摘要:
With the present invention, two wafers for a solar cell only whose light receiving surfaces are selectively etched can be simultaneously obtained by overlapping the two wafers and performing a single-sided etching or an asymmetric etching thereon. The present invention provides a method of etching a wafer comprising: performing a single-sided etching or an asymmetric etching on the wafer, wherein the performing the single-sided etching or the asymmetric etching comprises: overlapping two wafers whose one sides face each other; and etching the overlapped two wafers, and a solar cell including the etched wafers.
摘要:
A back contact solar cell comprises a first dopant diffusion part and a second dopant diffusion part formed on a rear surface of an n-type semiconductor wafer with a predetermined distance formed therebetween by a diffusion prevention part for ensuring no contact with each other and suppressing the diffusion of dopant; and an electrode configured of an anode and a cathode each connected to the first dopant diffusion part and the second dopant diffusion part. According to the present invention, the back contact solar cell is capable of preventing light loss and improving its efficiency by forming an electrode to be positioned on a rear surface of a semiconductor wafer through a simple process and by simultaneously implementing an anode electrode and a cathode electrode on the semiconductor wafer without having a grid electrode restricting incidence of sunlight.