STACKED LEADED ARRAY
    1.
    发明申请
    STACKED LEADED ARRAY 有权
    堆积领导阵列

    公开(公告)号:US20130016488A1

    公开(公告)日:2013-01-17

    申请号:US13533283

    申请日:2012-06-26

    IPC分类号: H05K7/06

    CPC分类号: H01G4/232 H01G4/38

    摘要: A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.

    摘要翻译: 提供堆叠的引线阵列,其中堆叠的引线阵列允许增加电子部件的封装密度。 堆叠引线阵列具有堆叠阵列中的多个电子部件。 每个电子部件包括第一终端和第二终端。 提供多个第一引线,其中每个第一引线与至少一个第一端接电接触。 第二引线与第二端接电接触。

    Stacked leaded array
    2.
    发明授权
    Stacked leaded array 有权
    堆叠引线阵列

    公开(公告)号:US09171672B2

    公开(公告)日:2015-10-27

    申请号:US13533283

    申请日:2012-06-26

    IPC分类号: H05K7/06 H01G4/232 H01G4/38

    CPC分类号: H01G4/232 H01G4/38

    摘要: A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.

    摘要翻译: 提供堆叠的引线阵列,其中堆叠的引线阵列允许增加电子部件的封装密度。 堆叠引线阵列具有堆叠阵列中的多个电子部件。 每个电子部件包括第一终端和第二终端。 提供多个第一引线,其中每个第一引线与至少一个第一端接电接触。 第二引线与第二端接电接触。