公开(公告)号：US08386799B2

公开(公告)日：2013-02-26

申请号：US12630646

申请日：2009-12-03

申请人： Jong Kim ,  Sangho Lee ,  Heejin Park

发明人： Jong Kim ,  Sangho Lee ,  Heejin Park

IPC分类号： G06F21/00

CPC分类号： G06F21/10 ,  G06F2221/0728

摘要： Methods and apparatuses for providing DRM interoperability are provided. Proxy re-encryption technique using bilinear map is used, and the same content can be used in different devices. According to the method of providing DRM interoperability includes in proxy agent with respect to digital rights management (DRM) service providers and device which supports predetermined DRM, first DRM service provider, second DRM service provider, the proxy agent, and the device identify each other, and proxy re-encrypt an interoperable content (IC) and provide the IC to the device. The IC is second-level encrypted by using a key of the first DRM service provider, and the proxy re-encryption is performed by using a proxy key generated from proxy key information provided from the first DRM service provider and the second DRM service provider. Therefore, a problem in which interoperability cannot be guaranteed since a DRM technique depends on a service provider is resolved.

摘要翻译： 提供了提供DRM互操作性的方法和设备。 使用双线性映射的代理重新加密技术，相同的内容可以在不同的设备中使用。 根据提供DRM互操作性的方法，其包括关于数字权限管理（DRM）服务提供商的代理代理和支持预定DRM的设备，第一DRM服务提供商，第二DRM服务提供商，代理代理和设备彼此识别 ，并且代理重新加密可互操作的内容（IC）并将IC提供给设备。 IC通过使用第一DRM服务提供商的密钥进行二级加密，并且通过使用从第一DRM服务提供商和第二DRM服务提供商提供的代理密钥信息生成的代理密钥来执行代理重新加密。 因此，解决了DRM技术取决于服务提供商的互操作性不能保证的问题。

公开(公告)号：US20100138671A1

公开(公告)日：2010-06-03

申请号：US12630646

申请日：2009-12-03

申请人： Jong Kim ,  Sangho Lee ,  Heejin Park

发明人： Jong Kim ,  Sangho Lee ,  Heejin Park

IPC分类号： G06F21/24

CPC分类号： G06F21/10 ,  G06F2221/0728

摘要： Methods and apparatuses for providing DRM interoperability are provided. Proxy re-encryption technique using bilinear map is used, and the same content can be used in different devices. According to the method of providing DRM interoperability includes in proxy agent with respect to digital rights management (DRM) service providers and device which supports predetermined DRM, first DRM service provider, second DRM service provider, the proxy agent, and the device identify each other, and proxy re-encrypt an interoperable content (IC) and provide the IC to the device. The IC is second-level encrypted by using a key of the first DRM service provider, and the proxy re-encryption is performed by using a proxy key generated from proxy key information provided from the first DRM service provider and the second DRM service provider. Therefore, a problem in which interoperability cannot be guaranteed since a DRM technique depends on a service provider is resolved.

摘要翻译： 提供了提供DRM互操作性的方法和设备。 使用双线性映射的代理重新加密技术，相同的内容可以在不同的设备中使用。 根据提供DRM互操作性的方法，其包括关于数字权限管理（DRM）服务提供商的代理代理和支持预定DRM的设备，第一DRM服务提供商，第二DRM服务提供商，代理代理和设备彼此识别 ，并且代理重新加密可互操作的内容（IC）并将IC提供给设备。 IC通过使用第一DRM服务提供商的密钥进行二级加密，并且通过使用从第一DRM服务提供商和第二DRM服务提供商提供的代理密钥信息生成的代理密钥来执行代理重新加密。 因此，解决了DRM技术取决于服务提供商的互操作性不能保证的问题。

公开(公告)号：US08704366B2

公开(公告)日：2014-04-22

申请号：US12911592

申请日：2010-10-25

申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a wafer and a dicing saw tape that is laminated to a back surface of the wafer. An active surface of the wafer is opposite the back surface of the wafer. The semiconductor device further includes a lamination tape disposed in contact with the wafer. The lamination tape includes an under-film layer contacting the active surface of the wafer. The lamination tape further includes an adhesive layer contacting the under-film layer.

摘要翻译： 半导体器件包括层叠到晶片的背面的晶片和切割锯带。 晶片的活性表面与晶片的背面相对。 半导体器件还包括与晶片接触设置的层压带。 层压带包括与晶片的活性表面接触的底膜层。 层压带还包括与底膜层接触的粘合剂层。

公开(公告)号：USD650604S1

公开(公告)日：2011-12-20

申请号：US29383680

申请日：2011-01-20

申请人： Sangho Lee

设计人： Sangho Lee

公开(公告)号：USD641562S1

公开(公告)日：2011-07-19

申请号：US29383681

申请日：2011-01-20

申请人： Sangho Lee

设计人： Sangho Lee

公开(公告)号：US20110037172A1

公开(公告)日：2011-02-17

申请号：US12911592

申请日：2010-10-25

申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a wafer and a dicing saw tape that is laminated to a back surface of the wafer. An active surface of the wafer is opposite the back surface of the wafer. The semiconductor device further includes a lamination tape disposed in contact with the wafer. The lamination tape includes an under-film layer contacting the active surface of the wafer. The lamination tape further includes an adhesive layer contacting the under-film layer.

