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    HERMETIC FEEDTHROUGH
    5.
    发明申请
    HERMETIC FEEDTHROUGH 有权

    公开(公告)号：US20130032378A1

    公开(公告)日：2013-02-07

    申请号：US13564475

    申请日：2012-08-01

    申请人： Kengo Morioka ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Andrew Thom ,  Hiroshi Makino ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto ,  Takahito Hirata

    发明人： Kengo Morioka ,  Arne Knudsen ,  Shingo Satou ,  Hidekazu Otomaru ,  Andrew Thom ,  Hiroshi Makino ,  Markus Reiterer ,  Gordon Munns ,  Thomas Miltich ,  Joyce Yamamoto ,  Takahito Hirata

    IPC分类号： H01B17/26 ,  B32B38/00 ,  B05D3/02

    CPC分类号： A61N1/3754

    摘要： A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

    摘要翻译： 用于可植入医疗装置的密封馈通包括具有孔的片，其中片包括包含氧化铝的陶瓷。 馈通还包括基本上填充孔的第二材料，其中第二材料包括铂粉末混合物和氧化铝添加剂。 铂粉末混合物包括中值粒径在约3微米至10微米之间的第一铂粉末和比第一铂粉末粗的第二铂粉末，其中位粒度在约5微米至20微米之间。 铂粉末混合物包含第一铂粉末的约50至80重量％和第二铂粉末的约20至50重量％。 第一和第二材料之间具有共烧结，密封该孔。

    IMPLANTABLE CO-FIRED ELECTRICAL FEEDTHROUGHS
    6.
    发明申请
    IMPLANTABLE CO-FIRED ELECTRICAL FEEDTHROUGHS 审中-公开
    可植入式电动发电机

    公开(公告)号：US20070236861A1

    公开(公告)日：2007-10-11

    申请号：US11278773

    申请日：2006-04-05

    申请人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

    发明人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

    IPC分类号： H01G4/35

    CPC分类号： A61N1/3754

    摘要： A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.

    摘要翻译： 介绍了可植入医疗器械的气密互连。 在一个实施例中，气密互连包括在单层中引入通孔的导电材料。 导电材料包括第一端和第二端。 第一焊盘耦合到导电材料的第一端。 第二接合焊盘耦合到导电材料的第二端。 单层和导电材料经历共烧制过程。

    Implantable co-fired electrical feedthroughs
    8.
    发明申请
    Implantable co-fired electrical feedthroughs 审中-公开
    可植入联合电气馈通

    公开(公告)号：US20070060969A1

    公开(公告)日：2007-03-15

    申请号：US11227342

    申请日：2005-09-15

    申请人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

    发明人： Jeremy Burdon ,  Joyce Yamamoto ,  Lea Nygren ,  William Wolf

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3754 ,  A61N1/375 ,  H01G9/10

    摘要： The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing reliable electrical communication. After sintering the structure is hermetically diffusion bonded to a part of a ferrule and/or adjacent support member.

    摘要翻译： 本发明包括一系列适于植入生物系统的小型化，密封电气馈通组件。 根据本发明的电馈通组件可以用作可植入医疗装置的组件，例如可植入脉冲发生器，心律转复除颤器，生理传感器，药物递送系统等。 这样的组件需要在施加的偏置电流或电压下的生物相容性和耐劣化性。 这种组件由布置在陶瓷绿色材料之间的导电金属膏的互连电路或通路制成。 层叠在一起并烧结以形成具有延伸穿过该结构的至少一个嵌入金属化路径的基本上单片的电介质结构。 即使暴露于体液和组织并且提供可靠的电通信，金属化路径也可靠地传导电信号。 在烧结之后，结构气密地扩散粘合到套圈和/或相邻的支撑构件的一部分上。

    Miniaturized co-fired electrical interconnects for implantable medical devices
    10.
    发明申请
    Miniaturized co-fired electrical interconnects for implantable medical devices 审中-公开
    用于可植入医疗器械的小型化共烧电互连

    公开(公告)号：US20070060970A1

    公开(公告)日：2007-03-15

    申请号：US11227375

    申请日：2005-09-15

    申请人： Jeremy Burdon ,  Joyce Yamamoto

    发明人： Jeremy Burdon ,  Joyce Yamamoto

    IPC分类号： A61N1/00

    CPC分类号： A61N1/3754 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09627 ,  H05K2201/09709 ,  H01L2924/00

    摘要： The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device (IMD) such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing electrical communication between internal IMD circuitry and active electrical components and/or circuitry coupled to the exterior of an IMD.

    摘要翻译： 本发明包括一系列适于植入生物系统的小型化，密封电气馈通组件。 根据本发明的电馈通组件可以用作可植入医疗装置（IMD）的组件，例如可植入脉冲发生器，心律转复除颤器，生理传感器，药物递送系统等。 这样的组件需要在施加的偏置电流或电压下的生物相容性和耐劣化性。 这种组件由布置在陶瓷绿色材料之间的导电金属膏的互连电路或通路制成。 层叠在一起并烧结以形成具有延伸穿过该结构的至少一个嵌入金属化路径的基本上单片的电介质结构。 金属化路径即使暴露于体液和组织也可靠地传导电信号，并提供内部IMD电路与耦合到IMD外部的有源电气部件和/或电路之间的电气通信。