公开(公告)号：US07723833B2

公开(公告)日：2010-05-25

申请号：US11846665

申请日：2007-08-29

申请人： Gaurav Mehta ,  Hien Boon Tan ,  Susanto Tanary ,  Mary Annie Cheong ,  Anthony Yi Sheng Sun ,  Chuen Khiang Wang

发明人： Gaurav Mehta ,  Hien Boon Tan ,  Susanto Tanary ,  Mary Annie Cheong ,  Anthony Yi Sheng Sun ,  Chuen Khiang Wang

IPC分类号： H01L23/02 ,  H01L21/48 ,  H01L23/28

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked die semiconductor package that includes a substrate with a plurality of adhesive portions arranged in a manner to create at least one gap between the adhesive portions. The package also includes a first semiconductor chip having a non-active surface in contact with the adhesive portions, and an active surface being electrically connected to the substrate. In the package, a second semiconductor chip the non-active surface of the second semiconductor chip is attached to the non-active surface of the first semiconductor chip by a layer of adhesive therebetween. The active surface of the second semiconductor chip is electrically connected to the substrate. An encapsulant material covers the first and second semiconductor chips and their associated electrical connections. The encapsulating material fills the at least one gap between the plurality of adhesive portions and thereby encapsulates the second semiconductor chip and its associated electrical connection.

摘要翻译： 一种堆叠半导体封装，其包括具有以在粘合剂部分之间形成至少一个间隙的方式布置的多个粘合剂部分的基板。 封装还包括具有与粘合剂部分接触的非活性表面的第一半导体芯片，以及与该基板电连接的有源表面。 在封装中，第二半导体芯片的第二半导体芯片的第二半导体芯片的非有效表面通过它们之间的粘合剂层附着到第一半导体芯片的非有效表面。 第二半导体芯片的有源表面与基板电连接。 密封剂材料覆盖第一和第二半导体芯片及其相关联的电连接。 封装材料填充多个粘合剂部分之间的至少一个间隙，从而封装第二半导体芯片及其相关联的电连接。

公开(公告)号：US20070164425A1

公开(公告)日：2007-07-19

申请号：US11495781

申请日：2006-07-31

申请人： Ravi Kanth Kolan ,  Danny Vallejo Retuta ,  Hien Boon Tan ,  Anthony Yi Sheng Sun ,  Susanto Tanary ,  Patrick Tse Hoong Low

发明人： Ravi Kanth Kolan ,  Danny Vallejo Retuta ,  Hien Boon Tan ,  Anthony Yi Sheng Sun ,  Susanto Tanary ,  Patrick Tse Hoong Low

IPC分类号： H01L23/34

CPC分类号： H01L23/544 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufacturing a semiconductor package that includes inserting a substrate with an attached semiconductor chip in a first mold portion, placing a heat sink structure on top of a portion of the substrate, placing a mold release film onto a second mold portion, clamping a second mold portion onto a portion of the heat sink structure, injecting an encapsulant into a mold cavity, wherein the encapsulant surrounds portions of the substrate, semiconductor chip and heat sink structure, curing the encapsulant, whereby the heat sink structure adheres to the encapsulant and singulating the encapsulated assembly to form a semiconductor package.

摘要翻译： 本发明包括用于半导体封装的散热器结构，其包括具有下降组件的环形结构和连接到环形结构的散热器。 羽绒服可以倾斜或V形。 本发明还包括制造半导体封装的方法，该方法包括将具有附接的半导体芯片的衬底插入第一模具部分中，将散热器结构放置在衬底的一部分的顶部上，将脱模膜放置在第二模具 将第二模具部分夹紧到散热器结构的一部分上，将密封剂注入模腔中，其中所述密封剂围绕所述衬底，半导体芯片和散热器结构的部分，固化所述密封剂，由此所述散热器结构粘附 并且分离封装的组件以形成半导体封装。

公开(公告)号：US08039951B2

公开(公告)日：2011-10-18

申请号：US11495781

申请日：2006-07-31

申请人： Kolan Ravi Kanth ,  Danny Vallejo Retuta ,  Hien Boon Tan ,  Anthony Sun-Yi Sheng ,  Susanto Tanary ,  Patrick Low Tse Hoong

