公开(公告)号：US08057017B2

公开(公告)日：2011-11-15

申请号：US12878339

申请日：2010-09-09

申请人： Toshiyasu Sakai ,  Shuji Koyama ,  Kenji Ono ,  Jun Yamamuro

发明人： Toshiyasu Sakai ,  Shuji Koyama ,  Kenji Ono ,  Jun Yamamuro

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1645 ,  H01L21/76898

摘要： A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.

摘要翻译： 一种用于喷墨头的基​​板的制造方法，包括在硅基板中形成供墨口，该方法包括以下步骤：在基板的一侧上形成在相应位置具有开口的蚀刻掩模层 供墨口; 通过蚀刻掩模层的开口沿开口的纵向至少两行形成未穿透孔的步骤; 以及通过在开口中的基板的晶体各向异性蚀刻形成供墨口的步骤。

公开(公告)号：US07824560B2

公开(公告)日：2010-11-02

申请号：US11679656

申请日：2007-02-27

申请人： Toshiyasu Sakai ,  Shuji Koyama ,  Kenji Ono ,  Jun Yamamuro

发明人： Toshiyasu Sakai ,  Shuji Koyama ,  Kenji Ono ,  Jun Yamamuro

IPC分类号： B41J2/16

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1645 ,  H01L21/76898

摘要： A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.

摘要翻译： 一种用于喷墨头的基​​板的制造方法，包括在硅基板中形成供墨口，该方法包括以下步骤：在基板的一侧上形成在相应位置具有开口的蚀刻掩模层 供墨口; 通过蚀刻掩模层的开口沿开口的纵向至少两行形成未穿透孔的步骤; 以及通过在开口中的基板的晶体各向异性蚀刻形成供墨口的步骤。

公开(公告)号：US20070212891A1

公开(公告)日：2007-09-13

申请号：US11681411

申请日：2007-03-02

申请人： Jun Yamamuro ,  Shuji Koyama ,  Kenji Ono ,  Toshiyasu Sakai

发明人： Jun Yamamuro ,  Shuji Koyama ,  Kenji Ono ,  Toshiyasu Sakai

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1645 ,  Y10T29/49401

摘要： The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.

摘要翻译： 本发明提供一种喷墨头用基板的制造方法，其特征在于，包括：（a）在所述硅基板的背面形成有具有开口部的蚀刻掩模层 在硅基板的要形成供墨口的表面上的区域的沿长度方向延伸的中心线是不对称的; （b）通过蚀刻掩模层上的开口在硅衬底上形成非通孔; 和（c）通过从开口对硅衬底进行结晶各向异性蚀刻来形成供墨口。

公开(公告)号：US07727411B2

公开(公告)日：2010-06-01

申请号：US11681411

申请日：2007-03-02

申请人： Jun Yamamuro ,  Shuji Koyama ,  Kenji Ono ,  Toshiyasu Sakai

发明人： Jun Yamamuro ,  Shuji Koyama ,  Kenji Ono ,  Toshiyasu Sakai

IPC分类号： B41J2/16

CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1645 ,  Y10T29/49401

摘要： The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.

摘要翻译： 本发明提供一种喷墨头用基板的制造方法，其特征在于，包括：（a）在所述硅基板的背面形成有具有开口部的蚀刻掩模层 在硅基板的要形成供墨口的表面上的区域的沿长度方向延伸的中心线是不对称的; （b）通过蚀刻掩模层上的开口在硅衬底上形成非通孔; 和（c）通过从开口对硅衬底进行结晶各向异性蚀刻来形成供墨口。

公开(公告)号：US20110020966A1

公开(公告)日：2011-01-27

申请号：US12839301

申请日：2010-07-19

申请人： Mitsuru Chida ,  Keiji Edamatsu ,  Toshiyasu Sakai ,  Jun Yamamuro

发明人： Mitsuru Chida ,  Keiji Edamatsu ,  Toshiyasu Sakai ,  Jun Yamamuro

IPC分类号： H01L21/306

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1645

摘要： A method for processing a silicon substrate includes preparing a first silicon substrate including an etching mask layer including first and second opening portions; forming a first recess in a portion of the silicon substrate corresponding to a region in the first opening portion; etching the silicon substrate by crystal anisotropic etching through the etching mask layer with an etching apparatus and an etchant, the etching proceeding in the first and second opening portions to form a through hole in a position corresponding to the first opening portion and to form a second recess in a position corresponding to the second opening portion; calculating an etching rate of the silicon substrate in terms of the etchant by using the second recess; and determining, by using the calculated etching rate, an etching condition for etching another silicon substrate with the etching apparatus after the etching of the first silicon substrate.

