公开(公告)号：US20050042877A1

公开(公告)日：2005-02-24

申请号：US10825849

申请日：2004-04-16

申请人： Joseph Salfelder ,  Wayne Swart ,  Gopalakrishna Prabhu ,  Srinivas Mirmira ,  Laertis Economikos ,  Fen Jamin ,  Donald Delehanty ,  Daniel Heenan ,  Joseph Danza

发明人： Joseph Salfelder ,  Wayne Swart ,  Gopalakrishna Prabhu ,  Srinivas Mirmira ,  Laertis Economikos ,  Fen Jamin ,  Donald Delehanty ,  Daniel Heenan ,  Joseph Danza

IPC分类号： H01L21/3105 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/31053

摘要： A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.

摘要翻译： 一种用于平坦化其上形成有一种或多种材料的基板的方法和抛光系统。 该方法通常包括将衬底定位在抛光垫附近，将抛光流体分配到抛光垫，抛光流体在分配到抛光垫之前进行碳酸化，并抛光衬底。 抛光系统通常包括具有设置在其上并且靠近基板的抛光垫的抛光台板，配置成使抛光垫与基板接触的控制器和抛光流体输送系统以将抛光流体输送到抛光垫， 抛光液输送系统包括碳酸化系统。