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公开(公告)号:US08354711B2
公开(公告)日:2013-01-15
申请号:US12806203
申请日:2010-01-11
IPC分类号: H01L29/76
CPC分类号: H01L29/7813 , H01L21/26586 , H01L29/0623 , H01L29/0634 , H01L29/0638 , H01L29/0878 , H01L29/402 , H01L29/407 , H01L29/41766 , H01L29/42368 , H01L29/66727 , H01L29/66734 , H01L29/7811
摘要: Improved MOSFET structures and processes, where multiple polysilicon embedded regions are introduced into the n+ source contact area. A top poly Field Plate is used to shield the electric field from penetrating into the channel, so that a very short channel can be used without jeopardizing the device drain-source leakage current. A bottom poly Field Plate is used to modulate the electric field distribution in the drift region such that a more uniform field distribution can be obtained.
摘要翻译: 改进的MOSFET结构和工艺,其中多个多晶硅嵌入区域被引入到n +源极接触区域。 顶部聚场板用于屏蔽电场穿透通道,使得可以使用非常短的通道,而不会危及器件漏源漏电流。 底部多场板用于调制漂移区域中的电场分布,使得可以获得更均匀的场分布。