CHIP FOR INTEGRATED TUMOR CELL BEHAVIOR EXPERIMENTS

    公开(公告)号:US20240018452A1

    公开(公告)日:2024-01-18

    申请号:US18026325

    申请日:2020-12-30

    CPC classification number: C12M21/08 C12M23/34 C12N2513/00

    Abstract: An chip for integrated tumor cell behavior experiments, which comprises a functional area I, a functional area II, a functional area III, a functional area IV and a functional area V, wherein the functional area I comprises a cell invasion 3D co-culture plate (400) for cell invasion experiments; the functional area II comprises a cell migration culture hole (500) for cell migration experiments; the functional area III comprises a cell proliferation single-cell culture hole (600) for tumor single-cell culture; the functional area IV comprises an angiogenesis 3D co-culture plate (700) for tumor-related angiogenesis experiments; and the functional area V comprises a tumor single-cell culture hole (803), a matrix glue groove (805) and a tumor cell attraction factor hole (801) connected by matrix glue for tumor single-cell migration or invasion experiments. The single-cell culture, micro-fluidic and 3D culture techniques are comprehensively used in the chip, such that the experiment process is obviously simplified, the experiment efficiency is improved, and the obtained experiment result has a higher accuracy and repeatability.

    APPARATUS AND METHOD FOR DETECTING ARRAY SUBSTRATE
    3.
    发明申请
    APPARATUS AND METHOD FOR DETECTING ARRAY SUBSTRATE 有权
    用于检测阵列基板的装置和方法

    公开(公告)号:US20110090502A1

    公开(公告)日:2011-04-21

    申请号:US12907416

    申请日:2010-10-19

    CPC classification number: G09G3/006 G02F2001/136254 G09G3/3611

    Abstract: An apparatus for detecting an array substrate, comprising: a transparent carrier for supporting an array substrate to be detected thereon; a light source disposed on one side of the transparent carrier; a modulator disposed on the other side of the transparent carrier in parallel with the transparent carrier, and comprising a liquid crystal layer and two transparent substrate layers disposed on both sides of the liquid crystal layers, wherein one transparent substrate layer away from the transparent carrier is a first transparent conductive substrate layer, and a second polarizer is disposed on the first transparent conductive substrate layer; a first polarizer, disposed between the light source and the transparent carrier, so that the light emitted from the light source is transmitted through the first polarizer to radiate on the transparent carrier; and a light receiver receiving the light emitted from the light source and then transmitted through the transparent carrier, the array substrate to be detected and the modulator.

    Abstract translation: 一种用于检测阵列基板的装置,包括:用于支撑待检测阵列基板的透明载体; 设置在透明载体的一侧的光源; 与透明载体平行设置在透明载体的另一侧的调制器,包括液晶层和设置在液晶层两侧的两个透明基板层,其中离开透明载体的一个透明基板层是 第一透明导电基板层和第二偏光片设置在第一透明导电基板层上; 第一偏振器,设置在光源和透明载体之间,使得从光源发射的光透射穿过第一偏振器以辐射在透明载体上; 以及光接收器,接收从光源发射的光,然后透过透明载体,要检测的阵列基板和调制器。

    Integrated Heat Sink and Optical Transceiver Including the Same

    公开(公告)号:US20190113698A1

    公开(公告)日:2019-04-18

    申请号:US15787492

    申请日:2017-10-18

    Abstract: Embodiments of the disclosure pertain to an optical or optoelectronic transceiver comprising an optical or optoelectronic receiver, an optical or optoelectronic transmitter, a plurality of electrical devices, a housing, and a heat sink having a non-planar surface. The optical or optoelectronic receiver includes a receiver optical subassembly (ROSA). The optical or optoelectronic transmitter includes a transmitter optical subassembly (TOSA). The electrical devices are configured to provide or control one or more functions of the optical or optoelectronic receiver and the optical or optoelectronic transmitter. The housing is over and/or enclosing the optical or optoelectronic receiver and the optical or optoelectronic transmitter. The housing includes a first section and a second section, and is configured to (a) be removably insertable into a cage or socket of a host device and (b) position the first section of the housing outside the cage or socket when the housing is inserted in the cage or socket. The heat sink is over or adjacent to the first section of the housing and is in thermal contact with the housing.

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