公开(公告)号：US5534290A

公开(公告)日：1996-07-09

申请号：US206756

申请日：1994-03-07

申请人： Jewel G. Rainwater ,  Paul Benson ,  William R. Belko ,  Robert J. Deffeyes ,  Arne B. Carlson, deceased

发明人： Jewel G. Rainwater ,  Paul Benson ,  William R. Belko ,  Robert J. Deffeyes ,  Arne B. Carlson, deceased

IPC分类号： H01G4/30 ,  H01L21/00 ,  H01L21/48 ,  H05K3/46 ,  B05D5/12

CPC分类号： H01L21/4857 ,  H01G4/308 ,  H01L21/4867 ,  H01L21/67236 ,  H05K3/4664

摘要： A multilayered ceramic chip capacitor. An electrode ink pattern is formed on a release film. The electrode ink pattern is calendered, densified and flattened. Dielectric material is applied to the release film and surrounds but does not cover the electrode ink to form an electrode surround printed dielectric sheet. The dielectric is calendered, densified and flattened. The densities of the electrode ink and dielectric are formulated such that after calendering the electrode ink and dielectric surfaces are substantially coplanar. A final overcoat of dielectric is applied over the surround printed dielectric sheet.

摘要翻译： 多层陶瓷片式电容器。 在剥离膜上形成电极油墨图案。 电极油墨图案被压延，致密化并变平。 将电介质材料施加到剥离膜并包围但不覆盖电极油墨以形成电极环绕印刷电介质片。 电介质被压延，致密化并变平。 配制电极油墨和电介质的密度使得在压延电极油墨之后，电介质表面基本上共面。 电介质的最终外涂层施加在环绕印刷电介质片上。

公开(公告)号：US5101319A

公开(公告)日：1992-03-31

申请号：US504330

申请日：1990-04-03

申请人： Robert J. Diffeyes ,  Jewel G. Rainwater ,  William R. Belko ,  Arne B. Carlson

发明人： Robert J. Diffeyes ,  Jewel G. Rainwater ,  William R. Belko ,  Arne B. Carlson

IPC分类号： H01C7/04 ,  H01C7/10 ,  H01G4/12 ,  H01G4/30

CPC分类号： H01G4/308 ,  Y10T29/435

摘要： Multilayered ceramic capacitors are manufactured using electrode machine coating densification techniques. The capacitors produced have electrodes and dielectric layers which are more uniform, thinner and flatter than prior art electrode and dielectric layers. An electrode pattern is printed on a release sheet and calendered. A dielectric overcoats the electrode pattern and is calendered, forming an electrode embedded green sheet. The green sheet is stacked with similarly formed electrode embedded green sheets, the stack is laminated and unfinished capacitors are cut from the stack.

摘要翻译： 使用电极机涂层致密化技术制造多层陶瓷电容器。 所制造的电容器具有比现有技术的电极和电介质层更均匀，更薄和更扁平的电极和电介质层。 将电极图案印刷在剥离片上并压延。 电介质覆盖电极图案并被压延，形成电极嵌入的生片。 将生片堆叠成类似形成的电极嵌入的生片，堆叠层叠，并且从堆叠切割未完成的电容器。

公开(公告)号：US5292548A

公开(公告)日：1994-03-08

申请号：US860063

申请日：1992-03-30

申请人： Jewel G. Rainwater

发明人： Jewel G. Rainwater

IPC分类号： B05D5/12 ,  H01G4/30 ,  H01L21/00 ,  H01L21/48 ,  H01L23/12 ,  H05K3/46

CPC分类号： H01L21/67236 ,  H01G4/308 ,  H01L21/4857 ,  H01L21/4867 ,  H05K3/4664

摘要： A method for making a substrate for use in a multilayered integrated circuit or multichip module which includes coating a conductive material on a surface of a support sheet to form a conductive circuit and then drying the sheet. Next, a coating of a layer of dielectric layer is placed on the support surface in the areas where the conductive material is not cast. After which the coated sheet is densified to form a densified conductive circuit embedded dielectric layer. A second coating of a dielectric is placed over the first densified conductive circuit embedded dielectric layer such that the second layer is characterized by vias therein which are in register with at least a portion of the conductive circuit. The vias in the second dielectric layer are filled to form electrically conductive vias and then densifying to form the substrate.

摘要翻译： 一种制造用于多层集成电路或多芯片模块的衬底的方法，包括在支撑片的表面上涂覆导电材料以形成导电电路，然后干燥片材。 接下来，将电介质层的涂层放置在导电材料未被铸造的区域中的支撑表面上。 之后，将被覆层片致密化，形成致密化的导电电路嵌入介质层。 电介质的第二涂层被放置在第一致密化的导电电路嵌入的介电层上，使得第二层的特征在于其中的通孔与导电电路的至少一部分对准。 填充第二电介质层中的通孔以形成导电通孔，然后致密化以形成衬底。