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公开(公告)号：US20210407959A1
公开(公告)日：2021-12-30
申请号：US16917492
申请日：2020-06-30
摘要： Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.
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公开(公告)号：US20210405291A1
公开(公告)日：2021-12-30
申请号：US16916781
申请日：2020-06-30
发明人： John Parker , Benjamin M. Curtin
IPC分类号： G02B6/122
摘要： Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.
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公开(公告)号：US20220099590A1
公开(公告)日：2022-03-31
申请号：US17038422
申请日：2020-09-30
发明人： Benjamin M. Curtin
摘要： Photonic errors in a photonic integrated circuit can be imaged using an on-chip light source integrated in a photonic layer of the circuit. The on-chip light source can generate light at wavelengths that propagates through one or more substrate layers to an image sensor sensitive to the wavelength range. The on-chip light source can be tunable and provide different power settings that can be utilized to detect different types of optical errors in the photonic integrated circuit.
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公开(公告)号：US20220065798A1
公开(公告)日：2022-03-03
申请号：US17006366
申请日：2020-08-28
摘要： Optical fabrication monitor structures can be included in a design fabricated on a wafer from a mask or fabrication reticle. A first set of components can be formed in an initial fabrication cycle, where the first set includes functional components and monitor structures. A second set of components can be formed by subsequent fabrication processes that can potentially cause errors or damage to the first set of components. The monitor structures can be implemented during fabrication (e.g., in a cleanroom) to detect fabrication errors without pulling or scrapping the wafer.
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