公开(公告)号：US20240336599A1

公开(公告)日：2024-10-10

申请号：US18611785

申请日：2024-03-21

申请人： PROMERUS, LLC

发明人： PRAMOD KANDANARACHCHI ,  LARRY F. RHODES

IPC分类号： C07D403/14 ,  C08G73/10 ,  C08K5/3442 ,  G03F7/004 ,  G03F7/038

CPC分类号： C07D403/14 ,  C08G73/105 ,  C08K5/3442 ,  G03F7/0045 ,  G03F7/0387

摘要： Embodiments in accordance with the present invention encompass a composition comprising a polyamic acid or an end capped polyamic acid and a diazirine, which are useful as photosensitive compositions for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

公开(公告)号：US20240254284A1

公开(公告)日：2024-08-01

申请号：US18609823

申请日：2024-03-19

申请人： PROMERUS, LLC

发明人： PRAMOD KANDANARACHCHI

IPC分类号： C08G73/10

CPC分类号： C08G73/1014 ,  C08G73/1025 ,  C08G73/1032 ,  C08G73/105 ,  C08G73/1078 ,  C08G73/1085

摘要： Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive unsaturated cyclic anhydride end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

公开(公告)号：US11725079B2

公开(公告)日：2023-08-15

申请号：US17377116

申请日：2021-07-15

申请人： The Boeing Company

发明人： Sayata Ghose ,  Marcus Anthony Belcher ,  John W. Connell

IPC分类号： C08G73/10 ,  C08K3/04 ,  C08K3/08 ,  C08K9/02 ,  C08K3/38 ,  B29C70/38

CPC分类号： C08G73/1007 ,  B29C70/384 ,  C08G73/105 ,  C08G73/1078 ,  C08K3/041 ,  C08K3/046 ,  C08K3/08 ,  C08K3/38 ,  C08K9/02 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0862 ,  C08K2003/385 ,  C08K2201/001

摘要： Compositions including a polyimide and one or more thermally conductive fillers, and compaction rollers for an automated fiber placement machine incorporating the compositions are provided. The polyimide may be a polymeric reaction product of a dianhydride and one or more diamines. The one or more diamines may include a fluorine-containing alkyl ether diamine. The one or more thermally conductive fillers may include one or more of a carbon-based filler, boron nitride, a metal, or combinations thereof. The compositions may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm−1 K−1).

公开(公告)号：US20190210768A1

公开(公告)日：2019-07-11

申请号：US16355797

申请日：2019-03-17

申请人： CORNING INCORPORATED

发明人： Kaveh Adib ,  Dana Craig Bookbinder ,  Theresa Chang ,  Paul Stephen Danielson ,  Steven Edward DeMartino ,  Melinda Ann Drake ,  Andrei Gennadyevich Fadeev ,  James Patrick Hamilton ,  Robert Michael Morena ,  Santona Pal ,  John Stephen Peanasky ,  Chandan Kumar Saha ,  Robert Anthony Schaut ,  Susan Lee Schiefelbein ,  Christopher Lee Timmons

IPC分类号： B65D23/08 ,  B65D1/40 ,  A61J1/14 ,  C03C3/087 ,  B65D25/14 ,  B32B17/06 ,  C03C17/34 ,  C03C17/00 ,  C03C17/32 ,  C03C17/30 ,  C08G73/10 ,  C09D179/08 ,  C03C21/00 ,  C03C17/42

CPC分类号： B65D23/0814 ,  A61J1/1468 ,  B32B17/06 ,  B65D1/40 ,  B65D25/14 ,  C03C3/087 ,  C03C17/005 ,  C03C17/30 ,  C03C17/32 ,  C03C17/3405 ,  C03C17/42 ,  C03C21/002 ,  C03C2217/78 ,  C03C2218/111 ,  C08G73/105 ,  C08G73/1071 ,  C09D179/08 ,  C08K5/544

摘要： Disclosed herein are delamination resistant glass pharmaceutical containers which may include a glass body having a Class HGA1 hydrolytic resistance when tested according to the ISO 720:1985 testing standard. The glass body may have an interior surface and an exterior surface. The interior surface of the glass body does not comprise a boron-rich layer when the glass body is in an as-formed condition. A heat-tolerant coating may be bonded to at least a portion of the exterior surface of the glass body. The heat-tolerant coating may have a coefficient of friction of less than about 0.7 and is thermally stable at a temperature of at least 250° C. for 30 minutes.

公开(公告)号：US20190066868A1

公开(公告)日：2019-02-28

申请号：US16058129

申请日：2018-08-08

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Shinichiro HIRAYAMA ,  Takashi YAMADA ,  Hikohito YAMAZAKI

IPC分类号： H01B3/30 ,  H01B7/02 ,  C09D177/10 ,  C09D179/08 ,  C09D5/00

CPC分类号： H01B3/306 ,  C08G73/105 ,  C08G73/1071 ,  C09D5/002 ,  C09D177/10 ,  C09D179/08 ,  H01B3/305 ,  H01B3/307 ,  H01B7/0216

摘要： An insulated wire has a conductor, and an insulating film including a first insulating layer covering the conductor and a second insulating layer covering the first insulating layer. The second insulating layer contains a polyimide or a polyamideimide as a main component. The first insulating layer contains a reaction product of a carboxylic acid dianhydride and a diamine as an adhesive component and a component that is the same as the main component in the second insulating layer. At least one of the carboxylic acid dianhydride and the diamine has a carbonyl group.

