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公开(公告)号：US06568991B2
公开(公告)日：2003-05-27
申请号：US09941110
申请日：2001-08-28
申请人： John D. Herb , Ned W. Teeny , Stephen C. Schultz
发明人： John D. Herb , Ned W. Teeny , Stephen C. Schultz
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B37/0053 , B24B49/10 , H01L21/67265 , H01L21/6838
摘要： The invention is a carrier that determines if a wafer has been properly loaded. The carrier includes a body having a cavity covered by a membrane, thereby forming an initial plenum. One or more annular ribs may extend from the body to the membrane to divide the initial plenum into a plurality of plenums. A sensor is positioned within one of the plenums to detect the presence of the wafer. Pump(s) with pressure regulators may be used to pressurize the plenum(s). A first plenum may be pressurized sufficient to hold the wafer to the membrane by creating a partial vacuum between the membrane and the wafer. A second plenum may be pressurized sufficient to urge the membrane away from the sensor if the wafer is not properly loaded in the carrier. If the membrane is near the sensor, the wafer has been properly loaded into the carrier.
摘要翻译： 本发明是确定晶片是否已被正确加载的载体。 载体包括具有被膜覆盖的空腔的主体，从而形成初始增压室。 一个或多个环形肋可以从主体延伸到膜以将初始增压室分成多个增压室。 传感器位于一个通风室内以检测晶片的存在。 带压力调节器的泵可以用于对集气室加压。 可以通过在膜和晶片之间产生部分真空来将第一增压室加压以将晶片保持在膜上。 如果晶片没有被适当地装载在载体中，则第二增压室可被加压以足以将膜推离传感器。 如果膜靠近传感器，则晶片已经被适当地加载到载体中。
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公开(公告)号：US07140956B1
公开(公告)日：2006-11-28
申请号：US11324038
申请日：2005-12-29
IPC分类号： B24B20/00
CPC分类号： B24B37/30 , B24B41/061
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
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公开(公告)号：US06878039B2
公开(公告)日：2005-04-12
申请号：US10058743
申请日：2002-01-28
CPC分类号： B24B37/205 , B24B37/26
摘要： A polishing pad assembly for use in a chemical-mechanical polishing apparatus comprises a polishing pad having at least a first aperture therethrough and a platen for supporting the polishing pad having a second aperture therethrough at least a portion of which is larger than the first aperture. A substantially transparent plug includes at least a first section having a first dimension for positioning substantially within the first aperture and at least a second section having a second dimension larger than the first dimension for positioning substantially within the second aperture. The optical plug is made of a polymeric material which may be press-fit through the platen into polishing pad.
摘要翻译： 用于化学 - 机械抛光装置的抛光垫组件包括具有穿过其中的至少第一孔的抛光垫和用于支撑抛光垫的压板，其具有穿过其中的至少一部分大于第一孔的第二孔。 基本上透明的插头包括至少第一部分，其具有用于基本上位于第一孔内的第一尺寸，以及具有大于第一尺寸的第二尺寸的第二部分，用于基本上位于第二孔内。 光学插头由聚合物材料制成，其可以通过压板压配合到抛光垫中。
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公开(公告)号：US06659850B2
公开(公告)日：2003-12-09
申请号：US10120600
申请日：2002-04-11
IPC分类号： B24B2900
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
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公开(公告)号：US06390905B1
公开(公告)日：2002-05-21
申请号：US09540476
申请日：2000-03-31
IPC分类号： B24B2900
摘要： An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process. A method for practicing the present invention starts by selecting a carrier with adjustable pressure zones that correspond to the number and locations of the bulges and troughs on the wafer. Zones that correspond to high regions receive greater pressure than zones that correspond to low regions on the wafer. The pressure on the barriers between zones may be optimized to prevent leakage between zones or to smooth the pressure distribution between neighboring zones on the back surface of the wafer.