摘要翻译： 一种处理硅衬底的方法包括：制备包含第一和第二开口部分的蚀刻掩模层的第一硅衬底; 在所述硅衬底的与所述第一开口部分中的区域相对应的部分中形成第一凹部; 通过蚀刻装置和蚀刻剂通过蚀刻掩模层通过晶体各向异性蚀刻来蚀刻硅衬底，蚀刻在第一和第二开口部分中进行，以在对应于第一开口部分的位置形成通孔，并形成第二 在与第二开口部相对应的位置处凹陷; 通过使用第二凹槽计算蚀刻剂方面的硅衬底的蚀刻速率; 以及通过使用所计算的蚀刻速率，在蚀刻所述第一硅衬底之后，使用所述蚀刻装置来确定用于蚀刻另一硅衬底的蚀刻条件。

公开(公告)号：US08366950B2

公开(公告)日：2013-02-05

申请号：US12204802

申请日：2008-09-05

申请人： Mitsuru Chida ,  Toshiyasu Sakai ,  Noriyasu Ozaki ,  Hiroyuki Abo ,  Kazuya Abe ,  Kenji Ono

发明人： Mitsuru Chida ,  Toshiyasu Sakai ,  Noriyasu Ozaki ,  Hiroyuki Abo ,  Kazuya Abe ,  Kenji Ono

IPC分类号： G01D15/00

CPC分类号： B41J2/14145 ,  B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1645

摘要： A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

摘要翻译： 提供一种制造包括具有用于供应液体的供给口的硅基板的液体喷射头基板的方法。 该方法包括：在硅衬底的表面上形成蚀刻掩模层，该蚀刻掩模层在与供给口对应的部分中具有开口; 通过在蚀刻掩模层中的开口各向异性蚀刻硅衬底，在硅衬底的表面中形成第一凹槽; 形成在所述硅衬底的所述第一凹部的表面中朝向所述硅衬底的另一表面延伸的第二凹部; 以及通过从设置有所述第二凹部的表面各向异性地蚀刻所述硅衬底而形成所述供给口。

公开(公告)号：US07566116B2

公开(公告)日：2009-07-28

申请号：US11264160

申请日：2005-11-02

申请人： Ichiro Saito ,  Toshiyasu Sakai ,  Teruo Ozaki ,  Sakai Yokoyama ,  Kenji Ono ,  Satoshi Ibe ,  Kazuaki Shibata

发明人： Ichiro Saito ,  Toshiyasu Sakai ,  Teruo Ozaki ,  Sakai Yokoyama ,  Kenji Ono ,  Satoshi Ibe ,  Kazuaki Shibata

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/14129 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2/1645 ,  B41J2/1646 ,  B41J2202/03 ,  H05K1/167

摘要： In an ink jet head circuit board including a heater for generating thermal energy used for ejecting ink in response to application of electricity, a drop in thermal energy efficiency is prevented while reducing an area of the heater to achieve higher-resolution and higher-image-quality printing, and damages on the heater attributable to a manufacturing process are avoided. To achieve this, a resistor layer is disposed on an electrode wire layer; and two protective layers are disposed thereon. Then the upper protective layer is removed in a site above the heater. Accordingly, it is possible to dispose the protective layers without causing a decrease in an effective bubble generating region, and to improve thermal energy efficiency by reducing the effective thickness of the protective layer above the heater. Moreover, the resistor layer is covered with the first protective layer and is thereby prevented from adverse effects in the manufacturing process such as etching processes.

摘要翻译： 在包括用于响应于施加电力而产生用于喷射墨水的热能的加热器的喷墨头电路板中，防止了热能效率的降低，同时减少了加热器的面积以实现更高分辨率和更高成像效果， 避免了由于制造过程而产生的高质量打印和加热器的损坏。 为了实现这一点，在电极线层上设置电阻层; 并且在其上设置两个保护层。 然后在加热器上方的位置移除上保护层。 因此，可以在不引起有效气泡生成区域的降低的情况下设置保护层，并且通过减小加热器上方的保护层的有效厚度来提高热能效率。 此外，电阻层被第一保护层覆盖，从而防止了诸如蚀刻工艺的制造过程中的不利影响。

