公开(公告)号：US06368421B1

公开(公告)日：2002-04-09

申请号：US09113892

申请日：1998-07-10

申请人： Joseph E. Oberlander ,  Mark S. Slezak ,  Dinesh N. Khanna ,  Dana L. Durham ,  Lawrence F. Spinicelli

发明人： Joseph E. Oberlander ,  Mark S. Slezak ,  Dinesh N. Khanna ,  Dana L. Durham ,  Lawrence F. Spinicelli

IPC分类号： B08B304

CPC分类号： G03F7/426

摘要： The invention relates to the field of microelectronics, such as integrated circuits, and more particularly to compositions and methods of removing photoresists or other organic materials from the surfaces of substrates used in the fabrication of integrated circuits. In particular the present invention relates to amine-free stripping compositions comprising solvent and surfactant that can effectively remove organic materials without corroding the underlying substrate, and the invention also relates to methods for removing these organic materials with the novel stripping composition.

摘要翻译： 本发明涉及微电子学领域，例如集成电路，更具体地涉及从用于制造集成电路的衬底表面去除光致抗蚀剂或其它有机材料的组合物和方法。 特别地，本发明涉及不含无溶剂和表面活性剂的无胺汽提组合物，其可有效去除有机材料而不腐蚀下面的基底，本发明还涉及用新的汽提组合物除去这些有机材料的方法。