发明人： Kolan Ravi Kanth ,  Danny Vallejo Retuta ,  Hien Boon Tan ,  Anthony Sun-Yi Sheng ,  Susanto Tanary ,  Patrick Low Tse Hoong

IPC分类号： H01L23/10

CPC分类号： H01L23/544 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufacturing a semiconductor package that includes inserting a substrate with an attached semiconductor chip in a first mold portion, placing a heat sink structure on top of a portion of the substrate, placing a mold release film onto a second mold portion, clamping a second mold portion onto a portion of the heat sink structure, injecting an encapsulant into a mold cavity, wherein the encapsulant surrounds portions of the substrate, semiconductor chip and heat sink structure, curing the encapsulant, whereby the heat sink structure adheres to the encapsulant and singulating the encapsulated assembly to form a semiconductor package.

摘要翻译： 本发明包括用于半导体封装的散热器结构，其包括具有下降组件的环形结构和连接到环形结构的散热器。 羽绒服可以倾斜或V形。 本发明还包括制造半导体封装的方法，该方法包括将具有附接的半导体芯片的衬底插入第一模具部分中，将散热器结构放置在衬底的一部分的顶部上，将脱模膜放置在第二模具 将第二模具部分夹紧到散热器结构的一部分上，将密封剂注入模腔中，其中所述密封剂围绕所述衬底，半导体芯片和散热器结构的部分，固化所述密封剂，由此所述散热器结构粘附 并且分离封装的组件以形成半导体封装。

公开(公告)号：US07476569B2

公开(公告)日：2009-01-13

申请号：US12113968

申请日：2008-05-02

申请人： Danny Vallejo Retuta ,  Hien Boon Tan ,  Susanto Tanary ,  Anthony Yi Sheng Sun ,  Soon Huat James Tan

发明人： Danny Vallejo Retuta ,  Hien Boon Tan ,  Susanto Tanary ,  Anthony Yi Sheng Sun ,  Soon Huat James Tan

IPC分类号： H01L23/48

CPC分类号： H01L21/4842 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.

摘要翻译： 半导体封装包括多个第一引线，每个第一引线具有从引线除去的顶部外部部分和外端，以及多个第二引线，每个引线具有从引线除去的底部外部部分和外部端部。 第一和第二引线沿着封装的边缘彼此交替。 此外，第一引线的外端沿着封装的边缘形成第一排，并且第二引线的外端沿着封装的边缘形成第二排。 在一个实施例中，第一和第二行彼此平行，并且密封剂覆盖第一和第二引线的至少一部分。

公开(公告)号：US20080199985A1

公开(公告)日：2008-08-21

申请号：US12113968

申请日：2008-05-02

申请人： Danny Vallejo Retuta ,  Hien Boon Tan ,  Susanto Tanary ,  Anthony Yi Sheng Sun ,  Soon Huat James Tan

发明人： Danny Vallejo Retuta ,  Hien Boon Tan ,  Susanto Tanary ,  Anthony Yi Sheng Sun ,  Soon Huat James Tan

IPC分类号： H01L21/00

CPC分类号： H01L21/4842 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.

摘要翻译： 半导体封装包括多个第一引线，每个第一引线具有从引线除去的顶部外部部分和外端，以及多个第二引线，每个引线具有从引线除去的底部外部部分和外部端部。 第一和第二引线沿着封装的边缘彼此交替。 此外，第一引线的外端沿着封装的边缘形成第一排，并且第二引线的外端沿着封装的边缘形成第二排。 在一个实施例中，第一和第二行彼此平行，并且密封剂覆盖第一和第二引线的至少一部分。

公开(公告)号：US08115292B2

公开(公告)日：2012-02-14

申请号：US12604613

申请日：2009-10-23

申请人： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Anthony Yi Sheng Sun

发明人： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Anthony Yi Sheng Sun

IPC分类号： H01L23/02

CPC分类号： H01L21/563 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2203/043 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。

公开(公告)号：US20080054435A1

公开(公告)日：2008-03-06

申请号：US11846665

申请日：2007-08-29

申请人： Gaurav MEHTA ,  Hien Boon Tan ,  Susanto Tanary ,  Mary Annie Cheong ,  Anthony Sun ,  Chuen Wang

