Mapping system for semiconductor wafer cassettes
    1.
    发明授权
    Mapping system for semiconductor wafer cassettes 有权
    半导体晶片盒的映射系统

    公开(公告)号:US06364745B1

    公开(公告)日:2002-04-02

    申请号:US09525315

    申请日:2000-03-13

    IPC分类号: B24B4900

    摘要: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

    摘要翻译: 用于抛光,清洁,漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片,将晶片移动到用于抛光的抛光台,并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站,漂洗站和旋转干燥站,以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

    Combined CMP and wafer cleaning apparatus and associated methods
    2.
    发明授权
    Combined CMP and wafer cleaning apparatus and associated methods 有权
    组合CMP和晶圆清洗装置及相关方法

    公开(公告)号:US06350177B1

    公开(公告)日:2002-02-26

    申请号:US09573621

    申请日:2000-05-17

    IPC分类号: B24B100

    摘要: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

    摘要翻译: 用于抛光,清洁,漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片,将晶片移动到用于抛光的抛光台,并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站,漂洗站和旋转干燥站,以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

    Integral machine for polishing, cleaning, rinsing and drying workpieces
    3.
    发明授权
    Integral machine for polishing, cleaning, rinsing and drying workpieces 失效
    抛光,清洗,漂洗和干燥工件的整体机

    公开(公告)号:US06213853B1

    公开(公告)日:2001-04-10

    申请号:US08926700

    申请日:1997-09-10

    IPC分类号: B24B500

    摘要: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

    摘要翻译: 用于抛光,清洁,漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片,将晶片移动到用于抛光的抛光台,并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站,漂洗站和旋转干燥站,以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

    Solderless connector technique and apparatus
    4.
    发明授权
    Solderless connector technique and apparatus 失效
    无焊接连接器技术和装置

    公开(公告)号:US4717345A

    公开(公告)日:1988-01-05

    申请号:US898121

    申请日:1986-08-19

    摘要: A solderless connector technique and apparatus is presented for establishing electrical contact between a flexible circuit and another circuit device utilizing relative motion therebetween to wipe away or remove any debris or other foreign matter present on the terminals which could adversely effect electrical contact. In a first embodiment of the present invention, relative motion between the respective circuit devices is provided by male and female housings having a camming device incorporated therein. This camming device will effectively wipe away any foreign matter or debris located on the respective terminal devices. In another embodiment of the present invention, mechanical springs are used to provide lateral motion to the circuit devices thereby wiping away any dirt, dust or debris. Preferably, a means for prewiping i.e., a cleaning pad, is provided to the present invention to facilitate removal of debris.

    摘要翻译: 提出了一种无焊接连接器技术和装置,用于在柔性电路和另一个电路装置之间建立电接触,利用它们之间的相对运动来擦除或去除端子上存在的可能不利地影响电接触的任何碎片或其它异物。 在本发明的第一实施例中,各个电路装置之间的相对运动由其中结合有凸轮装置的阳壳体和阴壳体提供。 该凸轮装置将有效地消除位于相应终端装置上的任何异物或碎片。 在本发明的另一个实施例中,使用机械弹簧来向电路装置提供横向运动,从而擦去任何污垢,灰尘或碎屑。 优选地,为本发明提供了一种用于预擦拭的装置,即清洁垫,以便于清除碎屑。