摘要翻译： 半导体器件包括层叠到晶片的背面的晶片和切割锯带。 晶片的活性表面与晶片的背面相对。 半导体器件还包括与晶片接触设置的层压带。 层压带包括与晶片的活性表面接触的底膜层。 层压带还包括与底膜层接触的粘合剂层。

公开(公告)号：US07838391B2

公开(公告)日：2010-11-23

申请号：US11745045

申请日：2007-05-07

申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device begins with a wafer having a plurality of bumps formed on a surface of the wafer. An under-film layer is formed over the wafer to completely cover all portions of the bumps with the under-film layer. An adhesive layer is formed over the under-film layer. A support layer is attached over the adhesive layer. A back surface of the wafer undergoes grinding. The support layer provides structural support to the wafer. The support layer is removed to expose the adhesive layer. The adhesive layer is removed to expose the under-film layer. The wafer is singulated into semiconductor die. The semiconductor die is mounted to a substrate by applying force to a back surface of the semiconductor die to press the bumps through under-film layer to contact the substrate while the under-film layer provides an underfill between the semiconductor die and substrate.

摘要翻译： 半导体器件开始于在晶片的表面上形成有多个凸块的晶片。 在晶片之上形成底膜层，以完全覆盖具有底膜层的凸块的所有部分。 在底膜层上形成粘合剂层。 支撑层附着在粘合剂层上。 晶片的后表面进行研磨。 支撑层为晶片提供结构支撑。 去除支撑层以暴露粘合剂层。 去除粘合剂层以暴露底膜层。 将晶片分成半导体芯片。 通过向半导体管芯的背面施加力将半导体管芯安装到基板上，以通过底膜层将凸块按压以接触基板，同时底膜层在半导体管芯和基板之间提供底部填充。

公开(公告)号：US20050060582A1

公开(公告)日：2005-03-17

申请号：US10749744

申请日：2003-12-30

申请人： Yang Choi ,  Hwan Kim ,  Dong Seo ,  Sangho Lee

发明人： Yang Choi ,  Hwan Kim ,  Dong Seo ,  Sangho Lee

IPC分类号： H04L12/28 ,  G06F11/30 ,  H04L29/06

CPC分类号： H04L63/1441 ,  H04L2463/146

摘要： An apparatus and method for providing traceback connection using a connection redirection technique are provided. A packet blocking unit blocks an attack packet transmitted to the system and a first response packet output from the system in response to the attack packet, if a system attack sensing signal is received. A response packet generation unit generates a second response packet into which a watermark is inserted, in response to the attack packet, and transmits the second response packet to a system corresponding to the source address of the attack packet. A path traceback unit receives a detection packet containing transmission path information of the second response packet from a system existing on a transmission path of the second response packet, and based on the received detection packet, traces back the transmission path of the second response packet and identifies the location of the attacker system. According to the apparatus and method, even when an attacker attacks a predetermined system via a plurality of systems, the actual location of the attacker system can be traced back fast and accurately and damage of the victim system can be minimized.

摘要翻译： 提供了一种使用连接重定向技术提供回溯连接的装置和方法。 如果接收到系统攻击感知信号，则分组阻塞单元阻止发送到系统的攻击分组和响应于攻击分组从系统输出的第一响应分组。 响应分组生成单元响应于攻击分组生成插入了水印的第二响应分组，并将第二响应分组发送到与攻击分组的源地址对应的系统。 路径追溯单元从存在于第二响应分组的传输路径上的系统接收包含第二响应分组的传输路径信息的检测分组，并且基于接收到的检测分组，追踪第二响应分组的传输路径， 识别攻击者系统的位置。 根据该装置和方法，即使攻击者通过多个系统攻击预定的系统，也可以快速，准确地跟踪攻击者系统的实际位置，并且可以使受害者系统的损坏最小化。

公开(公告)号：US20230138959A1

公开(公告)日：2023-05-04

申请号：US17976514

申请日：2022-10-28

申请人： Pedamalli SAIKRISHNA ,  Ankur Goyal ,  Ashok Kumar Reddy Chavva ,  Ashwini Kumar ,  Suhwook Kim ,  Sangho Lee

发明人： Pedamalli SAIKRISHNA ,  Ankur Goyal ,  Ashok Kumar Reddy Chavva ,  Ashwini Kumar ,  Suhwook Kim ,  Sangho Lee

IPC分类号： H03F3/26 ,  G06K9/62 ,  G06N3/04

摘要： Embodiments herein disclose a method for controlling a non-linear effect of a power amplifier by an apparatus. The method includes acquiring an input data of the power amplifier of the apparatus and an output data of the power amplifier. Further, the method includes determining an inverse function using a neural network. The inverse function maps normalized output data of the PA to the input data of the PA, where the neural network comprises at least one sub-network for at least one memory tap from a plurality of memory taps in the neural network. Further, the method includes modifying the input data based on the determined inverse function value by dynamically changing a usage of the at least one memory tap from the plurality of memory taps. Further, the method includes compensating the non-linear effect in the output data of the power amplifier.

公开(公告)号：US11629464B2

公开(公告)日：2023-04-18

申请号：US17197482

申请日：2021-03-10

申请人： Sung Woo Lee ,  Sangho Lee

发明人： Sung Woo Lee ,  Sangho Lee

IPC分类号： E01D19/12 ,  E01D101/24 ,  E01D101/30

摘要： A modular paneled structure, comprising a main panel with a symmetric profile which has a closed-sectional portion in the middle and open-sectional portions at each end; and further comprising a cover panel which interconnects two side-by-side main panels, where the cover panel closes the open-sectional portions of the two side-by-side main panels forming a closed-sectional shape together with main panels; and further comprising a tensioning member which interconnects and pre-tensions the main panels that are placed side by side; and consequently, forms an assembled paneled structure with all these connective means, which is used to construct a paneled ground structures.