Packing density for flash memories
    1.
    发明授权
    Packing density for flash memories 失效
    闪存的包装密度

    公开(公告)号:US5892257A

    公开(公告)日:1999-04-06

    申请号:US708432

    申请日:1996-09-05

    摘要: Improved packing density as well as improved performance and manufacturing yield is achieved in an electrically programmable memory by confining floating gate structures between isolation structures covered with a thin nitride layer. The confinement of the floating gate is achieved by planarization, preferably with a self-limiting chemical/mechanical polishing process, to the surface of the nitride layer covering the isolation structures. Gate oxide and control electrode connections can then be formed on a substantially planar surface without compromising the quality of the gate oxide or breakdown voltage the device must withstand for programming. Since severe topology is avoided over which these connections are formed, improved formation of low resistance connections, possibly including metal connections, are possible and allow scaling of transistors of the memory cells to be scaled to sizes not previously possible.

    摘要翻译: 通过将浮置栅极结构限制在被薄氮化物层覆盖的隔离结构之间,可在电可编程存储器中实现提高的封装密度以及改进的性能和制造产量。 浮栅的限制是通过平面化,优选采用自限制化学/机械抛光工艺,覆盖覆盖隔离结构的氮化物层的表面来实现的。 然后可以在基本平坦的表面上形成栅极氧化物和控制电极连接,而不会损害器件必须承受编程的栅极氧化物的质量或击穿电压。 由于避免了形成这些连接的严格的拓扑结构,所以可能包括可能包括金属连接的低电阻连接的形成得到改进,并且允许将存储器单元的晶体管缩放到先前不可能的尺寸。

    Packing density for flash memories by using a pad oxide
    2.
    发明授权
    Packing density for flash memories by using a pad oxide 失效
    通过使用垫氧化物的闪存的包装密度

    公开(公告)号:US5643813A

    公开(公告)日:1997-07-01

    申请号:US434698

    申请日:1995-05-04

    摘要: Improved packing density as well as improved performance and manufacturing yield is achieved in an electrically programmable memory by confining floating gate structures between isolation structures covered with a thin nitride layer. The confinement of the floating gate is achieved by planarization, preferably with a self-limiting chemical/mechanical polishing process, to the surface of the nitride layer covering the isolation structures. Gate oxide and control electrode connections can then be formed on a substantially planar surface without compromising the quality of the gate oxide or breakdown voltage the device must withstand for programming. Since severe topology is avoided over which these connections are formed, improved formation of low resistance connections, possibly including metal connections, are possible and allow scaling of transistors of the memory cells to be scaled to sizes not previously possible.

    摘要翻译: 通过将浮置栅极结构限制在被薄氮化物层覆盖的隔离结构之间,可在电可编程存储器中实现提高的封装密度以及改进的性能和制造产量。 浮栅的限制是通过平面化,优选采用自限制化学/机械抛光工艺,覆盖覆盖隔离结构的氮化物层的表面来实现的。 然后可以在基本平坦的表面上形成栅极氧化物和控制电极连接,而不会损害器件必须承受编程的栅极氧化物的质量或击穿电压。 由于避免了形成这些连接的严格的拓扑结构,所以可能包括可能包括金属连接的低电阻连接的形成得到改进,并且允许将存储器单元的晶体管缩放到先前不可能的尺寸。