公开(公告)号：US08470914B2

公开(公告)日：2013-06-25

申请号：US12861761

申请日：2010-08-23

申请人： Jung Ho Jo ,  Kyung Jun Kim ,  Hye Ran Seong ,  Hye Won Jeong ,  Chan Hyo Park ,  Yu Na Kim ,  Sang Woo Kim ,  Se Jin Shin ,  Kyoung Ho Ahn

发明人： Jung Ho Jo ,  Kyung Jun Kim ,  Hye Ran Seong ,  Hye Won Jeong ,  Chan Hyo Park ,  Yu Na Kim ,  Sang Woo Kim ,  Se Jin Shin ,  Kyoung Ho Ahn

IPC分类号： C08L79/08 ,  C08G69/26 ,  C08K5/41

CPC分类号： G03F7/0233 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/16 ,  C08L79/08 ,  G03F7/0048

摘要： The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.

摘要翻译： 本发明涉及由化学式1或2表示的聚酰亚胺或其前体和包含其的感光性树脂组合物。 聚酰亚胺或其前体使用包含聚环氧烷的二胺制造。 本发明的感光性树脂组合物具有优异的透光性，优异的分辨率，优异的光敏性和成像性能。 此外，感光性树脂组合物与硅膜，氧化硅膜，金属膜等基材的粘合性高。 特别地，可以形成无破裂的优异的膜，例如裂纹。

公开(公告)号：US20120301826A1

公开(公告)日：2012-11-29

申请号：US13568911

申请日：2012-08-07

申请人： Chan Hyo Park ,  Sang Woo Kim ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

发明人： Chan Hyo Park ,  Sang Woo Kim ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

IPC分类号： C08G73/10 ,  G03F7/004 ,  C08G77/26

CPC分类号： G03F7/0233 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08L79/08 ,  G03F7/0045 ,  Y10S430/107

摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

摘要翻译： 提供了聚酰亚胺基聚合物及其共聚物。 还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。 光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

公开(公告)号：US08669038B2

公开(公告)日：2014-03-11

申请号：US13568911

申请日：2012-08-07

申请人： Chan Hyo Park ,  Sang Woo Kim ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

发明人： Chan Hyo Park ,  Sang Woo Kim ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

IPC分类号： G03F7/023

CPC分类号： G03F7/0233 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08L79/08 ,  G03F7/0045 ,  Y10S430/107

摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

摘要翻译： 提供了聚酰亚胺基聚合物及其共聚物。 还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。 光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

公开(公告)号：US08257901B2

公开(公告)日：2012-09-04

申请号：US12720364

申请日：2010-03-09

申请人： Sang Woo Kim ,  Chan Hyo Park ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

发明人： Sang Woo Kim ,  Chan Hyo Park ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

IPC分类号： G03F7/023 ,  C08G69/32

CPC分类号： G03F7/0233 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08L79/08 ,  G03F7/0045 ,  Y10S430/107

摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

摘要翻译： 提供了聚酰亚胺基聚合物及其共聚物。 还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。 光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

公开(公告)号：US20100233618A1

公开(公告)日：2010-09-16

申请号：US12720364

申请日：2010-03-09

申请人： Sang Woo KIM ,  Chan Hyo Park ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

发明人： Sang Woo KIM ,  Chan Hyo Park ,  Kyung Jun Kim ,  Hye Ran Seong ,  Se Jin Shin ,  Dong Hyun Oh

IPC分类号： G03F7/004 ,  C08G73/10

CPC分类号： G03F7/0233 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1064 ,  C08L79/08 ,  G03F7/0045 ,  Y10S430/107

摘要： Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

摘要翻译： 提供了聚酰亚胺基聚合物及其共聚物。 还提供了包含作为粘合剂树脂的至少一种聚酰亚胺基聚合物及其共聚物的正型光致抗蚀剂组合物。 光致抗蚀剂组合物显示出形成半导体缓冲涂层所需的高分辨率，高灵敏度，优异的膜特性和改进的机械性能。

公开(公告)号：US09133353B2

公开(公告)日：2015-09-15

申请号：US13182012

申请日：2011-07-13

申请人： Sang Woo Kim ,  Se Jin Shin ,  Dong Hyun Oh ,  Kyung Jun Kim

发明人： Sang Woo Kim ,  Se Jin Shin ,  Dong Hyun Oh ,  Kyung Jun Kim

IPC分类号： C09D11/101 ,  C08G73/10 ,  G03F7/023 ,  G03F7/00

CPC分类号： C09D11/101 ,  C08G73/1032 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  G03F7/0007 ,  G03F7/0233

摘要： In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.

摘要翻译： 在二胺和二酐反应制备聚酰亚胺树脂的方法中，聚酰亚胺树脂在沸点范围为130℃至180℃的溶剂存在下聚合，以便在低温范围内可固化 由于聚酰亚胺即使在低温下也可固化，因此当将聚酰亚胺树脂用作电子材料时，由于其它高温处理而导致的设备损坏能够最小化，另外， 可以将聚酰亚胺树脂广泛用作塑料基板等电子材料。