METAL CONSERVATION WITH STRIPPER SOLUTIONS CONTAINING RESORCINOL
    6.
    发明申请
    METAL CONSERVATION WITH STRIPPER SOLUTIONS CONTAINING RESORCINOL 有权
    金属保存与含有RESORCINOL的剥离剂溶液

    公开(公告)号:US20090047609A1

    公开(公告)日:2009-02-19

    申请号:US11928728

    申请日:2007-10-30

    IPC分类号: G03C5/00 G03C11/12

    摘要: Resist stripping agents useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits and/or liquid crystals with reduced metal and metal alloy etch rates (particularly copper etch rates and TiW etch rates), are provided with methods for their use. The preferred stripping agents contain low concentrations of resorcinol or a resorcinol derivative, with or without an added copper salt, and with or without an added amine to improve solubility of the copper salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

    摘要翻译: 具有减少的金属和金属合金蚀刻速率(特别是铜蚀刻速率和TiW蚀刻速率)的半导体集成电路和/或液晶的半导体器件上制造电路和/或形成电极的抗蚀剂剥离剂提供了它们使用的方法 。 优选的汽提剂含有低浓度的间苯二酚或间苯二酚衍生物,具有或不具有加入的铜盐,以及具有或不具有加入的胺以改善铜盐的溶解度。 还提供了根据这些方法制备的集成电路器件和电子互连结构。

    Compositions for reducing metal etch rates using stripper solutions containing copper salts
    8.
    发明授权
    Compositions for reducing metal etch rates using stripper solutions containing copper salts 有权
    使用含铜盐的汽提溶液降低金属蚀刻速率的组合物

    公开(公告)号:US07851427B2

    公开(公告)日:2010-12-14

    申请号:US12697470

    申请日:2010-02-01

    IPC分类号: C11D3/30 C11D3/04 C11D1/62

    摘要: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper salt with or without an added amine to improve solubility of the salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

    摘要翻译: 具有减少的金属蚀刻速率,特别是铜蚀刻速率的用于制造电路和/或用于半导体集成电路的半导体器件上形成电极的抗蚀剂剥离剂提供有其使用方法。 优选的汽提剂含有低浓度的具有或不具有加入的胺的铜盐以改善盐的溶解度。 还提供了根据这些方法制备的集成电路器件和电子互连结构。

    COMPOSITIONS FOR REDUCING METAL ETCH RATES USING STRIPPER SOLUTIONS CONTAINING COPPER SALTS
    9.
    发明申请
    COMPOSITIONS FOR REDUCING METAL ETCH RATES USING STRIPPER SOLUTIONS CONTAINING COPPER SALTS 有权
    用于减少金属蚀刻速率的组合物使用含有铜箔的剥离剂溶液

    公开(公告)号:US20100137181A1

    公开(公告)日:2010-06-03

    申请号:US12697470

    申请日:2010-02-01

    IPC分类号: G03F7/42

    摘要: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper salt with or without an added amine to improve solubility of the salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

    摘要翻译: 具有减少的金属蚀刻速率,特别是铜蚀刻速率的用于制造电路和/或用于半导体集成电路的半导体器件上形成电极的抗蚀剂剥离剂提供有其使用方法。 优选的汽提剂含有低浓度的具有或不具有加入的胺的铜盐以改善盐的溶解度。 还提供了根据这些方法制备的集成电路器件和电子互连结构。