摘要翻译： 公开了一种用于在载体中平坦化晶片的装置和方法，其具有可调节的压力区域和区域之间的可调节的屏障。 载体具有独立控制的中心区域和同心的周围区域，用于在晶片在化学机械抛光工具中被压靠在磨料表面上时分配晶片背面的压力。 可以通过将弹性腹板隔膜安装到具有多个凹部的托架壳体上来产生压力区域。 相应的多个弹性环形肋可以从腹板隔膜相对于凹部延伸。 因此，多个环形肋限定了由一个或多个同心周围区域包围的中心区域。 通过在平坦化过程中利用相应的流体连通路径可以单独加压区域和障碍物。一种用于实施本发明的方法开始于选择具有可调压力区域的载体，其对应于晶片上的凸起和凹槽的数量和位置 。 对应于高区域的区域比对应于晶片上的低区域的区域承受更大的压力。 可以优化区域之间的屏障上的压力，以防止区域之间的泄漏或者平滑晶片背表面上的相邻区域之间的压力分布。
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6.发明授权Carrier having pistons for distributing a pressing force on the back surface of a workpiece 失效载体具有用于在工件的后表面上分布按压力的活塞公开(公告)号：US06336853B1
公开(公告)日：2002-01-08
申请号：US09541414
申请日：2000-03-31
IPC分类号： B24B500
CPC分类号： B24B37/30
摘要： An apparatus and method are disclosed for a carrier that is able to create independently controllable pressure zones on the back surface of a wafer while the front surface of the wafer is being planarizing against an abrasive surface. The carrier has a central disk shaped recess surrounded by a plurality of concentric ring shaped recesses. The recesses are covered by a diaphragm thereby creating a central disk shaped plenum and a plurality of surrounding ring shaped plenums. A central disk shaped piston and a plurality of surrounding ring shaped pistons are suspended on the diaphragm so that a portion of each piston may move in and out of their corresponding plenum in the carrier. An independently controllable fluid communication path is placed in fluid communication with each plenum thereby allowing the pressure exerted on each piston to be independently controllable.
摘要翻译： 公开了一种用于载体的装置和方法，其能够在晶片的背面上创建独立可控的压力区，同时晶片的前表面正对着研磨表面进行平面化。 载体具有由多个同心环形凹部包围的中心盘状凹部。 凹槽由隔膜覆盖，从而形成中央盘形集气室和多个周围的环形气室。 中心圆盘形活塞和多个周围的环形活塞悬挂在隔膜上，使得每个活塞的一部分可以在载体中进出其相应的气室。 独立可控的流体连通路径被放置成与每个通风室流体连通，从而允许施加在每个活塞上的压力是独立可控的。
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公开(公告)号：US07040957B2
公开(公告)日：2006-05-09
申请号：US10642313
申请日：2003-08-14
申请人： Stephen C. Schultz , John D. Herb , Dave Marquardt
发明人： Stephen C. Schultz , John D. Herb , Dave Marquardt
CPC分类号： B24B37/205 , B24B49/12
摘要： In a chemical mechanical wafer processing apparatus, a platen for supporting a polishing pad, a manifold for delivering a chemical to the platen, a workpiece substantially in contact with a polishing pad supported by the platen, a light transmission medium for transmitting and receiving light to and from the workpiece, one end of the medium being substantially flush with the top of the polishing pad, the other end of the transmission medium having a hollow portion for receiving a light transmitting and receiving probe, thereby providing a light transmitting and receiving probe in close proximity to the workpiece. The platen and manifold of the apparatus are substantially of non-metallic material and may be joined by spaced clamps and latches.