发明人： Gaurav MEHTA ,  Hien Boon Tan ,  Susanto Tanary ,  Mary Annie Cheong ,  Anthony Sun ,  Chuen Wang

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked die semiconductor package that includes a substrate with a plurality of adhesive portions arranged in a manner to create at least one gap between the adhesive portions. The package also includes a first semiconductor chip having a non-active surface in contact with the adhesive portions, and an active surface being electrically connected to the substrate. In the package, a second semiconductor chip the non-active surface of the second semiconductor chip is attached to the non-active surface of the first semiconductor chip by a layer of adhesive therebetween. The active surface of the second semiconductor chip is electrically connected to the substrate. An encapsulant material covers the first and second semiconductor chips and their associated electrical connections. The encapsulating material fills the at least one gap between the plurality of adhesive portions and thereby encapsulates the second semiconductor chip and its associated electrical connection.

摘要翻译： 一种堆叠半导体封装，其包括具有以在粘合剂部分之间形成至少一个间隙的方式布置的多个粘合剂部分的基板。 封装还包括具有与粘合剂部分接触的非活性表面的第一半导体芯片，以及与该基板电连接的有源表面。 在封装中，第二半导体芯片的第二半导体芯片的第二半导体芯片的非有效表面通过它们之间的粘合剂层附着到第一半导体芯片的非有效表面。 第二半导体芯片的有源表面与基板电连接。 密封剂材料覆盖第一和第二半导体芯片及其相关联的电连接。 封装材料填充多个粘合剂部分之间的至少一个间隙，从而封装第二半导体芯片及其相关联的电连接。

公开(公告)号：US20070246810A1

公开(公告)日：2007-10-25

申请号：US11406357

申请日：2006-04-19

申请人： Danny Retuta ,  Hien Tan ,  Susanto Tanary ,  Anthony Sun ,  Soon Tan

发明人： Danny Retuta ,  Hien Tan ,  Susanto Tanary ,  Anthony Sun ,  Soon Tan

IPC分类号： H01L23/02

CPC分类号： H01L21/4842 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.

摘要翻译： 半导体封装包括多个第一引线，每个第一引线具有从引线除去的顶部外部部分和外端，以及多个第二引线，每个引线具有从引线除去的底部外部部分和外部端部。 第一和第二引线沿着封装的边缘彼此交替。 此外，第一引线的外端沿着封装的边缘形成第一排，并且第二引线的外端沿着封装的边缘形成第二排。 在一个实施例中，第一和第二行彼此平行，并且密封剂覆盖第一和第二引线的至少一部分。

公开(公告)号：US20070069371A1

公开(公告)日：2007-03-29

申请号：US11536635

申请日：2006-09-28

申请人： Henry IKSAN ,  Seong Kwang Brandon KIM ,  Susanto TANARY ,  Hien Boon TAN ,  Yi Sheng Anthony SUN

发明人： Henry IKSAN ,  Seong Kwang Brandon KIM ,  Susanto TANARY ,  Hien Boon TAN ,  Yi Sheng Anthony SUN

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.

摘要翻译： 用于IC的封装件包括具有形成在其中一个主表面上的空腔的载体。 半导体管芯的撞击件与位于腔体底部的接触焊盘配合。 模具附接到载体的主表面。 主表面形成一个支架，通过粘合剂将芯片牢固地固定在一起。

公开(公告)号：US08772921B2

公开(公告)日：2014-07-08

申请号：US13347683

申请日：2012-01-10

申请人： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Yi Sheng Anthony Sun

发明人： Chin Hock Toh ,  Yao Huang Huang ,  Ravi Kanth Kolan ,  Wei Liang Yuan ,  Susanto Tanary ,  Yi Sheng Anthony Sun

IPC分类号： H01L23/02

CPC分类号： H01L21/563 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2203/043 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

摘要翻译： 介绍了插件。 插入器包括具有第一和第二表面的插入器基座。 再分配层设置在插入器基座的第一表面上。 插入器具有耦合到再分配层的至少一个插入器焊盘。 它还包括在第二表面上的至少一个中介层接触。 插入器触点通过再分配层电耦合到插入器衬垫。 插入器还包括通过插入器基座的至少一个插入器，用于将插入器触点耦合到再分配层。 插入器通孔包括内插器接触件的回流导电材料。