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公开(公告)号：US09197155B2
公开(公告)日：2015-11-24
申请号：US12529685
申请日：2008-08-25
Applicant: Jun Ishida , Kenji Hamano
Inventor： Jun Ishida , Kenji Hamano
CPC classification number: H02S40/345 , H02B1/01
Abstract: In a terminal plate circuit in which the bottom surface of the diode is attached to the surface of the terminal plate with solder so as to dissipate the heat of the diode, heat transfer from the diode to the terminal plate is facilitated by removing the air bubbles in the solder during the soldering. A terminal plate circuit configured in such a manner that a metal part of a bottom surface of a diode of surface mounting type is soldered onto a surface of a terminal plate that is larger than the metal part, characterized in that streaks consisting of a plurality of lines that do not intersect with each other are formed on the surface of the terminal plate onto which the diode is to be soldered, whereby air bubbles generated within the solder during the soldering are let to escape from a lower surface of the diode to outside through the streaks. This terminal plate circuit is suitable for the use in a terminal box for solar cell panel.
Abstract translation: 在二极管的底表面用焊料附着到端子板的表面以便散发二极管的热量的端子板电路中，通过去除气泡来促进从二极管到端子板的传热 在焊锡时焊接。 一种端子板电路，其构造为使得表面安装型二极管的底面的金属部分焊接到比金属部分大的端子板的表面上，其特征在于，由多个 在要焊接二极管的端子板的表面上形成彼此不相交的线，由此在焊接期间在焊料内产生的气泡从二极管的下表面逸出到外部 条纹。 该端子板电路适用于太阳能电池板的接线盒。
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公开(公告)号：US08237065B2
公开(公告)日：2012-08-07
申请号：US12513490
申请日：2008-01-25
Applicant: Jun Ishida , Kenji Hamano , Masayuki Kusumoto
Inventor： Jun Ishida , Kenji Hamano , Masayuki Kusumoto
CPC classification number: H01L23/49562 , H01L23/49575 , H01L24/40 , H01L24/41 , H01L24/48 , H01L25/072 , H01L2224/40137 , H01L2224/40247 , H01L2224/48095 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H02S40/345 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
Abstract: The present invention provides a diode that does not deteriorate its function even if it is used in an environment where the temperature change is considerable, such as in a terminal box for solar cell panel that is placed outdoors. A diode of twin-chip-mounting type in which each chip has a lead foot for being joined to a common terminal plate, wherein said lead feet are electrically connected with each other in a region of each lead foot from each chip to a portion wherein each lead foot is joined. The electrical connection of the lead feet is preferably formed by integral molding with each lead foot.
Abstract translation: 本发明提供即使在温度变化大的环境中使用也不会使其功能劣化的二极管，例如在放置在室外的太阳能电池面板用接线盒中。 一种双芯片安装型二极管，其中每个芯片具有用于连接到公共端子板的引脚，其中所述引脚在每个引脚的每个芯片的区域中彼此电连接到其中 每个引脚连接在一起。 引脚的电连接优选通过与每个引脚一体成型而形成。
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公开(公告)号：US20100170716A1
公开(公告)日：2010-07-08
申请号：US12664140
申请日：2008-06-24
Applicant: Jun Ishida , Kenji Hamano
Inventor： Jun Ishida , Kenji Hamano
IPC: H01R4/02
CPC classification number: H01R4/4818 , H01L31/02013 , H02S40/34 , Y02E10/50
Abstract: The present invention provides a terminal plate circuit in which the reliability of an electrical connection state between a terminal plate and a rectangular wire is enhanced by a simple method. The present invention is a terminal plate circuit including a terminal plate, a rectangular wire, and a pressing member, characterized in that a hole through which the rectangular wire penetrates is provided in the terminal plate; the rectangular wire is inserted into this hole so as to establish an electrical contact between the terminal plate and the rectangular wire; and the contact state is maintained by a pressing force of the pressing member to the part of the surface of the rectangular wire on the side opposite to the part of the surface of the rectangular wire that is in contact with the terminal plate, and that the pressing member has a sandwiching part that can sandwich the end of the terminal plate, and the pressing force of the pressing member to the rectangular wire is generated by sandwiching the end of the terminal plate with this sandwiching part. Preferably, soldering or welding is carried out so as to cover a part at which the terminal plate and the rectangular wire are in electrical contact with each other.
