-
公开(公告)号:US12074583B2
公开(公告)日:2024-08-27
申请号:US17317408
申请日:2021-05-11
发明人: Matthew Alexander Meitl , Christopher Andrew Bower , Salvatore Bonafede , Carl Ray Prevatte, Jr. , Ronald S. Cok , Brook Raymond
CPC分类号: H03H9/0509 , B41F16/00 , H03H3/02 , H03H9/105
摘要: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.
-
公开(公告)号:US20240278551A1
公开(公告)日:2024-08-22
申请号:US18569091
申请日:2022-06-10
发明人: Denis PONCET , Nicolas PRADINES
IPC分类号: B41F16/00
CPC分类号: B41F16/0066 , B41P2219/31 , B41P2219/33
摘要: The invention relates to a die (10) for printing through a print carrier onto an object in a hot stamping machine, characterized in that the die comprises a first layer (11) of a first material, hereinafter referred to as the base layer, the hardness of which is less than 50 shore A measured according to ISO 868 or DIN 53505, and the thickness of which is greater than 20 mm, and a second layer (12) of a second material, hereinafter referred to as the printing layer, the hardness of which is greater than 50 shore A measured according to ISO 868 or DIN 53505, and the thickness of which is less than 5 mm, the second layer being intended to be in contact with the print carrier.
-
公开(公告)号:US20240241317A9
公开(公告)日:2024-07-18
申请号:US17911111
申请日:2021-03-16
发明人: Mohamad DERNAIKA , Frank PETERS , Guomin YU
CPC分类号: G02B6/132 , B41F16/0046 , G02B6/136 , G02B6/4207 , G02B6/43 , H01L21/561 , H01L24/97 , H01L2224/95001
摘要: A coupon wafer comprising a device coupon (110) for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate (124), and the device coupon (110) is attached to the wafer substrate via a tether (122) and the tether (122) is formed from a dielectric material.
-
4.
公开(公告)号:US20240239095A1
公开(公告)日:2024-07-18
申请号:US18096976
申请日:2023-01-13
申请人: Eric Solomon
发明人: Eric Solomon
CPC分类号: B41F16/0046 , B41F1/38 , B41F16/02
摘要: A heat press includes a screen printing head and a stamp unit. The stamp unit includes a frame, carriages, a support, and a platen or ironer. The horizontal position of the platen relative to the horizontal position of the screen printing head can be adjusted by unlocking carriages from the guide rails and sliding the carriages while the frame remains attached to the screen printing head. Also, the platen is coupled to the support so that a horizontal position of the platen relative to the support is fixed, and a vertical position of the platen relative to the support is floating. The heat press is suitable for applying a print on a substrate, such as a stack of fabric layers of different sizes.
-
公开(公告)号:US11932040B2
公开(公告)日:2024-03-19
申请号:US17809499
申请日:2022-06-28
申请人: Cricut, Inc.
发明人: John Dalton , Cole Chamberlain , Ashish Arora
CPC分类号: B41M5/0358 , B41F16/0086 , F24H9/18 , H05B1/00 , H05B1/0227
摘要: A sublimation device includes a first heater and a second heater. The first heater includes a proximal end, a distal end, and an inner surface. The distal end is disposed opposite the proximal end. The inner surface extends between the proximal end and the distal end and at least partially forms a cavity. The second heater is disposed proximate the distal end of the first heater.
-
公开(公告)号:US20240066905A1
公开(公告)日:2024-02-29
申请号:US18387643
申请日:2023-11-07
发明人: Tanya Yvette Moore , David Gomez , Christopher Andrew Bower , Matthew Alexander Meitl , Salvatore Bonafede
CPC分类号: B41K3/04 , B41F16/00 , G03F7/0002
摘要: A micro-transfer structure comprises a stamp comprising a rigid support, only a single contiguous bulk layer disposed on the rigid support, and posts disposed on the bulk layer. Components are adhered to (e.g., disposed in contact with) some but not all of the posts. The posts can be substantially identical and disposed in a regular array on the bulk layer. Each component is adhered to (e.g., in contact with) two or more posts. Components can be disposed on a source wafer entirely over sacrificial portions of a sacrificial layer on or in the source wafer and attached to anchors disposed between sacrificial portions with a tether.
-
公开(公告)号:US11904595B2
公开(公告)日:2024-02-20
申请号:US17597419
申请日:2020-06-30
发明人: Florent Demange
CPC分类号: B41F16/0046 , B30B1/14 , B41P2219/132
摘要: Printing machine of the blocking press type, comprising a heating block which comprises a curved carrier medium surface of a printing plate, an application head comprising means of guidance of the heating block in a tilting motion, and an actuator for tilting of the heating block relative to the application head.
-
公开(公告)号:US11885067B2
公开(公告)日:2024-01-30
申请号:US17330471
申请日:2021-05-26
发明人: Mei-Ling Yeh
CPC分类号: D06P5/003 , B41F16/006 , B41F16/008 , B41F16/0026
摘要: A warp transferring machine includes a color transferring unit, a colored paper unit and a yarn arranging unit. The color transferring unit includes a heating roller, a driving shaft, a separable shaft, a supporting shaft that are rotatable about their respective axes and a pressing belt that is looped therearound to circulate continuously. The colored paper unit and the yarn arranging unit respectively guide a colored paper and a yarn toward the heating roller such that the pressing belt presses thereagainst so as to transfer colors of the colored paper onto the yarn.
-
公开(公告)号:US11865859B2
公开(公告)日:2024-01-09
申请号:US17386689
申请日:2021-07-28
发明人: Kentaro Mori , Ryosuke Sakai
CPC分类号: B44C1/17
摘要: A layer transfer device includes: a cover; a heat roller; a controller; temperature sensors including first and second sensors; and a locking member movable between a locking position to lock the cover to a closed position and an unlocking position to permit movement of the cover from the closed position to an open position. The first sensor measures temperature of a first member heated by a multilayer film or a sheet having been heated by the heat roller. The second sensor measures temperature of a second member heated by the heat roller. The controller determines evaluated temperatures based on temperatures measured by the temperature sensors, places the locking member in the locking position when at least one of the evaluated temperatures is not lower than a first threshold value, and places the locking member in the unlocking position when the evaluated temperatures are all lower than the first threshold value.
-
公开(公告)号:US20230415507A1
公开(公告)日:2023-12-28
申请号:US18463539
申请日:2023-09-08
发明人: Tomoya YAMAMOTO , Takashi SUZUKI
CPC分类号: B44C1/17 , B41F16/00 , G03G15/2032 , G03G15/2064 , B32B37/0053 , B32B38/004 , B32B2037/0061
摘要: A layer transfer device includes a supply reel, a take-up reel, a driving source, a releasable restraining device, a heating roller, a pressure roller, and a controller. The driving source drives the take-up reel. The releasable restraining device is capable of switching to a restraining state in which a multilayer film is put under restraint in being drawn out from the supply reel and to a release state in which the restraint is lifted. The controller is configured such that when the driving source is generating the mechanical power, the releasable restraining device is in the restraining state if an image area in which an image is formed on the sheet is not present in a layer transfer position between the heating roller and the pressure roller, and the releasable restraining device is in the release state if the image area is present in the layer transfer position.
-
-
-
-
-
-
-
-
-