公开(公告)号：US07533969B2

公开(公告)日：2009-05-19

申请号：US11407980

申请日：2006-04-21

申请人： Teruo Ozaki ,  Ichiro Saito ,  Sakai Yokoyama ,  Kenji Ono ,  Satoshi Ibe ,  Kazuaki Shibata ,  Toshiyasu Sakai

发明人： Teruo Ozaki ,  Ichiro Saito ,  Sakai Yokoyama ,  Kenji Ono ,  Satoshi Ibe ,  Kazuaki Shibata ,  Toshiyasu Sakai

IPC分类号： B41J2/05

CPC分类号： B41J2/14 ,  B41J2202/17 ,  Y10T29/49401

摘要： An ink jet print head substrate capable of precisely blowing fuse element to store data reliably is provided. An ink jet print head incorporating such a substrate and an ink jet printing apparatus are also provided. The interlayer insulating film formed over the fuse element is made of a material that has a lower melting point than the material of the fuse element and which forms a cavity therein by heat produced when the fuse elements is blown.

摘要翻译： 提供一种能够精确地熔断熔丝元件以可靠地存储数据的喷墨打印头基板。 还提供了一种并入这种基板的喷墨打印头和喷墨打印设备。 形成在保险丝元件上方的层间绝缘膜由具有比熔丝元件的材料低的熔点并且当熔丝元件被吹制时产生的热量在其中形成空腔的材料制成。

公开(公告)号：US20090065474A1

公开(公告)日：2009-03-12

申请号：US12204802

申请日：2008-09-05

申请人： Mitsuru Chida ,  Toshiyasu Sakai ,  Noriyasu Ozaki ,  Hiroyuki Abo ,  Kazuya Abe ,  Kenji Ono

发明人： Mitsuru Chida ,  Toshiyasu Sakai ,  Noriyasu Ozaki ,  Hiroyuki Abo ,  Kazuya Abe ,  Kenji Ono

IPC分类号： B41J2/16

CPC分类号： B41J2/14145 ,  B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1639 ,  B41J2/1645

摘要： A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

摘要翻译： 提供一种制造包括具有用于供应液体的供给口的硅基板的液体喷射头基板的方法。 该方法包括：在硅衬底的表面上形成蚀刻掩模层，该蚀刻掩模层在与供给口对应的部分中具有开口; 通过在蚀刻掩模层中的开口各向异性蚀刻硅衬底，在硅衬底的表面中形成第一凹槽; 形成在所述硅衬底的所述第一凹部的表面中朝向所述硅衬底的另一表面延伸的第二凹部; 以及通过从设置有所述第二凹部的表面各向异性地蚀刻所述硅衬底而形成所述供给口。

公开(公告)号：US07338150B2

公开(公告)日：2008-03-04

申请号：US11746251

申请日：2007-05-09

申请人： Satoshi Ibe ,  Teruo Ozaki ,  Yoshiyuki Imanaka ,  Takuya Hatsui ,  Kenji Ono ,  Ichiro Saito ,  Sakai Yokoyama ,  Toshiyasu Sakai ,  Kazuaki Shibata

发明人： Satoshi Ibe ,  Teruo Ozaki ,  Yoshiyuki Imanaka ,  Takuya Hatsui ,  Kenji Ono ,  Ichiro Saito ,  Sakai Yokoyama ,  Toshiyasu Sakai ,  Kazuaki Shibata

IPC分类号： B41J2/06 ,  B41J2/05

CPC分类号： B41J2/1643 ,  B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1645 ,  H05K3/244

摘要： A number of steps is reduced by manufacturing an electrode pad connecting a liquid discharge head to an external wiring by the same step of a common wiring for supplying an electric power to a discharge energy generating portion. A number of manufacturing steps of a head is reduced by forming a substrate for a liquid discharge head having an electrode pad and a common wiring for supplying an electric power to a discharge energy as a metal film made of the same material as the electrode pad in accordance with a plating in a step of forming the common wiring of the metal film in accordance with a plating.

摘要翻译： 通过与向放电能量产生部分供电的公共布线相同的步骤制造将液体排出头连接到外部布线的电极焊盘来减少多个步骤。 通过形成用于具有电极焊盘的液体排出头的基板和用于向作为与电极焊盘相同材料制成的金属膜的放电能量提供电力的公共布线来减少头部的制造步骤 根据在电镀中形成金属膜的公共布线的步骤中的电镀。