公开(公告)号：US20120060031A1

公开(公告)日：2012-03-08

申请号：US12874541

申请日：2010-09-02

申请人： Jian HUANG ,  Bobby Bo XIAO ,  Jack Jianxiu HAO ,  Diego S. ROZENSZTEJN ,  Okeno R. PALMER ,  Gaurav MEHTA

发明人： Jian HUANG ,  Bobby Bo XIAO ,  Jack Jianxiu HAO ,  Diego S. ROZENSZTEJN ,  Okeno R. PALMER ,  Gaurav MEHTA

IPC分类号： H04L9/32

CPC分类号： H04L9/083 ,  H04L2209/603 ,  H04N21/2543 ,  H04N21/25816 ,  H04N21/42684 ,  H04N21/47202 ,  H04N21/63345 ,  H04N21/6581 ,  H04N21/6582 ,  H04N21/8355

摘要： A method that includes receiving a first request for video content from a user of a user device; retrieving an identifier for the user device using an application programming interface; sending a second request to receive the video content that includes the identifier; receiving an instruction to provide payment to rent or purchase the video content; sending the payment in response to the instruction; receiving the video content and a token, where the video content is encrypted based on a key and where the token indicates that the payment was processed; sending a third request to obtain a license associated with the video content that includes the token and the identifier; receiving the license, which includes the key and terms under which the video content is to be processed; decrypting the video content, using the key, when the decrypting is performed in a manner permitted by the terms; and playing the decrypted video content.

摘要翻译： 一种方法，包括从用户设备的用户接收对视频内容的第一请求; 使用应用编程接口检索所述用户设备的标识符; 发送第二请求以接收包括标识符的视频内容; 接收提供租金或购买视频内容的指示; 根据该指示发送付款; 接收视频内容和令牌，其中基于密钥加密视频内容，以及令牌表示付款被处理的位置; 发送第三请求以获得与包括令牌和标识符的视频内容相关联的许可证; 接收许可证，其中包括要处理视频内容的关键字和条款; 使用密钥解密视频内容，当解密是以条款允许的方式执行的; 并播放解密的视频内容。

公开(公告)号：US20080054435A1

公开(公告)日：2008-03-06

申请号：US11846665

申请日：2007-08-29

申请人： Gaurav MEHTA ,  Hien Boon Tan ,  Susanto Tanary ,  Mary Annie Cheong ,  Anthony Sun ,  Chuen Wang

发明人： Gaurav MEHTA ,  Hien Boon Tan ,  Susanto Tanary ,  Mary Annie Cheong ,  Anthony Sun ,  Chuen Wang

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked die semiconductor package that includes a substrate with a plurality of adhesive portions arranged in a manner to create at least one gap between the adhesive portions. The package also includes a first semiconductor chip having a non-active surface in contact with the adhesive portions, and an active surface being electrically connected to the substrate. In the package, a second semiconductor chip the non-active surface of the second semiconductor chip is attached to the non-active surface of the first semiconductor chip by a layer of adhesive therebetween. The active surface of the second semiconductor chip is electrically connected to the substrate. An encapsulant material covers the first and second semiconductor chips and their associated electrical connections. The encapsulating material fills the at least one gap between the plurality of adhesive portions and thereby encapsulates the second semiconductor chip and its associated electrical connection.

摘要翻译： 一种堆叠半导体封装，其包括具有以在粘合剂部分之间形成至少一个间隙的方式布置的多个粘合剂部分的基板。 封装还包括具有与粘合剂部分接触的非活性表面的第一半导体芯片，以及与该基板电连接的有源表面。 在封装中，第二半导体芯片的第二半导体芯片的第二半导体芯片的非有效表面通过它们之间的粘合剂层附着到第一半导体芯片的非有效表面。 第二半导体芯片的有源表面与基板电连接。 密封剂材料覆盖第一和第二半导体芯片及其相关联的电连接。 封装材料填充多个粘合剂部分之间的至少一个间隙，从而封装第二半导体芯片及其相关联的电连接。