摘要翻译： 在化学机械晶片处理装置中，用于支撑抛光垫的压板，用于将化学品输送到压板的歧管，与由压板支撑的抛光垫基本上接触的工件，用于发射和接收光的光传输介质 并且从工件开始，介质的一端与抛光垫的顶部基本齐平，传输介质的另一端具有用于接收光发射和接收探头的中空部分，由此提供光传输和接收探头 靠近工件。 设备的压板和歧管基本上是非金属材料，并且可以通过间隔开的夹子和闩锁连接。
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公开(公告)号：US06599175B2
公开(公告)日：2003-07-29
申请号：US09923172
申请日：2001-08-06
申请人： John D. Herb , Stephen C. Schultz
发明人： John D. Herb , Stephen C. Schultz
IPC分类号： B24B2900
摘要： A fluid delivery system is provided for delivering a fluid to a polishing surface of a chemical mechanical polishing tool. The system includes a polishing pad having a plurality of apertures, a plurality of layers having a network of grooves and a platen having an aperture. A fluid may be communicated to the aperture in the platen, through the grooves in the plurality of layers and finally through the plurality of apertures in the polishing pad. The size, position and number of apertures in the platen and the polishing pad and the size, position and number of grooves in each of the layers may be varied to control the distribution of fluid across the top surface of the polishing pad. Preferably, the distance a fluid must travel from the platen aperture through the grooves to any of the apertures in the polishing pad is substantially the same.
摘要翻译： 提供流体输送系统用于将流体输送到化学机械抛光工具的抛光表面。 该系统包括具有多个孔的抛光垫，具有凹槽网络的多个层和具有孔的压板。 流体可以通过多个层中的槽并最终通过抛光垫中的多个孔而传递到压板中的孔。 可以改变压板和抛光垫中的孔的尺寸，位置和数量以及每个层中的槽的尺寸，位置和数量，以控制流过抛光垫顶表面的流体分布。 优选地，流体必须从压板孔穿过凹槽移动到抛光垫中的任何孔的距离基本相同。
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9.发明授权Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor 有权载体包括用于研磨半导体晶片的多体积膜片及其方法公开(公告)号：US06447379B1
公开(公告)日：2002-09-10
申请号：US09541753
申请日：2000-03-31
IPC分类号： B24B500
CPC分类号： B24B37/30
摘要： The present invention delineates a carrier for an apparatus (10) which polishes a surface of a semiconductor wafer (56, 124). In a preferred embodiment, the carrier includes a rigid plate (34) connected to one or more diaphragms (40, 42) of soft, flexible material that provide pressurizable cavities (50, 52) having respective surfaces for contacting the back surface of the wafer. A plurality of conduits (28a, 28c) are used to selectively pressurize the diaphragm cavities. The carrier head may also include an inter-diaphragm cavity (54) formed between a portion of one diaphragm, a portion of another diaphragm, and the semiconductor wafer. The inter-diaphragm cavity is provided with its own conduit (28b) by which a source of pressurized fluid and a source of vacuum are selectively connected to the inter-diaphragm cavity. During operation, pressure and/or vacuum may be applied through one or more cavities to chuck (90) a wafer, and to pressurize (96) the cavities during polishing.
摘要翻译： 本发明描绘了对半导体晶片（56,124）的表面进行抛光的装置（10）的载体。 在优选实施例中，载体包括连接到柔性柔性材料的一个或多个隔膜（40,42）的刚性板（34），其提供具有用于接触晶片的后表面的相应表面的可加压空腔（50,52） 。 多个导管（28a，28c）用于选择性地对隔膜腔加压。 载体头还可以包括形成在一个隔膜的一部分，另一个隔膜的一部分和半导体晶片之间的隔膜间腔体（54）。 隔膜间腔设置有自己的导管（28b），通过该导管（28b），加压流体源和真空源选择性地连接到隔膜间腔。 在操作期间，压力和/或真空可以通过一个或多个空腔施加以卡盘（90）晶片，并且在抛光期间加压（96）空腔。
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10.发明授权公开(公告)号：US07025664B2
公开(公告)日：2006-04-11
申请号：US10830412
申请日：2004-04-21
IPC分类号： B24B29/00
摘要： An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
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