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公开(公告)号：US5872025A
公开(公告)日：1999-02-16
申请号：US815452
申请日：1997-03-11
IPC分类号： H01L21/304 , H01L21/301 , H01L21/78 , H01L21/98 , H01L25/065 , H01L21/283 , H01L21/027 , H01L21/18 , H01L21/31
CPC分类号： H01L25/50 , H01L21/78 , H01L25/0657 , H01L2224/24145 , H01L2225/06513 , H01L2225/06541 , H01L2225/06551 , H01L2924/10253 , Y10S148/028 , Y10S438/977
摘要： Stacked three-dimensional devices can be prepared by stacking wafers as an alternative to stacking individual devices. Chip regions are formed on several wafers with each chip region being surrounded by a separation region, such as an insulator filled trench. The wafers are then stacked with the chip regions in alignment. Aligning the wafers can be facilitated using notched regions in the periphery of the wafers. The wafers are then joined together by lamination. After laminating the stacks of wafers, stacks of chips are separated by etching, dicing or other processes, which separate out stacked chip devices from the stacked wafer at the chip separation regions. The process allows several stacked chip devices to be manufactured simultaneously.
摘要翻译： 堆叠的三维器件可以通过堆叠晶片作为堆叠单个器件的替代物来制备。 芯片区域形成在几个晶片上，每个芯片区域被诸如绝缘体填充的沟槽之类的分离区域包围。 然后将晶片与芯片区域对准地堆叠。 可以利用晶片周边的切口区域来调整晶片对准。 然后通过层压将晶片连接在一起。 在堆叠晶片堆叠之后，通过蚀刻，切割或其它工艺来分离芯片堆叠，其在芯片分离区域将堆叠的芯片器件与堆叠晶片分开。 该过程允许同时制造几个堆叠的芯片器件。
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公开(公告)号：US06246583B1
公开(公告)日：2001-06-12
申请号：US09262267
申请日：1999-03-04
IPC分类号： H05K720
CPC分类号： H01L23/3675 , H01L23/3677 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/15312 , H01L2924/00014
摘要： An apparatus and method are provided that remove sufficient heat from both SOI and non-SOI semiconductor devices to prevent the devices from overheating during operation. A plurality of thermally conductive pads such as electrically conductive studs are coupled to a first side of a semiconductor device having circuit elements formed thereon. The thermally conductive pads also are coupled to a substrate comprising an apparatus for extracting heat from the thermally conductive pads. The apparatus for extracting heat from the thermally conductive pads preferably comprises one or more metallic planes. A module cover having a thermally conductive path formed therein also may be coupled between the apparatus for extracting heat and a heat sink to further aid in heat removal from the semiconductor device. Thermally conductive pads may be coupled between the semiconductor device and I/O pins of the substrate to improve heat dissipation via the I/O pins.
摘要翻译： 提供了一种装置和方法，其从SOI和非SOI半导体器件中去除足够的热量，以防止器件在工作期间过热。 诸如导电螺柱的多个导热焊盘耦合到其上形成有电路元件的半导体器件的第一侧。 导热焊盘还耦合到包括用于从导热焊盘提取热量的装置的衬底。 用于从导热垫提取热量的装置优选地包括一个或多个金属平面。 在其中形成有导热路径的模块盖也可以耦合在用于提取热量的设备和散热器之间，以进一步帮助从半导体器件散热。 导热焊盘可以耦合在半导体器件和衬底的I / O引脚之间，以改善通过I / O引脚的散热。
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公开(公告)号：US6156461A
公开(公告)日：2000-12-05
申请号：US504031
申请日：2000-02-14
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： B23K26/06 , G03F1/74 , H01L21/027 , G03S9/00
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
摘要翻译： 修复掩模上的缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射，激光烧蚀引起的石英点蚀，激光沉积染色和FIB引起的镓染色而对掩模的清晰区域的损害的步骤。 涂层是金属，聚合物或碳材料。 涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。 包含薄铜层的涂层显着地改善了用离子束的成像，同时保护掩模的清除区域不受FIB染色。 由光敏聚合物形成的涂层用于蚀刻不透明缺陷。 虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域，然后在随后的FIB沉积步骤中修复这些产生的明确缺陷，而铜涂层保护相邻的清晰区域免受FIB染色。 在另一个实施例中，用短脉冲持续时间激光修复不透明缺陷，而不损害下面的石英或相邻的透明区域，同时避免了涂层的需要。
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公开(公告)号：US06333546B1
公开(公告)日：2001-12-25
申请号：US09692539
申请日：2000-10-20
IPC分类号： H01L2900
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.
