公开(公告)号：US20210210417A1

公开(公告)日：2021-07-08

申请号：US17212756

申请日：2021-03-25

申请人： Johnson Electric International AG

发明人： Chiping SUN ,  Shinghin YEUNG ,  Haibo JIANG ,  Qiubao WANG ,  Enhui WANG

IPC分类号： H01L23/495 ,  H03K19/173 ,  G06F1/22 ,  H01L23/50 ,  H01L23/00

摘要： An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.

公开(公告)号：US20190244880A1

公开(公告)日：2019-08-08

申请号：US16266727

申请日：2019-02-04

申请人： Johnson Electric International AG

发明人： Chiping SUN ,  Shinghin YEUNG ,  Haibo JIANG ,  Qiubao WANG ,  Enhui WANG

IPC分类号： H01L23/495 ,  H01L23/50 ,  H01L23/00

CPC分类号： H03K19/1732 ,  G06F1/22

摘要： An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.

公开(公告)号：US20220014122A1

公开(公告)日：2022-01-13

申请号：US17368605

申请日：2021-07-06

申请人： Johnson Electric International AG

发明人： Yue LI ,  Xiuwen YANG ,  Enhui WANG ,  Shujuan HUANG ,  Guodong LIU ,  Haibo JIANG ,  Yunlong JIANG

IPC分类号： H02P1/46 ,  H02P6/18 ,  H02P27/024 ,  H02P6/26

摘要： The present disclosure provides a single phase motor driving circuit which includes a stator winding, a control unit, a controllable bidirectional AC switch, and two power input terminals configured to connect an AC power source. The stator winding includes a first winding and a second winding. The parallel-connected first winding and second winding and the controllable bidirectional AC switch are connected in series between the two power input terminals. The control unit is connected to a control electrode of the controllable bidirectional AC switch, to control the controllable bidirectional AC switch to be switched on and off. The present disclosure further provides a driving method for the single phase motor driving circuit. The single phase motor driving circuit and the driving method thereof has better reliability while ensuring sufficient starting torque.