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公开(公告)号：US20110278057A1
公开(公告)日：2011-11-17
申请号：US13191695
申请日：2011-07-27
IPC分类号： H05K1/02
CPC分类号： H01R12/585 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.
摘要翻译： 公开了一种被配置为接收电气部件的基板。 衬底包括多个第一通孔和多个第二通孔。 多个第一通孔以行和列的矩阵形式布置在基板中，并且被配置为提供电气部件的安装，每个第一通孔与其最近邻近的第一通孔相关联地形成一对。 多个第二通孔能够彼此电气共用并且位于多个第一通孔之间，使得存在至少一个第二通孔，其直接位于每个第一通路和任何最接近的非对第一通孔邻近件之间。
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公开(公告)号：US07775802B2
公开(公告)日：2010-08-17
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US20100144203A1
公开(公告)日：2010-06-10
申请号：US12474505
申请日：2009-05-29
申请人： Douglas W. Glover , Evan C. Wickes
发明人： Douglas W. Glover , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R13/506 , H01R13/6471 , H01R13/6587 , H01R13/6599 , H05K1/0219 , H05K1/0222 , H05K1/0245 , H05K1/116
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US20100144169A1
公开(公告)日：2010-06-10
申请号：US12474772
申请日：2009-05-29
CPC分类号： H01R12/585 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实施方案可以提供接地屏蔽和/或其他接地结构，其基本上将电连接器对（其可以是差分电连接器对）以三维方式贯穿整个背板占用面积，背板连接器和 子卡足迹。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US20100144168A1
公开(公告)日：2010-06-10
申请号：US12474626
申请日：2009-05-29
IPC分类号： H01R12/00
CPC分类号： H01R12/585 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US07811129B2
公开(公告)日：2010-10-12
申请号：US12474505
申请日：2009-05-29
申请人： Douglas W. Glover , Evan C. Wickes
发明人： Douglas W. Glover , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R13/506 , H01R13/6471 , H01R13/6587 , H01R13/6599 , H05K1/0219 , H05K1/0222 , H05K1/0245 , H05K1/116
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US08382522B2
公开(公告)日：2013-02-26
申请号：US13191695
申请日：2011-07-27
IPC分类号： H01R13/648
CPC分类号： H01R12/585 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.
摘要翻译： 公开了一种被配置为接收电气部件的基板。 衬底包括多个第一通孔和多个第二通孔。 多个第一通孔以行和列的矩阵形式布置在基板中，并且被配置为提供电气部件的安装，每个第一通孔与其最近邻近的第一通孔相关联地形成一对。 多个第二通孔能够彼此电气共用并且位于多个第一通孔之间，使得存在至少一个第二通孔，其直接位于每个第一通路和任何最接近的非对第一通孔邻近件之间。
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公开(公告)号：US07871296B2
公开(公告)日：2011-01-18
申请号：US12474545
申请日：2009-05-29
申请人： David K. Fowler , Evan C. Wickes , Donald E. Wood
发明人： David K. Fowler , Evan C. Wickes , Donald E. Wood
IPC分类号： H01R13/648
CPC分类号： H01R13/6599 , H01R12/585 , H01R12/724 , H01R13/111 , H01R13/514 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实施方案可以提供接地屏蔽和/或其他接地结构，其基本上将电连接器对（其可以是差分电连接器对）以三维方式贯穿整个背板占用面积，背板连接器和 子卡足迹。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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公开(公告)号：US20100144201A1
公开(公告)日：2010-06-10
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US08167651B2
公开(公告)日：2012-05-01
申请号：US12474626
申请日：2009-05-29
IPC分类号： H01R13/648
CPC分类号： H01R12/585 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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