公开(公告)号：US07354335B2

公开(公告)日：2008-04-08

申请号：US10821758

申请日：2004-04-09

申请人： David T. Marquardt ,  Joe E. Koeth ,  James Jed Crawford ,  James Ekberg ,  Antoni F. Jakubiec ,  Michael D. Smigel ,  John F. Stumpf

发明人： David T. Marquardt ,  Joe E. Koeth ,  James Jed Crawford ,  James Ekberg ,  Antoni F. Jakubiec ,  Michael D. Smigel ,  John F. Stumpf

IPC分类号： B24B49/00

CPC分类号： B24B37/345 ,  B23Q3/18 ,  B23Q7/04 ,  Y10S414/136 ,  Y10S414/141

摘要： In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured to pivot about an axis between a load position aligned with the apparatus and an off-load position. A work piece platform is coupled to an end of the load cup arm and a plurality of lift fingers and a plurality of guide fingers, configured to support and center a work piece, are spaced about the work piece platform. A plurality of guide posts are spaced apart about the periphery of the work piece platform and are configured to align the work piece platform, in the load position, to the processing apparatus.

摘要翻译： 根据本发明的一个实施例，提供了用于装载和卸载诸如CMP装置的装置的装载杯机构。 负载杯机构构造成将工件装载到装置中并从工具卸载工件，包括负载杯臂，其配置成围绕与该装置对准的负载位置和卸载位置之间的轴线枢转。 工件平台联接到负载杯臂的端部，并且构造成支撑和居中工件的多个提升指和多个引导指在工件平台周围间隔开。 多个引导柱围绕工件平台的周边间隔开，并且被构造成使处于装载位置的工件平台对准处理装置。

公开(公告)号：US07229339B2

公开(公告)日：2007-06-12

申请号：US10884371

申请日：2004-07-02

申请人： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

发明人： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

IPC分类号： B24B5/00

CPC分类号： B24B37/345

摘要： Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

摘要翻译： 提供了用于工件表面的化学机械平坦化（CMP）的方法和装置。 根据本发明的一个实施例，该装置包括多个CMP系统，用于将未处理的工件装载到多个CMP系统中并从其卸载加工的工件的多个装载杯;多个用于清洁加工件的清洁站 从CMP系统卸载的单个机器人和被配置为将未处理的工件传送到多个装载杯并将加工的工件从加载杯传送到多个清洁站的单个机器人。