公开(公告)号：US20070236861A1

公开(公告)日：2007-10-11

申请号：US11278773

申请日：2006-04-05

申请人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

发明人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

IPC分类号： H01G4/35

CPC分类号： A61N1/3754

摘要： A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.

摘要翻译： 介绍了可植入医疗器械的气密互连。 在一个实施例中，气密互连包括在单层中引入通孔的导电材料。 导电材料包括第一端和第二端。 第一焊盘耦合到导电材料的第一端。 第二接合焊盘耦合到导电材料的第二端。 单层和导电材料经历共烧制过程。

公开(公告)号：US20070060969A1

公开(公告)日：2007-03-15

申请号：US11227342

申请日：2005-09-15

申请人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

发明人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

IPC分类号： A61N1/375

CPC分类号： A61N1/3754 ,  A61N1/375 ,  H01G9/10

摘要： The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing reliable electrical communication. After sintering the structure is hermetically diffusion bonded to a part of a ferrule and/or adjacent support member.

摘要翻译： 本发明包括一系列适于植入生物系统的小型化，密封电气馈通组件。 根据本发明的电馈通组件可以用作可植入医疗装置的组件，例如可植入脉冲发生器，心律转复除颤器，生理传感器，药物递送系统等。 这样的组件需要在施加的偏置电流或电压下的生物相容性和耐劣化性。 这种组件由布置在陶瓷绿色材料之间的导电金属膏的互连电路或通路制成。 层叠在一起并烧结以形成具有延伸穿过该结构的至少一个嵌入金属化路径的基本上单片的电介质结构。 即使暴露于体液和组织并且提供可靠的电通信，金属化路径也可靠地传导电信号。 在烧结之后，结构气密地扩散粘合到套圈和/或相邻的支撑构件的一部分上。

公开(公告)号：US20060167536A1

公开(公告)日：2006-07-27

申请号：US11042649

申请日：2005-01-25

申请人： Lea Nygren ,  James Coles ,  Scott Brabec ,  Randy Rose

发明人： Lea Nygren ,  James Coles ,  Scott Brabec ,  Randy Rose

IPC分类号： A61N1/05

CPC分类号： A61N1/05 ,  C23C28/32 ,  Y10T29/49204

摘要： A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.

摘要翻译： 一种用于制造可植入医疗电极的方法包括使电极基板粗糙化，施加粘合层，以及在优化以最小化电极阻抗和脉冲后极化的条件下，在粘附层上沉积阀金属氧化物涂层。 电极基板可以是各种电极金属或包括钛，铂，铂 - 铱或铌的合金。 粘合层可以由钛或锆形成。 阀金属氧化物涂层是在受控目标功率，溅射压力和溅射气体比设置下溅射到粘附层上的氧化钌涂层，其被优化以最小化电极阻抗和后脉冲极化。

公开(公告)号：US20070179374A1

公开(公告)日：2007-08-02

申请号：US11343059

申请日：2006-01-30

申请人： Lea Nygren ,  Shawn Knowles

发明人： Lea Nygren ,  Shawn Knowles

IPC分类号： A61B5/04

CPC分类号： A61N1/056 ,  A61B5/042 ,  A61N1/3716

摘要： An implantable medical electrode comprising an electrode substrate having an exterior surface, and a zirconium nitride coating disposed over the exterior surface.

摘要翻译： 一种可植入医疗电极，包括具有外表面的电极基底和设置在外表面上的氮化锆涂层。

公开(公告)号：US20060030893A1

公开(公告)日：2006-02-09

申请号：US10914303

申请日：2004-08-09

申请人： Timothy Laske ,  Gonzalo Martinez ,  Lea Nygren

发明人： Timothy Laske ,  Gonzalo Martinez ,  Lea Nygren

IPC分类号： A61N1/375

CPC分类号： A61N1/375 ,  A61N1/3756

摘要： A surface area of an IMD electrode is increased by forming a conductive layer over an external portion of a sidewall of an IMD connector header and electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing; wherein the conductive mounting surface is an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

摘要翻译： 通过在IMD连接器集管的侧壁的外部部分上形成导电层并将连接器集管的导电层电耦合到密封的IMD壳体的导电安装表面来增加IMD电极的表面积; 其中所述导电安装表面是所述IMD的外部导电表面的延伸部，所述外部导电表面形成所述IMD电极，所述IMD电极通过形成在所述连接器插头上的导电层而在表面积上增加。