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公开(公告)号：US20170274498A1
公开(公告)日：2017-09-28
申请号：US15461944
申请日：2017-03-17
申请人： Jeonghoon Oh , Edwin C. Suarez , Jason Garcheung Fung , Eric Lau , King Yi Heung , Ashwin Murugappan Chockalingam , Daniel Redfield , Charles C. Garretson , Thomas H. Osterheld
发明人： Jeonghoon Oh , Edwin C. Suarez , Jason Garcheung Fung , Eric Lau , King Yi Heung , Ashwin Murugappan Chockalingam , Daniel Redfield , Charles C. Garretson , Thomas H. Osterheld
摘要： A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.
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公开(公告)号：US20180339402A1
公开(公告)日：2018-11-29
申请号：US15873851
申请日：2018-01-17
IPC分类号： B24D11/00 , B29C64/112 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00
摘要： A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set of successive layers onto a support by droplet ejection. Depositing the first set of successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. A second set of successive layers is deposited by droplet ejection over the first set of successive layers. The second set of successive layers corresponds to a lower portion of the polishing pad. The first set of successive layer and the second set of successive layers provide a body. The body is removed from the support. Removing the sacrificial material from the body provides the polishing pad with a polishing surface that has the partitions separated by the grooves.
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公开(公告)号：US20170259396A1
公开(公告)日：2017-09-14
申请号：US15455072
申请日：2017-03-09
摘要： A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.
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