PHASE-CHANGE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
    2.
    发明申请
    PHASE-CHANGE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME 有权
    相变存储器件及其制造方法

    公开(公告)号:US20120007032A1

    公开(公告)日:2012-01-12

    申请号:US12962183

    申请日:2010-12-07

    IPC分类号: H01L45/00 H01L21/02

    摘要: A phase-change memory device with improved deposition characteristic and a method of fabricating the same are provided. The phase-change memory device includes a semiconductor substrate having a phase-change area, a first material-rich first phase-change layer forming an inner surface of the phase-change area and comprised of a hetero compound of the first material and a second material, and a second phase-change layer formed on a surface of the first phase-change layer to fill the phase-change area.

    摘要翻译: 提供了具有改进的沉积特性的相变存储器件及其制造方法。 相变存储器件包括具有相变区域的半导体衬底,形成相变区域的内表面的第一富含材料的第一相变层,并且由第一材料的杂化合物和第二材料组成 材料和形成在第一相变层的表面上以填充相变区域的第二相变层。

    Phase-change memory device and method of fabricating the same
    3.
    发明授权
    Phase-change memory device and method of fabricating the same 有权
    相变存储器件及其制造方法

    公开(公告)号:US08508021B2

    公开(公告)日:2013-08-13

    申请号:US12962183

    申请日:2010-12-07

    IPC分类号: H01L45/00

    摘要: A phase-change memory device with improved deposition characteristic and a method of fabricating the same are provided. The phase-change memory device includes a semiconductor substrate having a phase-change area, a first material-rich first phase-change layer forming an inner surface of the phase-change area and comprised of a hetero compound of the first material and a second material, and a second phase-change layer formed on a surface of the first phase-change layer to fill the phase-change area.

    摘要翻译: 提供了具有改进的沉积特性的相变存储器件及其制造方法。 相变存储器件包括具有相变区域的半导体衬底,形成相变区域的内表面的第一富含材料的第一相变层,并且由第一材料的杂化合物和第二材料组成 材料和形成在第一相变层的表面上以填充相变区域的第二相变层。

    Semiconductor device and method of fabricating the same
    4.
    发明授权
    Semiconductor device and method of fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US09112137B2

    公开(公告)日:2015-08-18

    申请号:US13599489

    申请日:2012-08-30

    IPC分类号: H01L45/00

    摘要: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a semiconductor substrate in which a word line region is formed, and a barrier metal layer arranged on the word line region and causing a Schottky junction. The barrier metal layer includes a first nitride material, in which a first material is nitrified, and a second nitride material, in which a second material is nitrified. The barrier metal layer is formed of a mixture of the first nitride material and the second nitride material. At least one of the first material or the second material is rich in a metal used to form the first nitride material or the second nitride material.

    摘要翻译: 提供半导体器件及其制造方法。 半导体器件包括其中形成字线区域的半导体衬底和布置在字线区域上并形成肖特基结的势垒金属层。 阻挡金属层包括其中第一材料被硝化的第一氮化物材料和第二材料被硝化的第二氮化物材料。 阻挡金属层由第一氮化物材料和第二氮化物材料的混合物形成。 第一材料或第二材料中的至少一种富含用于形成第一氮化物材料或第二氮化物材料的金属。

    Semiconductor device having resistive device
    5.
    发明授权
    Semiconductor device having resistive device 有权
    具有电阻器件的半导体器件

    公开(公告)号:US08344346B2

    公开(公告)日:2013-01-01

    申请号:US13073521

    申请日:2011-03-28

    IPC分类号: H01L29/02 H01L29/06 G11C11/00

    摘要: A semiconductor memory device includes a plurality of word lines vertically formed on a surface of a semiconductor substrate, where each pair of the plurality of word lines form a set of word lines, a bit line formed parallel to the surface of the semiconductor substrate and disposed in plurality stacked between the word lines of each pair constituting the one set of word lines, and unit memory cells disposed between respective ones of the bit lines and an adjacent one of the pair of word lines of said one of the word line sets.

