公开(公告)号：US07229339B2

公开(公告)日：2007-06-12

申请号：US10884371

申请日：2004-07-02

申请人： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

发明人： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

IPC分类号： B24B5/00

CPC分类号： B24B37/345

摘要： Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

摘要翻译： 提供了用于工件表面的化学机械平坦化（CMP）的方法和装置。 根据本发明的一个实施例，该装置包括多个CMP系统，用于将未处理的工件装载到多个CMP系统中并从其卸载加工的工件的多个装载杯;多个用于清洁加工件的清洁站 从CMP系统卸载的单个机器人和被配置为将未处理的工件传送到多个装载杯并将加工的工件从加载杯传送到多个清洁站的单个机器人。