公开(公告)号：US07503983B2

公开(公告)日：2009-03-17

申请号：US12008552

申请日：2008-01-11

申请人： John M. Boyd ,  Michael L. Orbock ,  Fred C. Redeker

发明人： John M. Boyd ,  Michael L. Orbock ,  Fred C. Redeker

IPC分类号： B08B1/00

CPC分类号： H01L21/67046 ,  Y10S134/902

摘要： A wafer preparation method is provided for producing a wet region and then a corresponding dry region on the wafer. Brushing produces the wet region on the wafer. As the brushing moves in a selected scan operation across the wafer, a generating operation forms a meniscus that follows the brushing and dries the wet region. The generating operation produces the meniscus at least partially surrounding the wet region scrubbed by the scrubbing. The controlled meniscus is formed by applying fluid to the surface of the wafer and simultaneously removing the fluid. The scan operations may be selected so the brushing scrubs the wet region and then the meniscus forms the dry region where the scrubbing took place. The scan operations include a radial scan, a linear scan, a spiral scan and a raster scan.

摘要翻译： 提供晶片制备方法，用于在晶片上产生湿区域，然后产生相应的干燥区域。 刷子在晶片上产生湿区域。 当刷洗在晶片上的选择的扫描操作中移动时，产生操作形成跟随刷牙并干燥湿区域的弯液面。 生成操作产生弯液面，至少部分地围绕通过洗涤擦洗的湿区域。 受控弯液面通过将流体施加到晶片的表面并同时去除流体而形成。 可以选择扫描操作，使得刷洗擦洗湿区域，然后弯液面形成擦洗发生的干燥区域。 扫描操作包括径向扫描，线性扫描，螺旋扫描和光栅扫描。

公开(公告)号：US07353560B2

公开(公告)日：2008-04-08

申请号：US10742303

申请日：2003-12-18

申请人： John M. Boyd ,  Michael L. Orbock ,  Fred C. Redeker

发明人： John M. Boyd ,  Michael L. Orbock ,  Fred C. Redeker

IPC分类号： A47L7/00 ,  G03D5/06 ,  H01L21/00

CPC分类号： H01L21/67046 ,  Y10S134/902

摘要： An apparatus is provided for producing a wet region and corresponding dry region on a wafer. A proximity brush unit delivers fluids with a rotatable brush to produce the wet region on the wafer. As the proximity brush unit moves in a selected scan method across the wafer, a plurality of ports produces the dry region on the wafer. Further, the rotatable brush disposed within the proximity brush unit can rotate via mechanical gears or electromagnetic levitation. The selected scan method that produces the wet region and the dry region moves the proximity brush unit in a variety of methods including a radial scan, a linear scan, a spiral scan and a raster scan. To further produce a dry region during the selected scan method, the plurality of ports disposed on the surface of the proximity brush unit is on the trailing edges of the proximity head unit and the wafer.

摘要翻译： 提供了一种用于在晶片上产生湿区域和相应的干燥区域的装置。 接近刷单元用可旋转的刷子输送流体以在晶片上产生湿区域。 当接近刷单元以选定的扫描方法移动跨越晶片时，多个端口在晶片上产生干燥区域。 此外，设置在接近刷单元内的可旋转刷可以经由机械齿轮或电磁悬浮来旋转。 产生湿区域和干燥区域的选择的扫描方法以包括径向扫描，线性扫描，螺旋扫描和光栅扫描的各种方法移动接近刷单元。 为了在所选择的扫描方法期间进一步产生干燥区域，设置在接近刷单元表面上的多个端口位于邻近头单元和晶片的后缘。

公开(公告)号：US07350315B2

公开(公告)日：2008-04-01

申请号：US10745219

申请日：2003-12-22

申请人： Glenn W. Davis ,  Carl Woods ,  John Parks ,  Fred C. Redeker ,  Mike Ravkin ,  Michael L. Orbock

发明人： Glenn W. Davis ,  Carl Woods ,  John Parks ,  Fred C. Redeker ,  Mike Ravkin ,  Michael L. Orbock

IPC分类号： F26B13/30 ,  B08B5/04

CPC分类号： H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/68707

摘要： A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.

摘要翻译： 用于干燥衬底的设备包括邻近边缘轮定位的真空歧管。 边缘轮包括用于接收基板周边的边缘轮槽，并且边缘轮能够以所需的设定速度旋转基板。 真空歧管包括具有限定在其中的一个或多个真空端口的邻近端。 邻近端部至少部分地定位在边缘轮槽内，并且使用提供的真空去除积聚在边缘轮槽中的流体并且防止捕获的流体围绕衬底的周边边缘重新沉积。