公开(公告)号：US20150086597A1

公开(公告)日：2015-03-26

申请号：US14497504

申请日：2014-09-26

申请人： Joseph MALLAK ,  Lynn TILTON ,  John R. LINTON, JR. ,  Stephanie BRICKNER ,  Amy MILLER ,  Mark RODGERS ,  Christina ACORS

发明人： Joseph MALLAK ,  Lynn TILTON ,  John R. LINTON, JR. ,  Stephanie BRICKNER ,  Amy MILLER ,  Mark RODGERS ,  Christina ACORS

IPC分类号： A01N25/34 ,  A01N59/16 ,  A01N59/20

CPC分类号： A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  C23C30/00 ,  Y10T156/10 ,  Y10T428/31678

摘要： A copper or copper alloy product is provided, as well as a process for manufacturing a copper or copper alloy product. The product may include copper or copper alloy containing a minimum of 60% copper. The product may include an antimicrobial copper, such as, for example, the antimicrobial copper identified by the United States Environmental Protection Agency (EPA). The product may include, but is not limited to, for example, MD-Cu29™ antimicrobial copper or copper alloy. The antimicrobial copper or copper alloy which contains an antimicrobial touch surface should effectively kill bacteria within about two hours of exposure to the bacteria.

摘要翻译： 提供铜或铜合金产品，以及制造铜或铜合金产品的方法。 该产品可以包括含有至少60％铜的铜或铜合金。 该产品可以包括抗微生物铜，例如由美国环境保护署（EPA）鉴定的抗微生物铜。 该产品可以包括但不限于例如MD-Cu29 TM抗微生物铜或铜合金。 含有抗微生物接触表面的抗菌铜或铜合金应在暴露于细菌约2小时内有效杀死细菌。

公开(公告)号：US20180219124A1

公开(公告)日：2018-08-02

申请号：US15884461

申请日：2018-01-31

申请人： Masato TOITA ,  Satoshi YAMADA ,  Ken KITAMURA ,  Craig MOE ,  Amy MILLER

发明人： Masato TOITA ,  Satoshi YAMADA ,  Ken KITAMURA ,  Craig MOE ,  Amy MILLER

IPC分类号： H01L33/06 ,  H01L33/32 ,  H01L33/40 ,  H01L33/48 ,  H01L33/56 ,  H01L33/58 ,  H01L33/64 ,  H01L31/0203

摘要： In various embodiments, degradation of epoxy within packages for ultraviolet light-emitting devices is reduced or substantially eliminated via package venting, prevention of transmission of ultraviolet light to one or more regions of epoxy utilized in the package, and/or utilization of packaging schemes that reduce or avoid utilization of epoxy and/or specific metals.