公开(公告)号：US20140001613A1

公开(公告)日：2014-01-02

申请号：US13603654

申请日：2012-09-05

Applicant: Job HA

Inventor： Job HA

IPC: H01L23/495

CPC classification number: H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/4334 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49586 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: There is provided semiconductor package including: an internal lead having at least one electronic component mounted on a surface thereof; a heat sink disposed below the internal lead; a molded portion sealing the at least one electronic component, the internal lead and the heat sink; an external lead extended from the internal lead and protruding outwardly from the molded portion in a radial direction; a heat radiating member attached to the heat sink and a surface of the molded portion; and an insulating coating film formed on a surface of the external lead.

Abstract translation: 提供的半导体封装包括：具有安装在其表面上的至少一个电子部件的内部引线; 设置在内部引线下方的散热器; 密封所述至少一个电子部件，所述内部引线和所述散热器的模制部分; 外部引线从内部引线延伸并在径向方向上从模制部分向外突出; 附接到所述散热器的散热构件和所述模制部分的表面; 以及形成在外部引线的表面上的绝缘涂膜。