    摘要翻译: 半导体存储器件包括垂直形成在半导体衬底的表面上的多个字线,其中每对多条字线形成一组字线,平行于半导体衬底的表面形成的位线, 多个堆叠在构成所述一组字线的每一对的字线之间,以及设置在所述一个字线组中的所述位线中的相应位线与所述一对字线中的相邻一个之间的单元存储单元。

    Method of manufacturing a phase change memory device using a cross patterning technique
    6.
    发明授权
    Method of manufacturing a phase change memory device using a cross patterning technique 有权
    使用交叉图案化技术制造相变存储器件的方法

    公开(公告)号:US08349636B2

    公开(公告)日:2013-01-08

    申请号:US12834141

    申请日:2010-07-12

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a phase change memory device is provided. A first insulating layer having a plurality of metal word lines spaced apart at a constant distance is formed on a semiconductor substrate. A plurality of line structures having a barrier metal layer, a polysilicon layer and a hard mask layer are formed to be overlaid on the plurality of metal word lines. A second insulating layer is formed between the line structures. Cross patterns are formed by etching the hard mask layers and the polysilicon layers of the line structures using mask patterns crossed with the metal word lines. A third insulating layer is buried within spaces between the cross patterns. Self-aligned phase change contact holes are formed and at the same time, diode patterns formed of remnant polysilicon layers are formed by selectively removing the hard mask layers constituting the cross patterns.

    摘要翻译: 提供一种制造相变存储器件的方法。 在半导体衬底上形成具有以恒定距离隔开的多个金属字线的第一绝缘层。 形成具有阻挡金属层,多晶硅层和硬掩模层的多个线结构以覆盖在多个金属字线上。 在线路结构之间形成第二绝缘层。 通过使用与金属字线交叉的掩模图案蚀刻线结构的硬掩模层和多晶硅层来形成交叉图案。 第三绝缘层埋在交叉图案之间的空间内。 形成自对准的相变接触孔,同时,通过选择性地去除构成交叉图案的硬掩模层,形成由剩余多晶硅层形成的二极管图案。

    SEMICONDUCTOR DEVICE HAVING RESISTIVE DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE HAVING RESISTIVE DEVICE 有权
    具有电阻器件的半导体器件

    公开(公告)号:US20120153247A1

    公开(公告)日:2012-06-21

    申请号:US13073521

    申请日:2011-03-28

    IPC分类号: H01L45/00

    摘要: A semiconductor memory device includes a plurality of word lines vertically formed on a surface of a semiconductor substrate, where each pair of the plurality of word lines form a set of word lines, a bit line formed parallel to the surface of the semiconductor substrate and disposed in plurality stacked between the word lines of each pair constituting the one set of word lines, and unit memory cells disposed between respective ones of the bit lines and an adjacent one of the pair of word lines of said one of the word line sets.

    摘要翻译: 半导体存储器件包括垂直形成在半导体衬底的表面上的多个字线,其中每对多条字线形成一组字线,平行于半导体衬底的表面形成的位线, 多个堆叠在构成所述一组字线的每一对的字线之间,以及设置在所述一个字线组中的所述位线中的相应位线与所述一对字线中的相邻一个之间的单元存储单元。

    METHOD OF MANUFACTURING PHASE-CHANGE RANDOM ACCESS MEMORY
    8.
    发明申请
    METHOD OF MANUFACTURING PHASE-CHANGE RANDOM ACCESS MEMORY 审中-公开
    制造相变随机存取存储器的方法

    公开(公告)号:US20120009731A1

    公开(公告)日:2012-01-12

    申请号:US13178804

    申请日:2011-07-08

    IPC分类号: H01L21/62

    摘要: A method of a phase-change random access memory (PCRAM) device is provided. The method includes forming a heat pad on a substrate, forming a phase-change material layer by injecting a deposition gas for a phase-change material and a reaction gas on the heat pad, where the phase-change material includes tellurium (Te), forming an upper electrode electrically connected to the phase-change material layer, where the tellurium (Te) is added at a ratio smaller than a normal chemical stoichiometric ratio of materials constituting the phase-change material layer.

    摘要翻译: 提供了一种相变随机存取存储器(PCRAM)装置的方法。 该方法包括在基板上形成加热垫,通过在相对变化的材料包括碲(Te)的热垫上注入用于相变材料的沉积气体和反应气体来形成相变材料层, 形成与相变材料层电连接的上电极,其中以比构成相变材料层的材料的正常化学计量比小的比例添加碲(Te)。