Method of manufacturing TAB tapes and laminated body for producing the
same
    1.
    发明授权
    Method of manufacturing TAB tapes and laminated body for producing the same 失效
    制造TAB带及其制造方法

    公开(公告)号:US5919538A

    公开(公告)日:1999-07-06

    申请号:US164299

    申请日:1998-10-01

    摘要: A method of manufacturing TAB tapes comprising the steps of (1) to (5):(1) laminating a protection film-covered adhesive layer on the entire surface of at least one face of a base film except both the edge portions thereof thereby to obtain a laminated portion, the base film being enough wide to provide a base film for each of the intended plural TAB tapes each having a desired width;(2) drilling sprocket holes in the thus obtained laminated portion comprising the base film and the protection film-covered adhesive layer and in both the edge portions of said base film and drilling device holes in said laminated portion;(3) peeling said protection film off the adhesive layer, and adhering a copper foil to said adhesive layer;(4) applying a photoresist to said copper foil, exposing and developing the photoresist-applied copper foil and then etching the photoresist-developed copper foil to form wiring patterns thereby to obtain a wide TAB tape in which plural strips of TAB tape having the disired width are originally connected to each other in parallel; and then(5) slitting said wide TAB tape in the longitudinal direction thereof to obtain plural separate strips of TAB tape having the desired width.

    摘要翻译: 一种制造TAB带的方法,包括以下步骤:(1)至(5):(1)将保护膜覆盖的粘合剂层层压在除了两个边缘部分之外的基膜的至少一个面的整个表面上,从而至 获得层压部分,所述基膜足够宽以为每个具有期望宽度的预期多个TAB带提供基膜; (2)在如此获得的层压部分中钻出链轮孔,包括基膜和保护膜覆盖的粘合剂层,并且在所述基膜的两个边缘部分和所述层压部分中的钻孔装置孔中; (3)从粘合剂层剥离保护膜,并将铜箔粘合到所述粘合剂层上; (4)向所述铜箔施加光致抗蚀剂,曝光和显影所述光刻胶施加的铜箔,然后蚀刻所述光致抗蚀剂显影的铜箔以形成布线图案,从而获得宽的TAB带,其中, 宽度最初相互并联; 然后(5)在其纵向上切割所述宽TAB带,以获得具有期望宽度的多个单独的TAB带条。