摘要:
A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.
摘要:
A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.
摘要:
A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.
摘要:
A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.
摘要:
A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.