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公开(公告)号：US20220107542A1
公开(公告)日：2022-04-07
申请号：US17065118
申请日：2020-10-07
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jonathan Edgar Roth , Gregory Alan Fish
IPC: G02F1/225
Abstract: Photonic ring modulators with high tuning efficiency and small footprint can be formed in a hybrid material platform from a silicon bus waveguide vertically coupled to an optically active compound semiconductor (e.g., III-V) ring resonator. The performance of the modulator, e.g., in terms of the tuning efficiency and the maximum insertion loss, may be optimized by suitable levels of an applied bias voltage and a heater power of a heater optionally included in the ring modulator. The disclosed hybrid photonic ring modulators may be used, e.g., in photonic transceiver circuits with high lane count.
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公开(公告)号：US20220069916A1
公开(公告)日：2022-03-03
申请号：US17008516
申请日：2020-08-31
Applicant: Juniper Networks, Inc.
Inventor： John Parker
Abstract: High-channel-count optical transceivers can be implemented in photonic integrated circuits (PICs) with shared lasers, splitting the light of each laser between multiple lanes prior to modulation. To reduce waveguide crossings in such PICs, transmitter and self-test functionality may be distributed between separate device layers. Various beneficial transmitter circuitry layouts are disclosed.
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3.发明申请公开(公告)号：US20200233148A1
公开(公告)日：2020-07-23
申请号：US16844492
申请日：2020-04-09
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Gregory Alan Fish , Martin A. Spannagel , Antonio Labaro
IPC: G02B6/122 , H01L21/762 , H01L21/02 , H01L21/306 , G02B6/132 , G02B6/136
Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
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4.发明授权公开(公告)号：US11237325B2
公开(公告)日：2022-02-01
申请号：US16844492
申请日：2020-04-09
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Gregory Alan Fish , Martin A. Spannagel , Antonio Labaro
IPC: G02B6/12 , H01L21/12 , G02B6/122 , H01L21/762 , H01L21/02 , H01L21/306 , G02B6/132 , G02B6/136
Abstract: Methods and systems are presented for heterogeneous integration of photonics and electronics with atomic layer deposition (ALD) bonding. One method includes operations for forming a compound semiconductor and for depositing (e.g., via atomic layer deposition) a continuous film of a protection material (e.g., Al2O3) on a first surface of the compound semiconductor. Further, the method includes an operation for forming a silicon on insulator (SOI) wafer, with the SOI wafer comprising one or more waveguides. The method further includes bonding the compound semiconductor at the first surface to the SOI wafer to form a bonded structure and processing the bonded structure. The protection material protects the compound semiconductor from acid etchants during further processing of the bonded structure.
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公开(公告)号：US20220123840A1
公开(公告)日：2022-04-21
申请号：US17563417
申请日：2021-12-28
Applicant: Juniper Networks, Inc.
Inventor： John Parker
Abstract: High-channel-count optical transceivers can be implemented in photonic integrated circuits (PICs) with shared lasers, splitting the light of each laser between multiple lanes prior to modulation. To reduce waveguide crossings in such PICs, transmitter and self-test functionality may be distributed between separate device layers. Various beneficial transmitter circuitry layouts are disclosed.
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Patent Agency Ranking
公开(公告)号：US20220107229A1
公开(公告)日：2022-04-07
申请号：US17062885
申请日：2020-10-05
Applicant: Juniper Networks, Inc.
Inventor： Chris Barnard , John Parker
Abstract: Temperature measurements of photonic circuit components may be performed optically, exploiting a temperature-dependent spectral property of the photonic device to be monitored itself, or of a separate optical temperature sensor placed in its vicinity. By facilitating measurements of the temperature of the individual photonic devices rather than merely the photonic circuit at large, such optical temperature measurements can provide more accurate temperature information and help improve thermal design.
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公开(公告)号：US20210405291A1
公开(公告)日：2021-12-30
申请号：US16916781
申请日：2020-06-30
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Benjamin M. Curtin
IPC: G02B6/122
Abstract: Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.
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公开(公告)号：US20190199061A1
公开(公告)日：2019-06-27
申请号：US16286373
申请日：2019-02-26
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
CPC classification number: H01S5/0085 , G01J3/02 , G01J9/0246 , G02B6/12007 , G02B6/29353 , G02B6/29395 , G02B6/29398 , H01S5/0264 , H01S5/0607 , H01S5/0612 , H01S5/0617 , H01S5/06804 , H01S5/0687
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
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公开(公告)号：US10256607B2
公开(公告)日：2019-04-09
申请号：US16155113
申请日：2018-10-09
Applicant: Juniper Networks, Inc.
Inventor： John Parker , Jared Bauters , Jonathan Edgar Roth , Erik Norberg , Gregory Alan Fish
Abstract: Described are various configurations of integrated wavelength lockers including asymmetric Mach-Zehnder interferometers (AMZIs) and associated detectors. Various embodiments provide improved wavelength-locking accuracy by using an active tuning element in the AMZI to achieve an operational position with high locking sensitivity, a coherent receiver to reduce the frequency-dependence of the locking sensitivity, and/or a temperature sensor and/or strain gauge to computationally correct for the effect of temperature or strain changes.
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公开(公告)号：US20250070533A1
公开(公告)日：2025-02-27
申请号：US18946337
申请日：2024-11-13
Applicant: Juniper Networks, Inc.
Inventor： John Parker
Abstract: Disclosed are integrated electro-absorption modulators (EAM) that are structured and/or operated to improve uniformity of the photocurrent density along the active region. In various embodiments, this improvement results from increased optical absorption at the rear of the EAM, e.g., as achieved by heating a region at the rear, increasing a bias voltage applied across the EAM towards the rear, or changing a material composition of an intrinsic layer towards the rear. In another embodiment, the improvement is achieved by coupling light from a waveguide into the EAM active region continuously along a length of the EAM, using overlap between a tapered section of the waveguide and the EAM.
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