公开(公告)号：US20070158835A1

公开(公告)日：2007-07-12

申请号：US11332566

申请日：2006-01-12

申请人： Jian-Hong Lin ,  Hsueh-Chung Chen ,  Yi-Lung Cheng ,  Ta-Wei Lee ,  Chih-Tao Lin ,  Jyh-Kang Ting ,  Lee-Chung Lu

发明人： Jian-Hong Lin ,  Hsueh-Chung Chen ,  Yi-Lung Cheng ,  Ta-Wei Lee ,  Chih-Tao Lin ,  Jyh-Kang Ting ,  Lee-Chung Lu

IPC分类号： H01L23/48

CPC分类号： H01L23/5226 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method is disclosed for determining a size of an interconnect between a first and a second conductor respectively in two layers of an integrated circuit while scaling from a reference processing technology to a predetermined processing technology. The method comprises selecting a set of design rules for the conductors based on the predetermined processing technology, determining a length of a first side of a rectangular cross sectional area of the interconnect based on the design rules and a scaling rule for scaling such a length from the reference processing technology to the predetermined processing technology, and determining a length of a second side of the cross sectional area of the interconnect for compensating an increase of a resistance of the interconnect due to the scaling from the reference processing technology to the predetermined processing technology.

摘要翻译： 公开了一种用于在从参考处理技术缩放到预定处理技术的同时，分别在集成电路的两层中确定第一和第二导体之间的互连尺寸的方法。 该方法包括基于预定的处理技术来选择一组导体的设计规则，基于设计规则确定互连的矩形横截面积的第一侧的长度，以及用于缩放这种长度的缩放规则 将参考处理技术应用于预定处理技术，以及确定互连横截面积的第二侧的长度，以补偿由于从参考处理技术到预定处理技术的缩放而导致的互连电阻的增加 。