公开(公告)号：US07466155B2

公开(公告)日：2008-12-16

申请号：US11747204

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07453279B2

公开(公告)日：2008-11-18

申请号：US11747197

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07352200B2

公开(公告)日：2008-04-01

申请号：US11033935

申请日：2005-01-12

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07479796B2

公开(公告)日：2009-01-20

申请号：US11747202

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

摘要翻译： 公开了用于测试LGA设备的改进的方法，系统和设备。 一个示例性实施例包括测试嵌套组件冷却线的垂直布线，以便最小化测试嵌套足迹并增加单个测试卡上的可用测试位置。 另一示例性实施例包括将外部负载和力矩隔离并调整到散热器/冷板中，其中这些负载和力矩涉及控制质心以恢复散热片/芯片接口的更理想的热性能。 另一个示例性实施例包括便于LGA插座的简单且低成本替换的嵌套架构。 最后，另一示例性实施例包括通过使用干式空气排气对测试巢组件部件进行有效的冷凝控制。

公开(公告)号：US07456644B2

公开(公告)日：2008-11-25

申请号：US11747210

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07423440B2

公开(公告)日：2008-09-09

申请号：US11747207

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

摘要翻译： 公开了用于测试LGA设备的改进的方法，系统和设备。 一个示例性实施例包括测试嵌套组件冷却线的垂直布线，以便最小化测试嵌套足迹并增加单个测试卡上的可用测试位置。 另一示例性实施例包括将外部负载和力矩隔离并调整到散热器/冷板中，其中这些负载和力矩涉及控制质心以恢复散热片/芯片接口的更理想的热性能。 另一个示例性实施例包括便于LGA插座的简单且低成本替换的嵌套架构。 最后，另一示例性实施例包括通过使用干式空气排气对测试巢组件部件进行有效的冷凝控制。

公开(公告)号：US07405583B2

公开(公告)日：2008-07-29

申请号：US11747200

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07463017B2

公开(公告)日：2008-12-09

申请号：US11747213

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US07425822B2

公开(公告)日：2008-09-16

申请号：US11747216

申请日：2007-05-10

申请人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

发明人： John Saunders Corbin, Jr. ,  Jose Arturo Garza ,  Dales Morrison Kent ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  Hoa Thanh Phan ,  John Joseph Salazar

IPC分类号： G01R31/02

CPC分类号： G01R31/2891

摘要： Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

公开(公告)号：US06911836B2

公开(公告)日：2005-06-28

申请号：US10645038

申请日：2003-08-21

申请人： Lonnie J. Cannon ,  John Saunders Corbin, Jr. ,  David Lewis Gardell ,  Jose Arturo Garza ,  Jeffrey Frank Kutner ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  John Joseph Salazar

发明人： Lonnie J. Cannon ,  John Saunders Corbin, Jr. ,  David Lewis Gardell ,  Jose Arturo Garza ,  Jeffrey Frank Kutner ,  Kenneth Carl Larsen ,  Howard Victor Mahaney, Jr. ,  John Joseph Salazar

IPC分类号： G01R31/26

CPC分类号： G01R31/2891

摘要： A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.

摘要翻译： 具有改善热性能的芯片测试系统。 在优选实施例中，芯片测试装置的嵌套组件包括工具球和用于改善冷板和芯片表面的对准的装配框架。 在优选实施例中，冷板具有一体设计。 通过使用可调节软管安装支架平衡施加在冷板上的力，也可以提高热性能。 支架允许由软管施加在冷板上的力进行调节，从而平衡并消除冷板上的其他不必要的力。