PHASE CHANGE RANDOM ACCESS MEMORY AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    PHASE CHANGE RANDOM ACCESS MEMORY AND METHOD FOR MANUFACTURING THE SAME 有权
    相变随机访问存储器及其制造方法

    公开(公告)号:US20130075682A1

    公开(公告)日:2013-03-28

    申请号:US13331758

    申请日:2011-12-20

    申请人: Keun LEE

    发明人: Keun LEE

    IPC分类号: H01L45/00 H01L21/06

    摘要: A phase change random access memory includes a semiconductor substrate having a bottom electrode formed over the semiconductor substrate; and a phase change layer formed over the bottom electrode. The phase change layer a first phase change layer formed over the bottom electrode and including at least one of a first element, a second element, and a third element; and a second phase change layer formed over a surface of the first phase change layer and formed of the first element to prevent an area of the first phase change layer from increasing through diffusion.

    摘要翻译: 相变随机存取存储器包括在半导体衬底上形成有底电极的半导体衬底; 以及形成在底部电极上的相变层。 所述相变层形成在所述底部电极上并且包括第一元件,第二元件和第三元件中的至少一个的第一相变层; 以及形成在所述第一相变层的表面上并由所述第一元件形成以防止所述第一相变层的面积通过扩散增加的第二相变层。