Electronic apparatus for automatic control of the placing of material at
a junction between surfaces
    1.
    发明授权
    Electronic apparatus for automatic control of the placing of material at a junction between surfaces 失效
    用于自动控制在表面之间的接合处放置材料的电子设备

    公开(公告)号:US4593173A

    公开(公告)日:1986-06-03

    申请号:US547599

    申请日:1983-11-01

    摘要: Apparatus to control the automatic placing of material along a junction between surfaces with reference to the form and position of the junction including means controllably movable to deposit material progressively along the junction in response to a control signal, means linked to the movement of the means to deposit material to produce an image of the surfaces and junction, filter means to remove from the image information resulting from illumination at other than a specific wavelength with a tapped delay line to provide a specific impulse response, means to extract from the image that portion unambiguously defining the junction form and position, means responsive to said image portion to derive said control signal to control the means to deposit material to move in a required manner along said junction to deposit material.

    摘要翻译: 用于控制材料沿着表面之间的接合部处的自动放置的装置,所述设备的形式和位置包括可控制地移动的装置,以响应于控制信号逐渐沿着接合部沉积材料,所述装置与装置的移动相关联 沉积材料以产生表面和结的图像,滤波器装置从具有抽头延迟线的特定波长以外的照明产生的图像信息中除去以提供特定的脉冲响应,从图像中提取明确的脉冲响应的装置 限定接合形式和位置的装置,响应于所述图像部分导出所述控制信号以控制装置以沿所述连接点以所需方式移动以沉积材料的装置。