公开(公告)号：US20180223048A1

公开(公告)日：2018-08-09

申请号：US15686232

申请日：2017-08-25

申请人： Zhen Ding Technology Co., Ltd.

发明人： MAO-FENG HSU ,  SHOU-JUI HSIANG ,  SZU-HSIANG SU ,  YU-WEN KAO ,  CHIA-YIN TENG ,  MING-JAAN HO ,  YAO-YI CHENG ,  HSIN-MIN HSIAO

IPC分类号： C08G81/02 ,  C09D179/08 ,  C03C17/32 ,  H05K1/03 ,  H05K3/22 ,  H05K1/02

CPC分类号： C08G81/024 ,  C03C17/32 ,  C03C2218/32 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1071 ,  C09D179/08 ,  H05K1/024 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0393 ,  H05K3/22 ,  H05K2201/0158 ,  H05K2203/0759

摘要： A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.

公开(公告)号：US09988534B2

公开(公告)日：2018-06-05

申请号：US15243030

申请日：2016-08-22

申请人： FUJI XEROX CO., LTD.

发明人： Tsuyoshi Miyamoto ,  Tomoya Sasaki ,  Kana Miyazaki

IPC分类号： C08L79/08

CPC分类号： C08L79/08 ,  C08G73/1032 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09D179/08

摘要： A polyimide precursor composition includes a solvent mixture containing an alcohol solvent and a water-insoluble solvent that is at least one selected from the solvent group consisting of water-insoluble ketones and water-insoluble ethers; and a polyimide precursor dissolved in the solvent mixture.

公开(公告)号：US09926408B2

公开(公告)日：2018-03-27

申请号：US15024833

申请日：2014-09-24

申请人： PolyOne Corporation

发明人： Roger W. Avakian ,  Ling Hu

IPC分类号： C08G73/10 ,  B29C47/88 ,  C08K3/04 ,  C08K7/06 ,  C08L79/08 ,  C08J5/04 ,  C08J5/24 ,  B29C47/00 ,  C09D179/08

CPC分类号： C08G73/1067 ,  B29C47/0004 ,  C08G73/1014 ,  C08G73/1028 ,  C08G73/105 ,  C08G73/1071 ,  C08J5/042 ,  C08J5/24 ,  C08J2379/08 ,  C08K7/06 ,  C09D179/08 ,  C08L79/08

摘要： Reactive extrusion can be used in a continuous, solvent-less preparation of imide oligomers involving two competing reactions among three ingredients, the first reaction between a dianhydride and a diamine and the second reaction between an endcap and the same diamine. The imide oligomer can form a composite via conventional production methods or via formation of a film from imide oligomer re-melted in an extruder before being impregnated into tape or fabric.

公开(公告)号：US09896545B2

公开(公告)日：2018-02-20

申请号：US15584464

申请日：2017-05-02

申请人： The United States of America, as represented by the Secretary of the Air Force

发明人： Loon-Seng Tan ,  David Huabin Wang ,  Jeong Jae Wie ,  Timothy J. White

IPC分类号： C08G73/10 ,  C08G69/32 ,  C07C245/08

CPC分类号： C08G73/1007 ,  C07C245/08 ,  C07C323/48 ,  C08G69/32 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1085 ,  C08G73/1096 ,  C09B35/021 ,  C09B43/16 ,  C09B69/106

摘要： Bis(azo-benzene) diamine monomers and a method of synthesizing the monomers are provided. The bis(azo-benzene) diamine monomers, in combination with amine reactive monomers, form polymers, such as polyimides and copolyimides, having photomechanical and thermomechanical properties.

公开(公告)号：US20180009962A1

公开(公告)日：2018-01-11

申请号：US15504714

申请日：2015-08-19

申请人： Tokyo Ohka Kogyo Co., Ltd.

发明人： Mitsuharu TOBARI ,  Masanori ICHIKAWA ,  Kaoru ISHIKAWA ,  Tsukasa SUGAWARA

IPC分类号： C08J9/26 ,  C08J5/18 ,  C09D179/08

CPC分类号： C08J9/26 ,  B32B5/22 ,  C08G73/105 ,  C08G73/1071 ,  C08J5/18 ,  C08J2201/0442 ,  C08J2333/24 ,  C08J2379/08 ,  C09D179/08 ,  C08K3/36

摘要： Provided are a varnish for porous polyimide film production, providing an unburned composite film that is less likely to have a sea-island structure, and a method for producing a porous polyimide film using the same. The varnish according to the present invention comprises a resin including polyamide acid and/or polyimide, fine particles, and a solvent, and has a fine particle content of not less than 65% by volume relative to the total of the resin and the fine particles and a viscosity at 25° C. of not less than 550 mPa·s. Preferably, the varnish further comprises a dispersant. The method for producing a porous polyimide film according to the present invention comprises: forming an unburned composite film using the varnish; burning the unburned composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.