公开(公告)号：US08004845B2

公开(公告)日：2011-08-23

申请号：US12241052

申请日：2008-09-30

申请人： Jian-Ping Yu ,  Cui-Jun Lu

发明人： Jian-Ping Yu ,  Cui-Jun Lu

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T24/42 ,  H01L2924/00

摘要： A fastening assembly used for securing a heat dissipation device to a printed circuit board, comprises a sleeve, an inserting device extending through the sleeve, a spring encircling the inserting device and received in the sleeve, and a supporting device inserted in the sleeve. The inserting device engages with a back plate below the printed circuit board. The sleeve is integrally formed of plastic and comprises a hollow body, a resilient portion extending from an outer surface of the body and pressing a bottom of the heat dissipation device upwardly, and four supporting portions extending from the outer surface of the body and pressing a top of the heat dissipation device downwardly. The supporting device is inserted between the body and the resilient portion, and abuts against the resilient portion, to thereby reliably keep the resilient portion at its locked position.

摘要翻译： 用于将散热装置固定到印刷电路板上的紧固组件包括套筒，穿过套筒延伸的插入装置，围绕插入装置的弹簧并被套在套筒中，以及插入套筒中的支撑装置。 插入装置与印刷电路板下面的背板接合。 套筒由塑料一体形成，包括中空体，弹性部分从主体的外表面延伸并向上按压散热装置的底部;以及四个支撑部分，从主体的外表面延伸并按压 散热装置的顶部向下。 支撑装置插入在主体和弹性部分之间，并抵靠弹性部分，从而可靠地将弹性部分保持在其锁定位置。

公开(公告)号：US07701718B2

公开(公告)日：2010-04-20

申请号：US12235611

申请日：2008-09-23

申请人： Jian-Ping Yu ,  Cui-Jun Lu

发明人： Jian-Ping Yu ,  Cui-Jun Lu

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H01L23/467 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink assembly includes a base, a fin group located above a top of the base, a mounting bracket, and a fan mounted on a lateral side of the mounting bracket. The mounting bracket is integrally formed by a metal sheet. The mounting bracket includes a pedestal is located at a top of the base and connects with the base, and two sidewalls extending upwardly from opposite ends of the pedestal and sandwiching the fin group therebetween. The fan is mounted on a lateral side of the sidewalls of the mounting bracket. The pedestal integrally forms four mounting arms. Four fasteners extend through the mounting arms for securing the heat sink assembly to a printed circuit board.

摘要翻译： 散热器组件包括基座，位于基座顶部上方的翅片组，安装支架和安装在安装支架的侧面上的风扇。 安装支架由金属板一体形成。 安装支架包括基座，其位于基座的顶部并且与底座连接，并且两个侧壁从基座的相对端部向上延伸并将翅片组夹在其间。 风扇安装在安装支架侧壁的侧面。 基座一体形成四个安装臂。 四个紧固件延伸穿过安装臂，用于将散热器组件固定到印刷电路板。

公开(公告)号：US07746651B2

公开(公告)日：2010-06-29

申请号：US11831932

申请日：2007-07-31

申请人： Jian-Ping Yu ,  Dong-Yun Li ,  Wei Wu

发明人： Jian-Ping Yu ,  Dong-Yun Li ,  Wei Wu

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00 ,  A47B97/00

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  Y10T24/44034 ,  Y10T24/44556 ,  H01L2924/00

摘要： A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.

摘要翻译： 散热器组件包括散热器和用于将散热器安装到印刷电路板的电子部件的夹子。 散热器包括基部和从基部延伸的多个翅片。 该夹子包括一个按压件和一对形成在按压件相对两端上的细长臂。 按压构件具有朝向散热器的基部突出的下部。 翅片的中间一个以使得按压构件的下部弹性地抵靠散热器的方式向上延伸穿过按压构件。 两个臂位于散热器的相对侧面上并向下弯曲以与印刷电路板接合，使得按压构件朝向电子部件施加力。

公开(公告)号：US08149580B2

公开(公告)日：2012-04-03

申请号：US12755434

申请日：2010-04-07

申请人： Jian-Ping Yu ,  Jian Zhang

发明人： Jian-Ping Yu ,  Jian Zhang

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device adapted for cooling an electronic device mounted on a printed circuit board comprises a base plate adapted for being thermally attached to the electronic device and a clip attached on a top face of the base plate. The base plate comprises two protruding poles protruding downwardly from a bottom face thereof. The protruding poles are capable of extending through the printed circuit board, thereby establishing a location for the heat dissipation device on the printed circuit board. The clip fastens the heat dissipation device on the printed circuit board after the location for the heat dissipation device on the printed circuit board has been established.

摘要翻译： 适于冷却安装在印刷电路板上的电子装置的散热装置包括适于热连接到电子装置的基板和附接在基板顶面上的夹子。 基板包括从其底面向下突出的两个突出极。 突出的极能够延伸穿过印刷电路板，从而建立印刷电路板上的散热装置的位置。 在印刷电路板上的散热装置的位置已经建立之后，夹子将散热装置固定在印刷电路板上。

公开(公告)号：US07764500B2

公开(公告)日：2010-07-27

申请号：US11849128

申请日：2007-08-31

申请人： Dong-Yun Li ,  Wei Wu ,  Jian-Ping Yu

发明人： Dong-Yun Li ,  Wei Wu ,  Jian-Ping Yu

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.

摘要翻译： 电子系统包括外壳，外壳中的印刷电路板和包括保持构件的散热器组件。 所述外壳包括第一面板和与所述第一面板垂直连接的第二面板。 印刷电路板安装在外壳的第一个面板上。 散热器组件具有安装在印刷电路板上的第一端，用于接触印刷电路板上的发热电子器件和与第一端相对的第二端。 保持构件将外壳的第二面板与散热器组件的第二端连接。

公开(公告)号：US07965513B2

公开(公告)日：2011-06-21

申请号：US12695161

申请日：2010-01-28

申请人： Jian Zhang ,  Jian-Ping Yu

发明人： Jian Zhang ,  Jian-Ping Yu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/12 ,  F28F1/24 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink mounted on the printed circuit board and a heat pipe pivotably engaged with the heat sink. The heat sink includes a main body defining a transverse channel therethrough and an injection aperture at a top of the main body to communicate the channel and an exterior of the main body. The heat pipe is pivotably engaging in the channel of the main body. A gap is defined between the heat pipe and the heat sink. Heat conductive grease is injected into the channel and filled in the gap between the heat pipe and the heat sink to thermally connect the heat sink with the heat pipe.

摘要翻译： 示例性电子设备组件包括其上具有电子部件的印刷电路板和散热装置。 散热装置包括安装在印刷电路板上的散热器和与散热器可枢转地接合的热管。 散热器包括限定穿过其的横向通道的主体和在主体顶部的注入孔，用于连通通道和主体的外部。 热管可枢转地接合在主体的通道中。 在热管和散热器之间限定了间隙。 将导热油脂注入通道并填充在热管和散热器之间的间隙中以将散热器与热管热连接。