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公开(公告)号：US20210210417A1
公开(公告)日：2021-07-08
申请号：US17212756
申请日：2021-03-25
发明人： Chiping SUN , Shinghin YEUNG , Haibo JIANG , Qiubao WANG , Enhui WANG
IPC分类号： H01L23/495 , H03K19/173 , G06F1/22 , H01L23/50 , H01L23/00
摘要： An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.
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公开(公告)号：US20190244880A1
公开(公告)日：2019-08-08
申请号：US16266727
申请日：2019-02-04
发明人： Chiping SUN , Shinghin YEUNG , Haibo JIANG , Qiubao WANG , Enhui WANG
IPC分类号： H01L23/495 , H01L23/50 , H01L23/00
CPC分类号： H03K19/1732 , G06F1/22
摘要： An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.
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