Abstract translation: 本发明提供了一种端子板电路，其中通过简单的方法增强了端子板和矩形导线之间的电连接状态的可靠性。 本发明是一种端子板电路，其包括端子板，矩形电线和按压部件，其特征在于，在所述端子板上设置有矩形电线穿过的孔。 将矩形线插入该孔中，以在端子板和矩形线之间建立电接触; 并且通过按压构件对矩形线的表面的与端子板接触的矩形线的表面的部分相对的一侧的一部分的压力来保持接触状态，并且 按压构件具有可以夹持端子板的端部的夹持部，并且通过将端子板的端部夹在该夹持部上而产生按压构件到矩形线的按压力。 优选地，进行焊接或焊接以覆盖端子板和矩形电线彼此电接触的部分。
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公开(公告)号：US20100084183A1
公开(公告)日：2010-04-08
申请号：US12513490
申请日：2008-01-25
Applicant: Jun Ishida , Kenji Hamano , Masayuki Kusumoto
Inventor： Jun Ishida , Kenji Hamano , Masayuki Kusumoto
CPC classification number: H01L23/49562 , H01L23/49575 , H01L24/40 , H01L24/41 , H01L24/48 , H01L25/072 , H01L2224/40137 , H01L2224/40247 , H01L2224/48095 , H01L2224/48247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H02S40/345 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
Abstract: The present invention provides a diode that does not deteriorate its function even if it is used in an environment where the temperature change is considerable, such as in a terminal box for solar cell panel that is placed outdoors. A diode of twin-chip-mounting type in which each chip has a lead foot for being joined to a common terminal plate, wherein said lead feet are electrically connected with each other in a region of each lead foot from each chip to a portion wherein each lead foot is joined. The electrical connection of the lead feet is preferably formed by integral molding with each lead foot.
Abstract translation: 本发明提供即使在温度变化大的环境中使用也不会使其功能劣化的二极管，例如在放置在室外的太阳能电池面板用接线盒中。 一种双芯片安装型二极管，其中每个芯片具有用于连接到公共端子板的引脚，其中所述引脚在每个引脚的每个芯片的区域中彼此电连接到其中 每个引脚连接在一起。 引脚的电连接优选通过与每个引脚一体成型而形成。
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公开(公告)号：US07955118B2
公开(公告)日：2011-06-07
申请号：US12664140
申请日：2008-06-24
Applicant: Jun Ishida , Kenji Hamano
Inventor： Jun Ishida , Kenji Hamano
IPC: H01R4/48
CPC classification number: H01R4/4818 , H01L31/02013 , H02S40/34 , Y02E10/50
Abstract: A terminal plate circuit including a terminal plate, a rectangular wire, and a pressing member, characterized in that a hole through which the rectangular wire penetrates is provided in the terminal plate; the rectangular wire is inserted into this hole so as to establish an electrical contact between the terminal plate and the rectangular wire; and the contact state is maintained by a pressing force of the pressing member to the part of the surface of the rectangular wire on the side opposite to the part of the surface of the rectangular wire that is in contact with the terminal plate, and that the pressing member has a sandwiching part that can sandwich the end of the terminal plate, and the pressing force of the pressing member to the rectangular wire is generated by sandwiching the end of the terminal plate with this sandwiching part.
Abstract translation: 一种端子板电路，包括端子板，矩形线和按压构件，其特征在于，在所述端子板中设置有所述矩形电线穿过的孔。 将矩形线插入该孔中，以在端子板和矩形线之间建立电接触; 并且通过按压构件对矩形线的表面的与端子板接触的矩形线的表面的部分相对的一侧的一部分的压力来保持接触状态，并且 按压构件具有可以夹持端子板的端部的夹持部，并且通过将端子板的端部夹在该夹持部上而产生按压构件到矩形线的按压力。
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Patent Agency Ranking
公开(公告)号：US20100110639A1
公开(公告)日：2010-05-06
申请号：US12529685
申请日：2008-08-25
Applicant: Jun Ishida , Kenji Hamano
Inventor： Jun Ishida , Kenji Hamano
IPC: H05K7/20
CPC classification number: H02S40/345 , H02B1/01
Abstract: In a terminal plate circuit in which the bottom surface of the diode is attached to the surface of the terminal plate with solder so as to dissipate the heat of the diode, heat transfer from the diode to the terminal plate is facilitated by removing the air bubbles in the solder during the soldering. A terminal plate circuit configured in such a manner that a metal part of a bottom surface of a diode of surface mounting type is soldered onto a surface of a terminal plate that is larger than the metal part, characterized in that streaks consisting of a plurality of lines that do not intersect with each other are formed on the surface of the terminal plate onto which the diode is to be soldered, whereby air bubbles generated within the solder during the soldering are let to escape from a lower surface of the diode to outside through the streaks. This terminal plate circuit is suitable for the use in a terminal box for solar cell panel.
