公开(公告)号：US20070069345A1

公开(公告)日：2007-03-29

申请号：US11312461

申请日：2005-12-21

Applicant: Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Ku ,  Yu-Li Chung

Inventor： Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Ku ,  Yu-Li Chung

IPC: H01L23/495

CPC classification number: H01L23/4334 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a package of a leadframe with heatsinks. The package of the invention comprises a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions are corresponding to the first positioning portions of the first heatsink, whereby the warped problem of the leadframe will be resolved.

Abstract translation: 本发明涉及具有散热片的引线框的封装。 本发明的封装包括引线框架，模具，第一散热器和第二散热器。 引线框架具有管芯焊盘和多个引线，并且引线设置在管芯焊盘周围。 芯片设置在芯片上。 第一散热器设置在引线框架的第一侧上并且具有多个第一定位部分。 第二散热器设置在引线框架的第二侧上。 第二散热器具有多个第二定位部。 第二定位部分对应于第一散热器的第一定位部分，由此可以解决引线框架的翘曲问题。

公开(公告)号：US07365422B2

公开(公告)日：2008-04-29

申请号：US11312461

申请日：2005-12-21

Applicant: Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Kinhang Ku ,  Yu-Li Chung

Inventor： Pai-Chou Liu ,  Jun-Cheng Liu ,  Kenneth Kinhang Ku ,  Yu-Li Chung

IPC: H01L23/10 ,  H05K7/20

CPC classification number: H01L23/4334 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package of a leadframe with heatsinks, including a leadframe, a die, a first heatsink and a second heatsink. The leadframe has a die pad and a plurality of leads, and the leads are disposed around the die pad. The die is disposed on the die pad. The first heatsink is disposed on a first side of the leadframe and has a plurality of first positioning portions. The second heatsink is disposed on a second side of the leadframe. The second heatsink has a plurality of second positioning portions. The second positioning portions correspond to the first positioning portions of the first heatsink, whereby the warping problem of the leadframe is resolved.

Abstract translation: 具有散热器的引线框的封装，包括引线框，模具，第一散热器和第二散热器。 引线框架具有管芯焊盘和多个引线，并且引线设置在管芯焊盘周围。 芯片设置在芯片上。 第一散热器设置在引线框架的第一侧上并且具有多个第一定位部分。 第二散热器设置在引线框架的第二侧上。 第二散热器具有多个第二定位部。 第二定位部分对应于第一散热器的第一定位部分，由此解决引线框架的翘曲问题。

公开(公告)号：US20060197218A1

公开(公告)日：2006-09-07

申请号：US11164822

申请日：2005-12-07

Applicant: Jun-Cheng Liu

Inventor： Jun-Cheng Liu

IPC: H01L23/34

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package structure is provided, including a package substrate, a chip, a heat spreader, and a molding compound. The chip is disposed on a surface of the package substrate, and electrically connected thereof. The heat spreader is disposed on the surface of the package substrate, and the heat spreader includes a coating layer, a top portion and a support portion connected to the edge of the top portion. The top portion is above the chip, and the coating layer is only disposed on the surface of the top portion far away from the chip. The surface of the heat spreader uncovered by the coating layer is treated with an oxidization treatment. The support portion is in contact with the package substrate. The molding compound is disposed on the surface of the package substrate and envelopes the chip and the support portion but exposing the coating layer.

Abstract translation: 提供了一种芯片封装结构，包括封装衬底，芯片，散热器和模塑料。 芯片设置在封装基板的表面上并与其电连接。 散热器设置在封装基板的表面上，散热器包括连接到顶部的边缘的涂层，顶部和支撑部分。 顶部位于芯片上方，涂层仅设置在远离芯片的顶部表面上。 被涂层未覆盖的散热器的表面用氧化处理。 支撑部分与封装基板接触。 成型化合物设置在封装基板的表面上并包封芯片和支撑部分，但是暴露涂层。

公开(公告)号：US08800638B2

公开(公告)日：2014-08-12

申请号：US11514878

申请日：2006-09-05

Applicant: Jun-Cheng Liu ,  Cheng-Cheng Liu

Inventor： Jun-Cheng Liu ,  Cheng-Cheng Liu

IPC: F28F7/00

CPC classification number: H01L23/3672 ,  F28D2021/0029 ,  H01L23/04 ,  H01L23/3675 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heatsink and a heatsink-positioning system. The heatsink-positioning system includes a heatsink and a positioning device. The heatsink includes a circular top, a ring-shaped sidewall and a plurality of foot portions. The ring-shaped sidewall connects to the circular top and extends away from the circular top. The ring-shaped sidewall has at least one first positioning portion used for fixing the heatsink. The foot portions connect to the ring-shaped sidewall and extend away from the ring-shaped sidewall. Each foot portion has an opening. The positioning device has at least one second positioning portion corresponding to the first positioning portion and is used for fixing the first positioning portion. By utilizing the heatsink-positioning system, the problem of displacement of the heatsink can be improved.

Abstract translation: 散热器和散热器定位系统。 散热器定位系统包括散热器和定位装置。 散热器包括圆形顶部，环形侧壁和多个脚部。 环形侧壁连接到圆形顶部并远离圆形顶部延伸。 环形侧壁具有用于固定散热器的至少一个第一定位部分。 脚部连接到环形侧壁并远离环形侧壁延伸。 每个脚部都有一个开口。 定位装置具有与第一定位部对应的至少一个第二定位部，并且用于固定第一定位部。 通过利用散热器定位系统，可以提高散热器的位移问题。

公开(公告)号：US20070240848A1

公开(公告)日：2007-10-18

申请号：US11514878

申请日：2006-09-05

Applicant: Jun-Cheng Liu ,  Cheng-Cheng Liu

Inventor： Jun-Cheng Liu ,  Cheng-Cheng Liu

IPC: F28F9/00 ,  F28F7/00

CPC classification number: H01L23/3672 ,  F28D2021/0029 ,  H01L23/04 ,  H01L23/3675 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a heatsink and a heatsink-positioning system. The heatsink-positioning system comprises a heatsink and a positioning device. The heatsink comprises a circular top, a ring-shaped sidewall and a plurality of foot portions. The ring-shaped sidewall connects to the circular top and extends away from the circular top. The ring-shaped sidewall has at least one first positioning portion used for fixing the heatsink. The foot portions connect to the ring-shaped sidewall and extend away from the ring-shaped sidewall. Each foot portion has an opening. The positioning device has at least one second positioning portion corresponding to the first positioning portion and is used for fixing the first positioning portion. By utilizing the heatsink-positioning system of the invention, the problem of displacement of the heatsink can be improved.

Abstract translation: 本发明涉及一种散热器和散热器定位系统。 散热器定位系统包括散热器和定位装置。 散热器包括圆形顶部，环形侧壁和多个脚部。 环形侧壁连接到圆形顶部并远离圆形顶部延伸。 环形侧壁具有用于固定散热器的至少一个第一定位部分。 脚部连接到环形侧壁并远离环形侧壁延伸。 每个脚部都有一个开口。 定位装置具有与第一定位部对应的至少一个第二定位部，并且用于固定第一定位部。 通过利用本发明的散热器定位系统，可以提高散热器的位移问题。