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公开(公告)号：US07651373B2
公开(公告)日：2010-01-26
申请号：US12055854
申请日：2008-03-26
IPC分类号： H01R13/648
CPC分类号： H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.
摘要翻译： 电连接器包括限定连接器配合接口的壳体。 壳体保持多个接触模块，其协作以限定连接器安装界面。 每个接触模块包含信号引线和接地引线，它们以相对于接触模块的厚度并排定位的各个接地引线和信号引线的交替模式布置。 信号和接地引线具有靠近配合接口的相应匹配触头和靠近安装界面的相应安装触头。 每个触点模块内的配合和安装触头布置在与信号和接地引线图案不同的第一和第二触点图案之一中。 相邻接触模块中的配合和安装触点分别设置在第一和第二接触图形中的不同的接触图形中。
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公开(公告)号：US20100144201A1
公开(公告)日：2010-06-10
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US20100144167A1
公开(公告)日：2010-06-10
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US07976318B2
公开(公告)日：2011-07-12
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US07775802B2
公开(公告)日：2010-08-17
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US07927143B2
公开(公告)日：2011-04-19
申请号：US12474674
申请日：2009-05-29
申请人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
发明人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实施方案可以提供接地屏蔽和/或其他接地结构，其基本上将电连接器对（其可以是差分电连接器对）以三维方式贯穿整个背板占用面积，背板连接器和 子卡足迹。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US20100144175A1
公开(公告)日：2010-06-10
申请号：US12474674
申请日：2009-05-29
申请人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
发明人： David W. Helster , John E. Knaub , Peter C. O'Donnell , Timothy R. Minnick , Chad W. Morgan , Lynn R. Sipe
IPC分类号： H01R13/648 , H01R13/40
CPC分类号： H01R13/514 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US20100144174A1
公开(公告)日：2010-06-10
申请号：US12474605
申请日：2009-05-29
IPC分类号： H01R13/648 , H01R13/40
CPC分类号： H01R13/514 , H01R13/6471 , H01R13/6587 , H01R43/24
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US07819697B2
公开(公告)日：2010-10-26
申请号：US12474605
申请日：2009-05-29
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R13/6471 , H01R13/6587 , H01R43/24
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实施方案可以提供接地屏蔽和/或其他接地结构，其基本上将电连接器对（其可以是差分电连接器对）以三维方式贯穿整个背板占用面积，背板连接器和 子卡足迹。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US07690946B2
公开(公告)日：2010-04-06
申请号：US12181403
申请日：2008-07-29
IPC分类号： H01R12/00
CPC分类号： H01R12/724 , H01R13/514 , H01R13/6473 , H01R13/6587
摘要： A connector system includes a connector assembly and a contact organizer. The connector assembly includes a mounting end and a plurality of contacts protruding from the mounting end. The contact organizer includes a top side, a bottom side and a plurality of channels extending between the top and bottom sides. The contact organizer is movable with respect to the connector assembly between a supporting position and a seated position. When the contact organizer is in the supporting position, the contacts at least partially extend through the channels. When the contact organizer is moved to the supporting position, the contact organizer is moved toward the mounting end of the connector assembly until the top side of the contact organizer engages the mounting end.
摘要翻译： 连接器系统包括连接器组件和接触组织器。 连接器组件包括安装端和从安装端突出的多个触点。 接触管理器包括顶侧，底侧和在顶侧和底侧之间延伸的多个通道。 接触组织器可相对于连接器组件在支撑位置和就座位置之间移动。 当接触管理器处于支撑位置时，触头至少部分地延伸通过通道。 当接触组织器被移动到支撑位置时，接触组织器朝向连接器组件的安装端移动，直到接触组织器的顶侧接合安装端。
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