Abstract translation: 在二极管的底表面用焊料附着到端子板的表面以便散发二极管的热量的端子板电路中，通过去除气泡来促进从二极管到端子板的传热 在焊锡时焊接。 一种端子板电路，其构造为使得表面安装型二极管的底面的金属部分焊接到比金属部分大的端子板的表面上，其特征在于，由多个 在要焊接二极管的端子板的表面上形成彼此不相交的线，由此在焊接期间在焊料内产生的气泡从二极管的下表面逸出到外部 条纹。 该端子板电路适用于太阳能电池板的接线盒。
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7.发明授权公开(公告)号：US08481210B2
公开(公告)日：2013-07-09
申请号：US12944952
申请日：2010-11-12
Applicant: Jun Ishida , Yoshifumi Magari , Shigekazu Yasuoka
Inventor： Jun Ishida , Yoshifumi Magari , Shigekazu Yasuoka
CPC classification number: C22C19/03 , C22C19/058 , C22F1/10 , H01M4/242 , H01M4/383 , H01M10/30 , Y02E60/124
Abstract: An alkaline storage battery has a negative electrode using a hydrogen-absorbing alloy represented by a general formula Ln1-xMgxNiyAz wherein Ln is at least one element selected from rare-earth elements including Y, Ca, Zr, and Ti, A is at least one element selected from Co, Fe, Mn, V, Cr, Nb, Al, Ga, Zn, Sn, Cu, Si, P and B, and 0.15≦x≦0.30, 0
Abstract translation: 碱性蓄电池具有使用由通式Ln1-xMgxNiyAz表示的吸氢合金的负极，其中Ln是选自Y，Ca，Zr和Ti的稀土元素中的至少一种元素，A是至少一种 选自Co，Fe，Mn，V，Cr，Nb，Al，Ga，Zn，Sn，Cu，Si，P和B的元素，以及0.15 @ x @ 0.30,0
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8.发明授权Method of making hydrogen-absorbing alloy for alkaline storage battery, and alkaline storage battery 有权制备碱性蓄电池用吸氢合金和碱性蓄电池的方法公开(公告)号：US08317950B2
公开(公告)日：2012-11-27
申请号：US12232129
申请日：2008-09-11
Applicant: Yoshifumi Magari , Jun Ishida , Shigekazu Yasuoka
Inventor： Yoshifumi Magari , Jun Ishida , Shigekazu Yasuoka
IPC: C22F1/10
CPC classification number: H01M4/383 , C22C19/007 , C22C19/03 , H01M10/345 , Y02E60/124 , Y02P70/54
Abstract: A hydrogen-absorbing alloy for alkaline storage battery which is produced by a rapid cool using a rapid quenching method and whose component is represented by a general formula Ln1-xMgxNia-b-cAlbZc is used for a negative electrode of an alkaline storage battery.
Abstract translation: 碱性蓄电池的负极使用通过快速冷却法快速冷却而制成的碱性蓄电池用吸氢合金，其成分用通式Ln1-xMgxNia-b-cAlbZc表示。
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公开(公告)号：US08101121B2
公开(公告)日：2012-01-24
申请号：US10743745
申请日：2003-12-24
Applicant: Shigekazu Yasuoka , Jun Ishida , Tetsuyuki Murata , Hiroshi Nakamura
Inventor： Shigekazu Yasuoka , Jun Ishida , Tetsuyuki Murata , Hiroshi Nakamura
CPC classification number: H01M10/26 , H01M4/0471 , H01M4/383 , H01M4/52 , H01M10/342 , Y02E60/124
Abstract: A hydrogen absorbing alloy represented by the formula Ln1−xMgxNiy−aAla (where Ln is at least one element selected from rare earth elements, 0.05≦x
Abstract translation: 由式Ln1-xMgxNiy-aAla表示的吸氢合金（其中Ln为选自稀土元素中的至少一种元素，0.05≤n1E; x <0.20，2.8＆nlE; y＆nlE; 3.9和0.10＆nlE; a＆nlE; 0.25） 用于碱性蓄电池。
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10.发明申请公开(公告)号：US20100081053A1
公开(公告)日：2010-04-01
申请号：US12588015
申请日：2009-09-30
Applicant: Jun Ishida
Inventor： Jun Ishida
CPC classification number: H01M4/242 , H01M4/366 , H01M4/383 , H01M4/385 , H01M4/46 , H01M10/345 , Y02E60/124 , Y02P70/54
Abstract: A negative electrode for alkaline storage batteries uses a hydrogen-absorbing alloy represented by the general formula Ln1-xMgxNiy-a-bAlaMb, having a crystal structure other than CaCu5 type. First to third layers S1 to S3 are formed on the surface of the bulk phase B of the hydrogen-absorbing alloy. The first layer closest to the bulk phase contains oxygen in a greater amount than the second layer located on the first layer, and contains at least one element soluble in an alkaline solution in an amount of 10 atom % or greater. The second layer located on the first layer has a Ni content higher than that of the bulk phase. The third layer located on the second layer has a NiO content higher than the NiO content in the second layer.
Abstract translation: 碱性蓄电池用负极使用具有CaCu5型以外的晶体结构的通式Ln1-xMgxNiy-a-bAlaMb表示的吸氢合金。 在吸氢合金的体相B的表面上形成有第一至第三层S1至S3。 最靠近体相的第一层含有比位于第一层上的第二层更大量的氧，并且含有至少一种可溶于碱性溶液的元素，其量为10原子％或更大。 位于第一层上的第二层的Ni含量高于体相。 位于第二层上的第三层的NiO含量高于第二层中的NiO含量。
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