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公开(公告)号：US06190836B1
公开(公告)日：2001-02-20
申请号：US09561560
申请日：2000-04-28
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： G03C500
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
摘要翻译： 修复掩模上的缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射，激光烧蚀引起的石英点蚀，激光沉积染色和FIB引起的镓染色而对掩模的清晰区域的损害的步骤。 涂层是金属，聚合物或碳材料。 涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。 包含薄铜层的涂层显着地改善了用离子束的成像，同时保护掩模的清除区域不受FIB染色。 由光敏聚合物形成的涂层用于蚀刻不透明缺陷。 虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域，然后在随后的FIB沉积步骤中修复这些产生的明确缺陷，而铜涂层保护相邻的清晰区域免受FIB染色。 在另一个实施例中，用短脉冲持续时间激光修复不透明缺陷，而不损害下面的石英或相邻的透明区域，同时避免了涂层的需要。
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公开(公告)号：US4386729A
公开(公告)日：1983-06-07
申请号：US246473
申请日：1981-03-23
申请人： Dennis A. Schmidt
发明人： Dennis A. Schmidt
摘要： An octagonal container having a unique bottom closure and a blank therefor are provided. The body of the octagonal container includes a pair of major wall panels, a pair of minor wall panels, and four corner wall panels. Each major and minor wall panel is foldably connected to a corner wall panel on either side. In the preferred embodiment, one of the minor wall panels is formed from two pieces, which are secured in overlapping relation to one another. The closure section includes a pair of rectangular major cover flaps, a pair of rectangular minor cover flaps, and four polygonal corner flaps. Each major cover flap is foldably connected to a major wall panel. Each corner flap is foldably connected to a corner wall panel. Each minor cover flap is foldably connected to a minor wall panel. In the preferred embodiment, one of the minor cover flaps is formed from two pieces, which are fastened in overlapping relation to one another. Each minor cover flap features a pair of locking tabs which are coextensive with the minor cover flap and are defined by one or more slit lines. A central horizontal score line runs between the locking tabs. Each major cover flap features a pair of vertical slots aligned in parallel. The closure is formed by folding the corner flaps inward at right angles to the corner wall panels and then folding the major cover flaps inward at right angles to the major wall panels to overlie the corner flaps. The minor cover flaps are folded inward at right angles to the minor wall panels to overlie the major cover flaps. Finally, each minor cover flap is folded along its central horizontal score line to release the pair of locking tabs, and each locking tab is inserted into the corresponding slot in a major cover flap to form a secure, flat-bottomed closure.
摘要翻译： 提供具有独特的底部封闭件和其空白的八边形容器。 八角形容器的主体包括一对主要墙板，一对次要墙板和四个角壁板。 每个主墙和小墙板可折叠地连接到任一侧的角壁板。 在优选实施例中，其中一个小墙板由两块彼此重叠的关系固定。 封闭部分包括一对矩形主盖板，一对矩形小盖板和四个多边形角板。 每个主盖板可折叠地连接到主壁板。 每个角襟翼可折叠地连接到角落墙板。 每个小盖板可折叠地连接到次墙板。 在优选实施例中，一个小盖板由两个彼此重叠的紧固件形成。 每个小盖板具有一对锁定突片，其与较小盖板瓣共同延伸并由一条或多条狭缝线限定。 中央水平刻痕线在锁定片之间延伸。 每个主盖板具有一对平行排列的垂直槽。 封闭件通过将拐角折板与角壁板成直角向内折叠而形成，然后将主盖板与主壁板成直角向内折叠，以覆盖角襟翼。 小盖板与小墙板成直角折叠，以覆盖主盖板。 最后，每个小盖翼片沿其中心水平刻痕线折叠以释放一对锁定突片，并且每个锁定突片插入到主盖板中的相应槽中以形成牢固的平底盖。
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公开(公告)号：US06294453B1
公开(公告)日：2001-09-25
申请号：US09074353
申请日：1998-05-07
IPC分类号： H01L2144
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.
摘要翻译： 具有高熔点加热器元件的电激活保险丝，与低熔点可熔链节串联。 加热器元件具有比可熔连接件更高的电阻率和更大的横截面面积，以便承受加热器元件产生的热量，从而使熔断体熔化。 保险丝尺寸（宽度和长度）各自在0.1和2.0微米之间，加热器元件的热质量足以熔化可熔链节。
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公开(公告)号：US6165649A
公开(公告)日：2000-12-26
申请号：US786061
申请日：1997-01-21
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： B23K26/06 , G03F1/74 , H01L21/027 , G03F9/00
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
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公开(公告)号：US6090507A
公开(公告)日：2000-07-18
申请号：US261638
申请日：1999-03-03
申请人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
发明人： Brian J. Grenon , Richard A. Haight , Dennis M. Hayden , Michael S. Hibbs , J. Peter Levin , Timothy E. Neary , Raymond E. Rochefort , Dennis A. Schmidt , Jacek G. Smolinski , Alfred Wagner
IPC分类号： B23K26/06 , G03F1/74 , H01L21/027 , G03F9/00
CPC分类号： G03F1/74 , B23K26/0624
摘要： A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
摘要翻译： 修复掩模缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射，激光烧蚀引起的石英点蚀，激光沉积染色和FIB引起的镓染色而对掩模的透明区域的损害的步骤。 涂层是金属，聚合物或碳材料。 涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。 包含薄铜层的涂层显着地改善了用离子束的成像，同时保护掩模的清除区域不受FIB染色。 由光敏聚合物形成的涂层用于蚀刻不透明缺陷。 虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域，然后在随后的FIB沉积步骤中修复这些产生的明确缺陷，而铜涂层保护相邻的清晰区域免受FIB染色。 在另一个实施例中，用短脉冲持续时间激光修复不透明缺陷，而不损害下面的石英或相邻的透明区域，同时避免了涂层的需要。
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