况下，板也可以相对于轴自由旋转和旋转 。 安装结构包括一对背对背配置的角接触轴承，其内圈限制在轴上，其外圈被限制在壳体内。 壳体块不可旋转地键合到压板，并且单个滚珠轴承安装在压力板和轴承座之间，与轴和压力板轴向对准。 然后，其中一个角接触轴承的作用是允许在轴和压板之间施加轴向压缩力时自由压板旋转和旋转，单个球轴承自动对准轴和轴承板同轴的轴向力 ; 而另一个角接触轴承的作用是允许自由压板旋转并在轴升高时旋转，并且板在其下侧不被支撑。

    Polishing machine
    5.
    发明授权
    Polishing machine 失效
    抛光机

    公开(公告)号：US3631634A

    公开(公告)日：1972-01-04

    申请号：US3631634D

    申请日：1970-01-26

    申请人： JOHN L WEBER

    发明人： WEBER JOHN L

    IPC分类号： B24B37/10 ,  B24B5/00

    CPC分类号： B24B37/102

    摘要： A polishing machine or similar abrading apparatus having a horizontal platen rotatable about a vertical axis with workpieces held against the platen by at least one vertically movable support head. Pneumatic means are provided to raise and lower the support head with the pneumatic means operatively disengaged from the support head in the operating position, and with adjustable dead weight means and position aligning idlers controlling the pressure and position of the support head during operation.

    摘要翻译： 一种抛光机或类似的研磨装置，其具有可绕垂直轴线旋转的水平压板，工件通过至少一个可垂直移动的支撑头保持抵靠压板。 提供气动装置以便在操作位置可操作地从支撑头脱离的气动装置以及在操作期间控制支撑头的压力和位置的可调整的自重装置和位置对准惰轮来升高和降低支撑头。